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产品型号06033C223KAT2A的概述

芯片06033C223KAT2A概述 06033C223KAT2A是一款广泛应用于电子电路中的表面贴装电容器,属于多层陶瓷电容(MLCC)系列。由于其良好的电气性能和高稳定性,此电容器被广泛运用于消费电子、通信设备及工业应用中。06033C223KAT2A主要特性为容值为22,000pF(即22nF),耐压值为50V,具有低 ESR(等效串联电阻)及ESL(等效串联电感),适合高频应用。 芯片06033C223KAT2A详细参数 06033C223KAT2A的关键电气参数包括: - 类型:多层陶瓷电容(MLCC) - 容量:22nF(22,000pF) - 额定电压:50V - 温度特性:X7R - 尺寸:0603(英寸),对应的毫米为1.6mm x 0.8mm - 频率特性:适用于高频应用 - ESR(等效串联电阻):低 - ESL(等效串联电感):低 - 工作温度范围:-55℃至1...

产品型号06033C223KAT2A的Datasheet PDF文件预览

X7R Dielectric  
General Specifications  
X7R formulations are called “temperature stable” ceramics and  
fall into EIA Class II materials. X7R is the most popular of these  
intermediate dielectric constant materials. Its temperature varia-  
tion of capacitance is within ±±15 from -11°C to +±21°C. This  
capacitance change is non-linear.  
Capacitance for X7R varies under the influence of electrical op-  
erating conditions such as voltage and frequency.  
X7R dielectric chip usage covers the broad spectrum of  
industrial applications where known changes in capacitance  
due to applied voltages are acceptable.  
PART NUMBER (see page 2 for complete part number explanation)  
0805  
5
C
103  
M
A
T
2
A
Size  
(L" x W")  
Voltage  
4V = 4  
Dielectric  
X7R = C  
Capacitance  
Code (In pF)  
2 Sig. Digits +  
Number of Zeros  
Capacitance  
Tolerance  
J = ± 15%  
Failure  
Rate  
A = Not  
Applicable  
Terminations  
Packaging  
2 = 7" Reel  
Special  
Code  
A = Std.  
Product  
T = Plated Ni  
6.3V = 6  
±0V = Z  
±6V = Y  
21V = 3  
10V = 1  
±00V = ±  
200V = 2  
100V = 7  
4 = ±3" Reel  
7 = Bulk Cass.  
9 = Bulk  
and Sn  
K = ±±05  
M = ± 205  
7 = Gold Plated%  
Z= FLEXITERM®%%  
%≤±μF only,  
contact factory for  
additional values  
Contact  
Factory For  
Multiples  
%Optional termination  
%%See FLEXITERM®  
X7R section  
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.  
Contact factory for non-specified capacitance values.  
X7R Dielectric  
Insulation Resistance vs Temperature  
Capacitance vs. Frequency  
Typical Temperature Coefficient  
10,000  
1,000  
100  
+30  
10  
+20  
+10  
5
0
-5  
0
-10  
-20  
-30  
-10  
-15  
-20  
-25  
0
0
20  
40  
60  
80  
100  
120  
-60 -40  
100 140  
120  
1KHz  
10 KHz  
100 KHz  
1 MHz  
10 MHz  
-20  
0
20 40 60 80  
Frequency  
Temperature °C  
Temperature °C  
Variation of Impedance with Cap Value  
Impedance vs. Frequency  
1,000 pF vs. 10,000 pF - X7R  
0805  
Variation of Impedance with Chip Size  
Impedance vs. Frequency  
100,000 pF - X7R  
Variation of Impedance with Chip Size  
Impedance vs. Frequency  
10,000 pF - X7R  
10  
10.00  
10  
1206  
0805  
1210  
1206  
0805  
1210  
1,000 pF  
10,000 pF  
1.0  
0.1  
.01  
1.00  
1.0  
0.10  
0.01  
0.1  
.01  
100  
1,000  
1
10  
100  
1000  
10  
100  
1,000  
1
10  
Frequency, MHz  
Frequency, MHz  
Frequency, MHz  
17  
X7R Dielectric  
Specifications and Test Methods  
Parameter/Test  
Operating Temperature Range  
Capacitance  
X7R Specification Limits  
Measuring Conditions  
Temperature Cycle Chamber  
-11ºC to +±21ºC  
Within specified tolerance  
≤ 2.15 for ≥ 10V DC rating  
≤ 3.05 for 21V DC rating  
≤ 3.15 for 21V and ±6V DC rating  
≤ 1.05 for ≤ ±0V DC rating  
±00,000MΩ or ±000MΩ - μF,  
whichever is less  
Freq.: ±.0 kHz ± ±05  
Voltage: ±.0Vrms ± .2V  
Dissipation Factor  
Charge device with rated voltage for  
±20 ± 1 secs ꢀ room temp/humidity  
Charge device with 3005 of rated voltage for  
±-1 seconds, w/charge and discharge current  
limited to 10 mA (max)  
Insulation Resistance  
Dielectric Strength  
No breakdown or visual defects  
Note: Charge device with ±105 of rated  
voltage for 100V devices.  
Appearance  
Capacitance  
Variation  
Dissipation  
Factor  
Insulation  
Resistance  
No defects  
≤ ±±25  
Deflection: 2mm  
Test Time: 30 seconds  
Resistance to  
Flexure  
1mm/sec  
Meets Initial Values (As Above)  
≥ Initial Value x 0.3  
Stresses  
90 mm  
≥ 915 of each terminal should be covered  
with fresh solder  
No defects, <215 leaching of either end terminal  
Dip device in eutectic solder at 230 ± 1ºC  
for 1.0 ± 0.1 seconds  
Solderability  
Appearance  
Capacitance  
Variation  
≤ ±7.15  
Dip device in eutectic solder at 260ºC for 60  
seconds. Store at room temperature for 24 ± 2  
hours before measuring electrical properties.  
Dissipation  
Factor  
Insulation  
Resistance  
Dielectric  
Strength  
Resistance to  
Solder Heat  
Meets Initial Values (As Above)  
Meets Initial Values (As Above)  
Meets Initial Values (As Above)  
No visual defects  
≤ ±7.15  
Appearance  
Capacitance  
Variation  
Step ±: -11ºC ± 2º  
Step 2: Room Temp  
30 ± 3 minutes  
≤ 3 minutes  
Dissipation  
Factor  
Insulation  
Resistance  
Dielectric  
Strength  
Appearance  
Capacitance  
Variation  
Dissipation  
Factor  
Insulation  
Resistance  
Dielectric  
Strength  
Appearance  
Capacitance  
Variation  
Dissipation  
Factor  
Insulation  
Resistance  
Dielectric  
Strength  
Thermal  
Shock  
Meets Initial Values (As Above)  
Meets Initial Values (As Above)  
Step 3: +±21ºC ± 2º  
Step 4: Room Temp  
30 ± 3 minutes  
≤ 3 minutes  
Repeat for 1 cycles and measure after  
24 ± 2 hours at room temperature  
Meets Initial Values (As Above)  
No visual defects  
Charge device with ±.1 rated voltage (≤ ±0V) in  
test chamber set at ±21ºC ± 2ºC  
for ±000 hours (+48, -0)  
≤ ±±2.15  
≤ Initial Value x 2.0 (See Above)  
≥ Initial Value x 0.3 (See Above)  
Load Life  
Remove from test chamber and stabilize  
at room temperature for 24 ± 2 hours  
before measuring.  
Meets Initial Values (As Above)  
No visual defects  
Store in a test chamber set at 81ºC ± 2ºC/  
815 ± 15 relative humidity for ±000 hours  
(+48, -0) with rated voltage applied.  
≤ ±±2.15  
Load  
Humidity  
≤ Initial Value x 2.0 (See Above)  
≥ Initial Value x 0.3 (See Above)  
Meets Initial Values (As Above)  
Remove from chamber and stabilize at  
room temperature and humidity for  
24 ± 2 hours before measuring.  
18  
X7R Dielectric  
Capacitance Range  
PREFERRED SIZES ARE SHADED  
SIZE  
0101  
0201  
0402  
0603  
0805  
1206  
Soldering  
Packaging  
Reflow Only  
Reflow Only  
All Paper  
Reflow/Wave  
All Paper  
Reflow/Wave  
All Paper  
Reflow/Wave  
Reflow/Wave  
Paper/Embossed  
Paper/Embossed  
Paper/Embossed  
mm  
(in.)  
0.40 ± 0.02  
0.60 ± 0.03  
±.00 ± 0.±0  
±.60 ± 0.±1  
2.0± ± 0.20  
3.20 ± 0.20  
(L) Length  
(0.0±6 ± 0.0008)  
(0.024 ± 0.00±)  
(0.040 ± 0.004)  
(0.063 ± 0.006)  
(0.079 ± 0.008)  
(0.±26 ± 0.008)  
mm  
(in.)  
0.20 ± 0.02  
(0.008 ± 0.0008)  
0.30 ± 0.03  
(0.0±± ± 0.00±)  
0.10 ± 0.±0  
(0.020 ± 0.004)  
0.8± ± 0.±1  
(0.032 ± 0.006)  
±.21 ± 0.20  
(0.049 ± 0.008)  
±.60 ± 0.20  
(0.063 ± 0.008)  
(W) Width  
mm  
(in.)  
0.20 ± 0.02  
(0.008 ± 0.0008)  
0.±1 ± 0.01  
(0.006 ± 0.002)  
0.21 ± 0.±1  
(0.0±0 ± 0.006)  
0.31 ± 0.±1  
(0.0±4 ± 0.006)  
0.10 ± 0.21  
(0.020 ± 0.0±0)  
0.10 ± 0.21  
(0.020 ± 0.0±0)  
(t) Terminal  
WVDC  
±00  
±10  
220  
330  
±0  
A
A
A
A
A
A
A
±0  
±6  
A
A
A
A
A
A
A
21  
±6  
21  
10  
6.3  
±0  
±6  
21  
10  
±00 200 6.3  
±0  
±6  
21  
10  
±00 200 6.3  
±0  
±6  
21  
10 ±00 200 100  
Cap  
(pF)  
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
C
C
C
C
C
C
C
C
C
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
K
K
K
470  
680  
±000  
±100  
2200  
3300  
4700  
6800  
0.0±0  
0.0±1  
0.022  
0.033  
0.047  
0.068  
0.±0  
0.±1  
0.22  
0.33  
0.47  
0.68  
±.0  
K
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
P
C
C
C
C
C
C
C
C
C
C
C
C
Cap  
(μF  
J
J
J
J
P
G
G
G
G
G
G
M
M
M
M
P
P
C
C
C
C
C
N
N
N
N
N
N
N
N
G
G
G
J
J
G
G
G
M
Q
Q
Q
Q
Q
Q
G
G
J%  
J%  
N
N
N
N
N
J
M
M
Q
Q
Q
Q
M
M
M
P
Q
M
M
M
Q
Q
J%  
J%  
N
±.1  
2.2  
J%  
P%  
Q%  
3.3  
4.7  
±0  
22  
P%  
P%  
P%  
Q%  
Q%  
Q%  
Q%  
Q%  
Q%  
Q%  
Q%  
P%  
Q%  
47  
±00  
WVDC  
±0  
±0  
±6  
21  
±6  
21  
10  
6.3  
±0  
±6  
21  
10  
±00 200 6.3  
±0  
±6  
21  
10  
±00 200 6.3  
±0  
±6  
21  
10 ±00 200 100  
SIZE  
0101  
0201  
0402  
0603  
0805  
1206  
Letter  
Max.  
Thickness (0.0±3)  
A
0.33  
C
0.16  
(0.022)  
E
0.7±  
(0.028)  
G
J
K
±.02  
(0.040)  
M
±.27  
(0.010)  
N
±.40  
(0.011)  
P
±.12  
(0.060)  
Q
X
2.29  
(0.090)  
Y
2.14  
(0.±00)  
Z
2.79  
(0.±±0)  
0.90  
(0.031)  
0.94  
(0.037)  
±.78  
(0.070)  
PAPER  
EMBOSSED  
%Optional Specifications – Contact factory  
19  
X7R Dielectric  
Capacitance Range  
PREFERRED SIZES ARE SHADED  
SIZE  
1210  
1812  
1825  
2220  
2225  
Soldering  
Reflow Only  
Reflow Only  
Reflow Only  
Reflow Only  
Reflow Only  
Packaging  
Paper/Embossed  
All Embossed  
All Embossed  
All Embossed  
All Embossed  
mm  
(in.)  
3.20 ± 0.20  
4.10 ± 0.30  
4.10 ± 0.30  
1.70 ± 0.40  
1.72 ± 0.21  
(L) Length  
(0.±26 ± 0.008)  
(0.±77 ± 0.0±2)  
(0.±77 ± 0.0±2)  
(0.221 ± 0.0±6)  
(0.221 ± 0.0±0)  
mm  
(in.)  
2.10 ± 0.20  
(0.098 ± 0.008)  
3.20 ± 0.20  
(0.±26 ± 0.008)  
6.40 ± 0.40  
(0.212 ± 0.0±6)  
1.00 ± 0.40  
(0.±97 ± 0.0±6)  
6.31 ± 0.21  
(0.210 ± 0.0±0)  
(W) Width  
mm  
(in.)  
0.10 ± 0.21  
(0.020 ± 0.0±0)  
0.6± ± 0.36  
(0.024 ± 0.0±4)  
0.6± ± 0.36  
(0.024 ± 0.0±4)  
0.64 ± 0.39  
(0.021 ± 0.0±1)  
0.64 ± 0.39  
(0.021 ± 0.0±1)  
(t) Terminal  
WVDC  
±0  
±6  
21  
10  
±00  
200  
100  
10  
±00  
200  
100  
10  
±00  
21  
10  
±00  
200  
10  
±00  
Cap  
(pF)  
±00  
±10  
220  
W
L
330  
470  
T
680  
±000  
±100  
2200  
3300  
4700  
6800  
0.0±0  
0.0±1  
0.022  
0.033  
0.047  
0.068  
0.±0  
0.±1  
0.22  
0.33  
0.47  
0.68  
±.0  
t
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
Z%  
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
Z%  
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
P
P
Z
Z
Z
Z
Z%  
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
X
X
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
P
Cap  
(μF  
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
K
K
K
K
K
K
K
K
K
M
P
Q
X
K
K
K
K
K
K
K
P
P
X
K
P
P
X
Z
Z
Z
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
Z
X
X
X
X
X
X
X
X
X
X
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
P
P
P
P
P
P
P
P
X
Q
Q
J
J
J
J
M
M
Z
Z
M
P
Q
Q
X
Z
Z
Z
P
±.1  
2.2  
3.3  
4.7  
±0  
22  
Z
Z
Z
Z
Z
Z
47  
±00  
WVDC  
±0  
±6  
21  
10  
±00  
200  
100  
10  
±00  
200  
100  
10  
±00  
21  
10  
±00  
200  
10  
±00  
SIZE  
1210  
1812  
1825  
2220  
2225  
Letter  
Max.  
Thickness (0.0±3)  
A
0.33  
C
0.16  
(0.022)  
E
0.7±  
(0.028)  
G
0.90  
(0.031)  
J
0.94  
(0.037)  
K
±.02  
(0.040)  
M
±.27  
(0.010)  
N
±.40  
(0.011)  
P
±.12  
(0.060)  
Q
±.78  
(0.070)  
X
2.29  
(0.090)  
Y
Z
2.79  
(0.±±0)  
2.14  
(0.±00)  
PAPER  
EMBOSSED  
%Optional Specifications – Contact factory  
20  
配单直通车
06033C223KAT2A产品参数
型号:06033C223KAT2A
是否无铅:不含铅
是否Rohs认证:符合
生命周期:Active
IHS 制造商:AVX CORP
零件包装代码:0603
包装说明:, 0603
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8532.24.00.20
Factory Lead Time:13 weeks 5 days
风险等级:0.74
Samacsys Confidence:3
Samacsys Status:Released
Samacsys PartID:281431
Samacsys Pin Count:2
Samacsys Part Category:Capacitor
Samacsys Package Category:Capacitor Chip Non-polarised
Samacsys Footprint Name:G0603
Samacsys Released Date:2016-04-06 04:05:29
Is Samacsys:N
电容:0.022 µF
电容器类型:CERAMIC CAPACITOR
介电材料:CERAMIC
高度:0.9 mm
JESD-609代码:e3
长度:1.6 mm
安装特点:SURFACE MOUNT
多层:Yes
负容差:10%
端子数量:2
最高工作温度:125 °C
最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE
封装形式:SMT
包装方法:TR, PAPER, 7 INCH
正容差:10%
额定(直流)电压(URdc):25 V
尺寸代码:0603
表面贴装:YES
温度特性代码:X7R
温度系数:15% ppm/ °C
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状:WRAPAROUND
宽度:0.81 mm
Base Number Matches:1
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