TSic™- 206
Precise, Rapid Response, Low-Cost Temperature Sensor IC
Feature Sheet
Features
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Low cost, precision temperature sensor
Single-wire 11-bit digital serial signal output
compatible with state-of-the-art µP controllers
Communication range > 10 meters
Resolution: 0.1ºC
Accuracy: ±0.5ºC over a span of 80ºC
Wide measurement range: –50 to +150 ºC
Signal read-out every 0.1s (other rates available
on request)
V+ supply voltage: 2.97 to 5.5V (industry
standard); 3.3V or 5V (±10%) power supplies
Package: 8-pin SOIC
Low quiescent current: <80µA at 25°C with 3.3V –
minimizes self-heating errors for applications such
as wall-mounted thermostats
System-on-a-chip based on advanced mixed-
signal technology integrating precision tempera-
ture sensing bandgap reference with PTAT out-
put; digital signal processor (DSP) core, and
electrically erasable memory (EEPROM)
Brief Description
The TSic™ temperature sensor IC family are fully test-
ed and calibrated sensors with absolute measurement
accuracy on delivery – no further calibration needed.
The TSic™ combines outstanding accuracy with long
term stability, yet it is very simple to use.
The TSic™ series is specifically designed for high per-
formance, cost-effective solutions for sensing temper-
ature in building automation, automotive, industrial,
office automation, white goods and low-power/mobile
applications.
TSic™ employs a high precision bandgap reference
with proportional-to-absolute-temperature (PTAT) out-
put; a low-power, precision ADC; and an on-chip DSP
core with EEPROM to precisely calibrate the output
temperature signal. The TSic™ series includes ICs
with two linear analog signal output options, such as
standard 0~1Vout (V+ = 2.97V to 5.5V) or ratiometric
(10~90% of V+; i.e., 0.5~4.5Vout @ V+ = 5V) or the
digital serial output signal for interfacing with
µP
controllers.
Benefits
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Several accuracy classes available with 100%
upward compatibility
No calibration by customer needed; absolute
calibration specified
Simple to integrate, reducing cost and time for
application-development
Fast data measurement – optimal for temper-
ature control
Packages for standard SMD, THT or applica-
tion specific assembly
Miniaturized solutions with Bare-Chip (for
COB, COF, CSP*) or e-line packages – very
fast response time for COF
Very low power consumption – ideal for
mobile and standard applications
Field reconfiguration/recalibration option
available (high volume customers only)
Outstanding long term stability
Package Information
TSic 206 SOP8: 150mil, Standard SMT Package,
SOIC, Based on IEC 191-2Q, Type 076E35 B.
TM
Other packages available on demand: TSic 206
TM
e-line; 3 pin THT package; TSic 206 bare die or
wafer level.
TM
Pin
1
2
4
Name
V+
Signal
Gnd
Description
Supply voltage
(3.0-5.5V)
Temperature
output signal
Ground
Test pin / NC
Do not connect
3, TP/NC
5-8
* COB: Chip-On-Board; COF: Chip-On-Flex; CSP: Chip Scale Packaging
TSic
TM
206 Feature Sheet, Rev. 3.3, July 18, 2005
Page 1 of 2
© ZMD AG & IST AG, 2005
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written
consent of the copyright owner.
ZMD [ Zentrum Mikroelektronik Dresden AG ]
