GF02-20
HIGH VOLTAGE SINTERED GLASS PASSIVATED JUNCTION RECTIFIER
Reverse Voltage - 2000 Volts
Forward Current - 1.0 Ampere
NTED
TE
NTED
SMA/DO-214AC
PA
TE
PA
FEATURES
* GPRC (Glass Passivated Rectifier Chip) inside
0.114(2.90)
0.098(2.50)
0.181(4.60)
0.157(4.00)
0.012(0.305)
0.006(0.152)
0.096(2.44)
0.079(2.00)
0.059(1.52)
0.030(0.76)
Max.
0.203
0.208(5.28)
0.189(4.80)
0.063(1.60)
0.047(1.20)
* Glass passivated cavity-free junction
* High temperature soldering guaranteed: 260 C/10 seconds,
at terminals
* Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
o
MECHANICAL DATA
Case :
JEDEC DO-214AC molded plastic over glass body
Terminals :
Tin Plated, solderable per MIL-STD-750,
Method 2026
Polarity :
Color band denotes cathode end
Weight :
0.002 ounes , 0.064 gram
*Dimensions in inches and (millimeters)
TM
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature
unless otherwise specified.
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current (SEE FIG.1)
o
SYMBOLS
V
RRM
V
RMS
V
DC
I
(AV)
GF02-20
2000
1400
2000
1.0
UNITS
Volts
Volts
Volts
Amps
Peak forward surge current 8.3ms single half sine-wave
I
FSM
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1.0 A
Maximum DC reverse current
at rated DC blocking voltage
Typical junction capacitance (NOTE 1)
Typical thermal resistance (NOTE 2)
Operating junction and storage temperature range
T
A
=25 C
o
T
A
=125 C
o
30
Amps
V
F
2.00
5
50
12
75
27
-65 to +175
Volts
I
R
C
J
R
R
JA
JL
uA
pF
o
C/W
o
T
J
,T
STG
C
NOTES : (1) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(2) Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas
REV. 0
Zowie Technology Corporation
ZOWIE [ ZOWIE TECHNOLOGY CORPORATION ]
