CD4013BMS
Typical Performance Characteristics
AMBIENT TEMPERATURE (T
A
) = +25 C
tr, tf = 5ns
CL = 50pF
30
25
20
15
10
5
o
(Continued)
10
4
DISSIPATION PER DEVICE (PD) (µW)
8
6
4
2
CLOCK FREQUENCY (fCL) (MHz)
10
3
SUPPLY VOLTAGE
(VDD) = 15V
10V
10V
5V
CL = 50pF
CL = 15pF
AMBIENT TEMPERATURE (T
A
) = +25
o
C
INPUT tr = tf = 20ns
8
6
4
2
10
2
8
6
4
2
10
8
6
4
2
0
5
10
15
SUPPLY VOLTAGE (VDD) (V)
20
1
10
2
2
4 6 8
10
3
2
10
4
10
5
10
6
INPUT FREQUENCY (ft) (HZ)
4 68
2
4 68
2
4 68
2
4 68
FIGURE 8. TYPICAL MAXIMUM CLOCK FREQUENCY vs
SUPPLY VOLTAGE
FIGURE 9. TYPICAL POWER DISSIPATION vs FREQUENCY
Chip Dimensions and Pad Layout
Dimension in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10
-3
inch).
METALLIZATION:
Thickness: 11k
Å
−
14k
Å,
PASSIVATION:
BOND PADS:
10.4kÅ - 15.6k
Å
, Silane
AL.
0.004 inches X 0.004 inches MIN
0.0198 inches - 0.0218 inches
DIE THICKNESS:
7-69
ETC [ ETC ]
