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9960-1100-24 参数 Datasheet PDF下载

9960-1100-24图片预览
型号: 9960-1100-24
PDF下载: 下载PDF文件 查看货源
内容描述: SSMT新一代表面贴装\n [SSMT Next Generation Surface Mount ]
分类和应用: 连接器
文件页数/大小: 12 页 / 385 K
品牌: ETC [ ETC ]
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1307043
SSMT™ Interconnect System
Microminiature Surface Mount RF Connectors
3.0 mm mated height
Excellent interface retention
Flexible micro-coax cable
360 degree mated rotation
Tape and Reel packaging
M/A-COM’s next generation SSMT™ surface mount
Interconnect System is designed to provide superior electrical
and mechanical performance for wireless communication
applications. The SSMT™ occupies less printed circuit board
(PCB) real estate than conventional through hole coaxial con-
nectors. An innovative microstrip mounting pattern and plug
receptacle design ensure reliable grounding and PCB reten-
tion characteristics. The SSMT™ Interconnect System allows
closer pitch/spacing, standing a mere 3.0 mm (fully mated
height) off the board. The mated SSMT™ interface allows 360
degrees of rotation providing maximum PCB design flexibility.
The SSMT™ interface has been designed to provide optimal
retention for applications where shock, vibration or cable flex-
ure may be encountered. Force to disengage by cable load
(cam-out) exceeds 300 grams.
These next generation enhancements and features have been
built into the SSMT™ design to provide the performance of
much larger industry standard connectors. The SSMT™
Interconnect System consistently achieves broad band electri-
cal performance through 6 GHz with a maximum VSWR of
1.20:1 at 2 GHz. This broad band performance establishes a
reliable interface that can be utilized for future system
upgrades without concern for performance degradation.
The SSMT™ utilizes a common OSMT plug receptacle, part
number 2367-0000-54, which is designed for high volume
assembly using surface mount technology and is available in
tape and reel packaging for automatic pick and place board
assembly. The mating cable jack is available terminated to a
highly flexible micro-coax cable as either a pigtail, jumper or
standard interseries connector assembly to meet your needs.
The SSMT™ Interconnect System can be manually mated,
facilitating high volume assembly and eliminating the need for
special engagement tooling. The SSMT™ interface design
aligns the center contacts prior to full mating to ensure a
robust mechanical engagement. Interface durability is rated at
100 mating cycles.
4.5
REF
.177
4.0
REF
.157
360° ROTATION
MATED
HEIGHT
3.0
REF
.120
MINIMUM CLEARANCE
FOR DISENGAGEMENT
6.6
REF
.258
5.3
REF
.208
SSMT™JACK
1.3 DIA REF
.052 (CABLE)
4.4
REF
.172
SMT PLUG
Note: Unless otherwise specified, all dimensions are mm/in
M/A-COM’s SSMT™ Interconnect System is ideal for wireless
surface mount applications in cellular basestations, handsets,
personal communications systems (PCS), global positioning
systems (GPS), wireless local loops (WLL), wireless LAN
(WLAN) and paging. The SSMT™ provides versatile, high
quality RF solutions for next generation interconnect needs.
M/A-COM is an ISO 9001 certified manufacturer and main-
tains a SPC controlled manufacturing environment. Call your
local Sales or authorized Distribution office for additional
information or qualification samples.
V4.00
M/A-COM Division of AMP Incorporated
s
North America: Tel. (800) 366-2266, Fax (800) 618-8883
s
Asia/Pacific: Tel. +85 2 2111 8088, Fax +85 2 2111 8087
s
Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.