原英文文档摘要：1:NXP SemiconductorsUBA2080/1Half-bridge driver IC14. Legal information14. 1 Data sheet statusDocument status[1][2]Objective [short] data sheetPreliminary [short] data sheetProduct [short] data sheet[1][2][3]Product status[3]DevelopmentQualificationProductionDefinitionThis document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product statusinformation is available on the Internet at URLhttp://www. nxp. com. 14. 2 DefinitionsDraft —The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. NXP Semiconductors does not give anyrepresentations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequences ofuse of such information. Short data sheet —A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet is intendedfor quick reference only and should not be relied upon to contain detailed andfull information. For detailed and full information see the relevant full datasheet, which is available on request via the local NXP Semiconductors salesoffice. In case of any inconsistency or conflict with the short data sheet, thefull data sheet shall prevail. Product specification —The information and data provided in a Productdata sheet shall define the specification of the product as agreed betweenNXP Semiconductors and its customer, unless NXP Semiconductors andcustomer have explicitly agreed otherwise in writing. In no event however,shall an agreement be valid in which the NXP Semiconductors product isdeemed to offer functions and qualities beyond those described in theProduct data sheet. malfunction of an NXP Semiconductors product can reasonably be expectedto result in personal injury, death or severe property or environmentaldamage. NXP Semiconductors accepts no liability for inclusion and/or use ofNXP Semiconductors products in such equipment or applications andtherefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makes norepresentation or warranty that such applications will be suitable for thespecified use without further testing or modification. Customers are responsible for the design and operation of their applicationsand products using NXP Semiconductors products, and NXP Semiconductorsaccepts no liability for any assistance with applications or customer productdesign. It is customer’s sole responsibility to determine whether the NXPSemiconductors product is suitable and fit for the customer’s applications andproducts planned, as well as for the planned application and use ofcustomer’s third party customer(s). Customers should provide appropriatedesign and operating safeguards to minimize the risks associated with theirapplications and products. NXP Semiconductors does not accept any liability related to any default,damage, costs or problem which is based on any weakness or default in thecustomer’s applications or products, or the application or use by customer’sthird party customer(s). Customer is responsible for doing all necessarytesting for the customer’s applications and products using NXPSemiconductors products in order to avoid a default of the applications andthe products or of the application or use by customer’s third partycustomer(s). NXP does not accept any liability in this respect. Limiting values —Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above those given inthe Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device. Terms and conditions of commercial sale —NXP Semiconductorsproducts are sold subject to the general terms and conditions of commercialsale, as published athttp://www. nxp. com/profile/terms,unless otherwiseagreed in a valid written individual agreement. In case an individualagreement is concluded only the terms and conditions of the respectiveagreement shall apply. NXP Semiconductors hereby expressly objects toapplying the customer’s general terms and conditions with regard to thepurchase of NXP Semiconductors products by customer. No offer to sell or license —Nothing in this document may be interpreted orconstrued as an offer to sell products that is open for acceptance or the grant,conveyance or implication of any license under any copyrights, patents orother industrial or intellectual property rights. Export control —This document as well as the item(s) described hereinmay be subject to export control regulations. Export might require a priorauthorization from competent authorities. © NXP B. V. 2011. All rights reserved. 14. 3 DisclaimersLimited warranty and liability —Information in this document is believed tobe accurate and reliable. However, NXP Semiconductors does not give anyrepresentations or warranties, expressed or implied, as to the accuracy orcompleteness of such information and shall have no liability for theconsequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation - lostprofits, lost savings, business interruption, costs related to the removal orreplacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory. Notwithstanding any damages that customer might incur for any reasonwhatsoever, NXP Semiconductors’ aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith theTerms and conditions of commercial saleof NXP Semiconductors. Right to make changes —NXP Semiconductors reserves the right to makechanges to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof. Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure orUBA2080_UBA2081All information provided in this document is subject to legal disclaimers. Objective data sheetRev. 1. 1 — 6 December 201113 of 15

中文文档摘要：1:恩智浦半导体UBA2080/1半桥驱动器IC14. 法律信息14. 1数据表状态文档状态[1][2]目标[短]数据表初步[短]数据表产品[短]数据表[1][2][3]产品状态[3]发展QUALI科幻阳离子生产德网络nition本文件包含从客观规范的产品开发数据。 本文件包含的初步规格数据。 本文件包含的产品规格。 启动或完成设计之前，请咨询最新发布的文档。 术语“短数据表”中的一节“德网络nitions ”的解释。 本文档中描述的设备（S ）的产品的状态可能已经改变，因为这个文件公布，并可能在不同的情况下，多台设备。 最新产品情况信息可在互联网上的网址http://www. nxp. com 。 14. 2德网络nitions草案 -该文件只是一个草稿。 内容仍在内部审查，并经正式批准，这可能会导致修改或补充。 恩智浦半导体公司不给任何陈述或保证的准确性或完整性此处包含的信息，并有权对造成的后果不承担任何责任使用这些信息。 短期数据表 -短数据表是从一个完整的数据资料的摘录与同产品类型号码和标题。 短数据表意为快速参考之用，不应依靠包含详细，全部信息。 有关详细和完整的信息，请参阅相关的全部数据表，它可以在通过本地恩智浦半导体的销售要求办公。 如有任何不一致或冲突，短数据表中，完整的数据资料为准。 产品speci fi cation -在一个产品中提供的信息和数据双方同意数据表应确定该产品的规格恩智浦半导体公司和它的客户，除非NXP半导体以及在写作客户已经明确约定，否则。 在任何情况下，然而，应的协议是有效的，其中恩智浦半导体产品当作提供功能和质量超出那些在所描述的产品数据表。 恩智浦半导体产品的故障可合理预期导致人身伤害，死亡或严重财产或环境损害。 恩智浦半导体公司接受了包容和/或使用不承担任何责任恩智浦半导体的产品在此类设备或应用程序和因此，这样的包容性和/或用法是在客户自己的风险。 应用程序 -在此描述的任何的这些应用产品仅用于说明目的。 恩智浦半导体是没有陈述或保证，这些应用将是适当的没有进一步的测试或修改指定用途。 客户有责任为他们的应用程序的设计和运行并采用恩智浦半导体的产品，恩智浦半导体产品接受与应用程序或客户产品的任何援助不承担任何责任设计。 这是客户自己的责任，以确定是否NXP半导体产品是合适的，适合客户的应用和产品计划，以及为所计划的应用程序和使用客户的第三方客户（ S） 。 客户应提供适当的设计和运行保障措施，以尽量减少相关风险的应用和产品。 恩智浦半导体公司不接受相关的任何违约承担任何责任，破坏，这是基于在任何弱点或违约成本或问题客户的应用或产品，或者应用或使用由客户第三方客户（ S） 。 客户有责任尽一切必要的测试客户的应用和产品使用恩智浦半导体产品，以避免在应用程序的默认和通过客户的第三方提供产品的应用或使用，或客户（ S） 。 恩智浦不接受这方面的任何责任。 极限值 -应力以上的一个或多个限流值（定义在IEC 60134的绝对最大额定值系统）将会引起永久性的损坏设备。 极限值只是应力额定值和（适当的）该设备在这些或以上的任何给定其他条件的操作推荐工作条件部分（如果有的话）或本文档的特性部分是不值得的。 常数或反复接触限制值将永久和不可逆的影响器件的质量和可靠性。 条款和商业销售条件 -恩智浦半导体产品的销售都遵循的一般条款和商业条件销售方面，截至公布http://www. nxp. com/pro科幻LE /而言，除非另有同意在有效的书面个别协议。 的情况下的个体协议签订相应的唯一的条款和条件协议应适用。 恩智浦半导体在此明确反对将客户的一般条款和条件方面的根据客户购买恩智浦半导体的产品。 没有任何出售要约或许可 -本文档中的任何内容都不得被解释或视为出售要约是开放接受或授予，在任何著作权，专利运输工具或任何许可或其它工业或知识产权。 出口管制 -本文档以及在此描述的一条（或多条）可能会受到出口管制条例。 出口可能需要先授权由主管机关。 © NXP B. V. 2011保留所有权利。 14. 3免责声明有限保修和责任 -本文档中的信息被认为是是准确和可靠。 然而，恩智浦半导体不给任何陈述或保证，明示或暗示，作为的准确性或完整性这样的信息，并有权对任何法律责任使用这些信息的后果。 在任何情况下对任何间接恩智浦半导体公司承担赔偿责任，附带的，惩罚性的，特殊的或后果性损害（包括 - 但不限于 - 失落利润，储蓄损失，业务中断，成本有关撤销或更换任何产品或返工费）不论这种损害赔偿是基于侵权（包括过失） ，担保，违约合同或任何其他法律理论。 尽管任何损害客户可能遭受的任何原因无论如何，恩智浦半导体对聚集和累积责任顾客对于本文中所描述的产品，应当按照被限制与条款和商业销售条件恩智浦半导体。 有权进行修改 -恩智浦半导体公司保留作出正确的变化信息文件中公布的，包括但不限规格和产品说明，在任何时候，不通知。 本文件取代之前提供的所有信息于此次公布。 适宜使用 -恩智浦半导体产品并非设计，授权或担保适合用于生命支持，临界或使用安全关键系统或设备，也没有在应用中出现故障或UBA2080_UBA2081本文档中提供的所有信息受法律免责声明。 目标数据表修订版1. 1 - 2011年12月6日13 15

原英文文档摘要：2:NXP SemiconductorsUBA2080/1Half-bridge driver IC10. CharacteristicsTable 8. CharacteristicsTj= 25C; all voltages are measured with respect to SGND; VDD= 12. 8 V; positive currents flow into the IC. SymbolIleakStart-up stateIVDDVDD(start)VDD(stop)VDD(hys)Pin LIN inputVIHVhys(LIN)II(LIN)Pin HIN inputVIHVhys(HIN)II(HIN)Pin CLK inputVIHVILII(CLK)Pin SD inputVIHVhys(SD)tnogate driversIO(source)IO(sink)Vd(bs)VUVLOIFSTimingtdtontofffmaxdelay timeturn-on timeturn-off timemaximum frequencyUBA2080UBA2080UBA2080---80050240180-----nsnsnskHzoutput source currentoutput sink currentbootstrap diode voltageundervoltage lockout voltagecurrent on pin FSVFS= VVDD= 12 V; VSH= 0 V;VGH= VGL= 8 VVFS= VVDD= 12 V; VSH= 0 V;VGH= VGL= 4 VId(bs)= 20 mAresetVFS= VVDD= 12 V; VSH= 0 V---3. 6272004002. 34. 232---4. 837mAmAVVAHIGH-level input voltagehysteresis voltage on pin SDnon-overlap timeRSD= 100 k; typical minimumRSD= 3 M; typical maximumto activate shutdown1. 6---2. 24001402. 42. 8---VmVnssHIGH-level input voltageLOW-level input voltageinput current on pin CLK2. 7----0-0. 81VVAHIGH-level input voltagehysteresis voltage on pin HINinput current on pin HIN1. 6--2. 240002. 8-1VmVAHIGH-level input voltagehysteresis voltage on pin LINinput current on pin LIN1. 6--2. 240002. 8-1VmVAcurrent on pin VDDstart supply voltagestop supply voltagehysteresis of supply voltagestart to stop4201183520128. 53. 56201394AVVVParameterleakage currentConditionsFS = GH = SH = 600 VMin-Typ-Max10UnitAHigh-voltage supplyUBA2080_UBA2081All information provided in this document is subject to legal disclaimers. © NXP B. V. 2011. All rights reserved. Objective data sheetRev. 1. 1 — 6 December 20117 of 15

中文文档摘要：2:恩智浦半导体UBA2080/1半桥驱动器IC10. 特点表8 。 特征Tj= 25℃;所有电压都相对于SGND ; VDD= 12. 8 V ;正电流流入所述集成电路。 符号I泄漏启动状态IVDDVDD （开始）VDD （ STOP ）VDD （ HYS ）LIN引脚输入VIHVHYS （ LIN ）I我（ LIN ）脚HIN输入VIHVHYS （ HIN ）I我（ HIN ）引脚CLK输入VIHVILI我（CLK）SD引脚输入VIHVHYS （ SD ）tno栅极驱动器IO（ SOURCE ）IO（汇）VD（ BS）VUVLOIFS定时tdtont关闭f最大延迟时间开启时间打开-O FF时间最大频率UBA2080UBA2080UBA2080---80050240180-----nsnsns千赫输出源电流输出灌电流自举二极管电压欠压锁定电压目前在销的FSVFS= VVDD= 12 V; VSH= 0 V;VGH= VGL= 8 VVFS= VVDD= 12 V; VSH= 0 V;VGH= VGL= 4 VID（ BS）= 20毫安RESETVFS= VVDD= 12 V; VSH= 0 V---3. 6272004002. 34. 232---4. 837mAmAVVA高电平输入电压对SD引脚的电压滞后非重叠时间RSD= 100 k ;典型的最小值RSD= 3 M ;典型的最大激活关闭1. 6---2. 24001402. 42. 8---VmVnss高电平输入电压低电平输入电压在CLK引脚的输入电流2. 7----0-0. 81VVA高电平输入电压引脚HIN滞后电压引脚HIN输入电流1. 6--2. 240002. 8-1VmVA高电平输入电压在LIN引脚的电压滞后在LIN引脚的输入电流1. 6--2. 240002. 8-1VmVA当前的上的引脚VDD启动电压停止供电电压电源电压的滞后开始停止4201183520128. 53. 56201394AVVV参数漏电流条件FS = GH = SH = 600 V民-典型值-最大10单位A高压电源UBA2080_UBA2081本文档中提供的所有信息受法律免责声明。 © NXP B. V. 2011保留所有权利。 目标数据表修订版1. 1 - 2011年12月6日7 15

原英文文档摘要：3:NXP SemiconductorsUBA2080/1Half-bridge driver IC8. Limiting valuesTable 6. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134). SymbolVDDVFSVSHVi(HIN)Vi(LIN)VCLKVi(SD)SRTjTambTstgVESDParametersupply voltagevoltage on pin FSvoltage on pin SHinput voltage on pin HINinput voltage on pin LINvoltage on pin CLKinput voltage on pin SDslew ratejunction temperatureambient temperaturestorage temperatureelectrostatic dischargevoltagehuman body model:pins FS, GH and SHpins VDD, HIN, LIN, SD, CLKmachine model:all pins[1][2][2][1]Conditionsnominalsource high-side MOSFETt < 1slogic input for high-side driverlogic input for low-side driverlogic input for output driverslogic input for output drivers andanalog input for non-overlap settingon pin SH; repetitiveMin0VSH-3-14006404055---Max14VSH+ 1460060014141414+6+150+150+15012250UnitVVVVVVVVV/nsCCCkVkVVIn accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1. 5 k series resistor. In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1. 5 k series resistor and a0. 75Hinductor. 9. Thermal characteristicsTable 7. SymbolSO8Rth(j-a)SO14 and DIP8Rth(j-a)[1]Thermal characteristicsParameterthermal resistance from junction to ambientthermal resistance from junction to ambientConditionsin free airin free air[1]TypUnit160 K/W100 K/W[1]In accordance with IEC 60747-1. UBA2080_UBA2081All information provided in this document is subject to legal disclaimers. © NXP B. V. 2011. All rights reserved. Objective data sheetRev. 1. 1 — 6 December 20116 of 15

中文文档摘要：3:恩智浦半导体UBA2080/1半桥驱动器IC8. 极限值表6 。 极限值按照绝对最大额定值系统（ IEC 60134 ） 。 符号VDDVFSVSHV我（ HIN ）V我（ LIN ）VCLKV我（SD）的SRTjTAMBT英镑VESD参数电源电压电压引脚FS电压引脚SH引脚HIN输入电压在LIN引脚的输入电压电压引脚CLK对SD引脚的输入电压压摆率结温环境温度储存温度静电放电电压人体模型：引脚FS ， GH和SH引脚VDD， HIN ， LIN， SD ， CLK机器型号：所有引脚[1][2][2][1]条件公称源高边MOSFET吨< 1s逻辑输入为高侧驱动器逻辑输入为低侧驱动器逻辑输入，用于输出驱动器逻辑输入，用于输出驱动器和模拟输入非重叠设置引脚SH ;重复民0VSH-3-14006404055---最大14VSH+ 1460060014141414+6+150+150+15012250单位VVVVVVVVV / ns的CCCkVkVV按照人体模型（ HBM ） ：等同于1. 5 k串联电阻放电100 pF电容。 根据机器模型（ MM） ：相当于通过1. 5 k串联电阻和一个排出200 pF电容0. 75H电感器。 9. 热特性表7中。 符号SO8R号（j -a）的SO14和DIP8R号（j -a）的[1]热特性参数从结点到环境的热阻从结点到环境的热阻条件在自由空气在自由空气[1]典型值单位160 K / W100 K / W[1]符合IEC 60747-1 。 UBA2080_UBA2081本文档中提供的所有信息受法律免责声明。 © NXP B. V. 2011保留所有权利。 目标数据表修订版1. 1 - 2011年12月6日6 15

原英文文档摘要：4:NXP SemiconductorsUBA2080/1Half-bridge driver IC6. Pinning information6. 1 PinningGNDGNDSD/LINVDDGNDLINHIN1234aaa-0011211234567aaa-00113414 SEL13 GND12 VDD8GLSHGHFSGNDCLK/HINFSGHUBA2080AT11 GL10 GND98GNDSHVDDGNDSDCLK1234aaa-0011268GLSHGHFSUBA2080765UBA2081765Fig 3. UBA2080X: Pinconfiguration DIP8 andSO8 packageFig 4. UBA2080AT: Pinconfiguration SO14packageFig 5. UBA2081X: Pinconfiguration DIP8 andSO8 package6. 2 Pin descriptionTable 2. SymbolPin description UBA2080X/1X DIP8 and SO8PinUBA2080X(DIP8/SO8)VDDGNDLINSDHINCLKFSGHSHGLTable 3. SymbolGNDSD/LINCLK/HINFSSHGH123-4-5678-3-4UBA2081X(DIP8/SO8)IC supplyIC ground and low-side driver returnlow-side driver logic inputlow-side driver logic inputhigh-side driver logic inputhigh-side driver logic inputfloating supply voltagehigh-side MOSFET gatehigh-side MOSFET sourcelow-side MOSFET gateDescriptionPin description UBA2080AT (SO14)Pin1, 2, 4, 9, 10, 1335687DescriptionIC ground and low side driver returnlow-side driver logic inputhigh-side driver logic inputfloating supply voltagehigh-side MOSFET sourcehigh-side MOSFET gateUBA2080_UBA2081All information provided in this document is subject to legal disclaimers. © NXP B. V. 2011. All rights reserved. Objective data sheetRev. 1. 1 — 6 December 20113 of 15

中文文档摘要：4:恩智浦半导体UBA2080/1半桥驱动器IC6. 管脚信息6. 1钢钉GNDGNDSD / LINVDDGNDLINHIN1234aaa-0011211234567aaa-00113414 SEL13 GND12 VDD8GLSHGHFSGNDCLK / HINFSGHUBA2080AT11 GL10 GND98GNDSHVDDGNDSDCLK1234aaa-0011268GLSHGHFSUBA2080765UBA2081765图3 。 UBA2080X ：引脚配置和DIP8SO8封装图4 。 UBA2080AT ：引脚配置SO14包图5 。 UBA2081X ：引脚配置和DIP8SO8封装6. 2引脚说明表2中。 符号引脚说明UBA2080X / 1X和DIP8 SO8针UBA2080X(DIP8/SO8)VDDGNDLINSDHINCLKFSGHSHGL表3中。 符号GNDSD / LINCLK / HINFSSHGH123-4-5678-3-4UBA2081X(DIP8/SO8)IC供应集成电路接地和低侧驱动器返回低侧驱动器的逻辑输入低侧驱动器的逻辑输入高侧驱动器的逻辑输入高侧驱动器的逻辑输入浮动电源电压高边MOSFET的栅极高边MOSFET的源极低边MOSFET的栅极描述引脚说明UBA2080AT （ SO14 ）针1, 2, 4, 9, 10, 1335687描述IC地面和低侧驱动器返回低侧驱动器的逻辑输入高侧驱动器的逻辑输入浮动电源电压高边MOSFET的源极高边MOSFET的栅极UBA2080_UBA2081本文档中提供的所有信息受法律免责声明。 © NXP B. V. 2011保留所有权利。 目标数据表修订版1. 1 - 2011年12月6日3 15

原英文文档摘要：5:NXP SemiconductorsUBA2080/1Half-bridge driver IC12. Package outlineSO8: plastic small outline package; 8 leads; body width 3. 9 mmSOT96-1DEAXcyHEvMAZ85QA2A1pin 1 indexθLp14(A3)ALwMdetail Xebp02. 5scale5 mmDIMENSIONS (inch dimensions are derived from the original mm dimensions)UNITmminchesAmax. 1. 750. 069A10. 250. 10A21. 451. 25A30. 250. 01bp0. 490. 36c0. 250. 19D(1)5. 04. 80. 200. 19E(2)4. 03. 80. 160. 15e1. 270. 05HE6. 25. 8L1. 05Lp1. 00. 4Q0. 70. 6v0. 250. 01w0. 250. 01y0. 10. 004Z(1)0. 70. 30. 0280. 012θ8oo00. 010 0. 0570. 004 0. 0490. 019 0. 01000. 014 0. 00750. 2440. 039 0. 0280. 0410. 2280. 016 0. 024Notes1. Plastic or metal protrusions of 0. 15 mm (0. 006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0. 25 mm (0. 01 inch) maximum per side are not included. OUTLINEVERSIONSOT96-1REFERENCESIEC076E03JEDECMS-012JEITAEUROPEANPROJECTIONISSUE DATE99-12-2703-02-18Fig 9. Package outline SOT96-1All information provided in this document is subject to legal disclaimers. © NXP B. V. 2011. All rights reserved. UBA2080_UBA2081Objective data sheetRev. 1. 1 — 6 December 20119 of 15

中文文档摘要：5:恩智浦半导体UBA2080/1半桥驱动器IC12. 封装外形SO8 ：塑料小外形封装; 8线索;体宽3. 9毫米SOT96-1DEAXcyHEvMAZ85QA2A1PIN 1 INDEXθLp14(A3)ALwM细节Xebp02. 5规模5 mm尺寸（英寸尺寸是从原始的毫米尺寸得到）单位mm英寸A马克斯。 1. 750. 069A10. 250. 10A21. 451. 25A30. 250. 01bp0. 490. 36c0. 250. 19D(1)5. 04. 80. 200. 19E(2)4. 03. 80. 160. 15e1. 270. 05HE6. 25. 8L1. 05Lp1. 00. 4Q0. 70. 6v0. 250. 01w0. 250. 01y0. 10. 004Z(1)0. 70. 30. 0280. 012θ8oo00. 010 0. 0570. 004 0. 0490. 019 0. 01000. 014 0. 00750. 2440. 039 0. 0280. 0410. 2280. 016 0. 024笔记不包括1. 塑料或金属为0. 15毫米（ 0. 006英寸）的最大每一侧突起。 不包括2. 塑料或金属为0. 25毫米（0. 01英寸），最大每一侧突起。 概要VERSIONSOT96-1参考文献：IEC076E03JEDECMS-012JEITA欧洲投影发行日期99-12-2703-02-18图9 。 封装外形SOT96-1本文档中提供的所有信息受法律免责声明。 © NXP B. V. 2011保留所有权利。 UBA2080_UBA2081目标数据表修订版1. 1 - 2011年12月6日9 15