MBCR10D THRU MBCR10M
MINIATURE SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
Reverse Voltage - 200 to 1000 Volts
Forward Current - 1.0 Ampere
ENTED
PAT
0.213(5.40)
0.205(5.20)
0.132(3.35)
0.128(3.25)
0.047(1.20)
MBCR
Mounting Pad Layout
0.165(4.20)
0.157(4.00)
FEATURES
* Internal Constructure with GPRC (Glass Passivated Rectifier Chip)
inside
* Lead free product
* Leadless chip form , no lead damage
* Solder Joint , No Wire bond & Lead Frame
* Low profile package
* For surface mounted applications
* Built-in strain relief
* Low power loss , High efficiency
* High current capability
* High surge capacity
* Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
0.039(1.00)
0.232(5.90)
0.224(5.70)
0.229(5.82)
0.040(1.0)
0.031(0.8)
0.063(1.60)
~
R0
.2
0.037(0.95)
0.033(0.85)
~
0.051(1.30)
0.043(1.10)
0.055(1.40)
0.221(5.62)
MECHANICAL DATA
*Dimensions in inches and (millimeters)
Case :
Packed with FRP substrate and epoxy underfilled
Terminals :
Tin plated , solderable per MIL-STD-750,
Method 2026
Polarity :
Laser marking
Weight :
0.07 gram
SuperBridge with GPRC inside
TM
TM
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature
unless otherwise specified.
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current @ T
A
=55 C
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
@ I
F
=0.4 A
Maximum instantaneous forward voltage
@ I
F
=1.0 A
@T
C
=25 C
@T
C
=150 C
o
o
o
o
SYMBOLS
V
RRM
V
RMS
V
DC
I
(AV)
MBCR10D
200
140
200
MBCR10G
400
280
400
MBCR10J
600
420
600
MBCR10K
800
560
800
MBCR10M
1000
700
1000
UNITS
Volts
Volts
Volts
Amps
1.0
I
FSM
30
Amps
V
F
0.9
1.0
5
Volts
Maximum DC reverse current
at rated DC blocking voltage
I
2
t rating for fusing ( t < 8.3ms )
I
R
I
2
t
C
J
R
JA
200
3.74
25
110
-55 to +175
o
uA
2
A s
pF
C/W
o
Typical junction capacitance per element (NOTE 1)
Typical thermal resistance, junction to ambient (NOTE 2)
Operating junction and storage temperature range
T
J
,T
STG
C
NOTES : (1) Measured at 1.0 MHz and applied reverse voltage of 4.0 V DC.
(2) Thermal resistance, junction to ambient, measured on PC board with 5.0mm
2
(0.03mm thick) land areas.
05/2004
Zowie Technology Corporation
ZOWIE [ ZOWIE TECHNOLOGY CORPORATION ]
