•ꢀ
•ꢀ
Recommendedꢀmaximumꢀpasteꢀthicknessꢀisꢀ0.25mmꢀ(0.010ꢀinch)
Devicesꢀcanꢀbeꢀcleanedꢀusingꢀstandardꢀindustryꢀmethodsꢀandꢀ
solvents.ꢀ
Note:ꢀ
Ifꢀreflowꢀtemperaturesꢀexceedꢀtheꢀrecommendedꢀprofile,ꢀ
devicesꢀmayꢀnotꢀmeetꢀtheꢀperformanceꢀrequirements.
POLYFUSE® Resettable PTCs
Surface Mount
Soldering Parameters
Condition
Reflow
Peak Temp/ Duration Time
Time above liquids (TAL) 220°C
Preheat 120°C~ 180°C
Storage Condition
260°Cꢀ/ꢀ10ꢀSec
Soldering
Cooling
260
220
60ꢀSecꢀ~ꢀ100ꢀSec
50ꢀSecꢀ~ꢀ150ꢀSec
<
0°C~35°C,ꢀ 70ꢁRH
=
Preheating
180
120
•ꢀ
Recommendedꢀreflowꢀmethods:ꢀIR,ꢀvaporꢀphaseꢀoven,ꢀhotꢀairꢀ
oven,ꢀN2ꢀenvironmentꢀforꢀlead-free
•ꢀ
Devicesꢀareꢀnotꢀdesignedꢀtoꢀbeꢀwaveꢀsolderedꢀtoꢀtheꢀbottomꢀsideꢀ
ofꢀtheꢀboard.
0
60 to 100
120
50 to 150
Time(s)
Physical Specifications
Environmental Specifications
Operating/Storage
Gold-PlatedꢀCopperꢀorꢀSolder-Platedꢀ
Terminal Material
Lead Solderability
-40°Cꢀtoꢀ+85°C
Copperꢀ(SolderꢀMaterial:ꢀMatteꢀTinꢀ(Sn))
Temperature
MeetsꢀEIAꢀSpecificationꢀRS186-9E,ꢀANSI/
J-STD-002ꢀCategoryꢀ3.
Maximum Device Surface
Temperature in Tripped State
125°C
+85°C,ꢀ1000ꢀhours
Passive Aging
5ꢁꢀtypicalꢀresistanceꢀchange
+85°C,ꢀ85ꢁR.H.ꢀ1000ꢀhours
5ꢁꢀtypicalꢀresistanceꢀchange
Humidity Aging
MIL-STD-202ꢀMethodꢀ107Gꢀ
+85°C/-40°Cꢀ20ꢀtimesꢀ
-30ꢁꢀtypicalꢀresistanceꢀchange
Thermal Shock
Solvent Resistance
Vibration
MIL-STD-202,ꢀMethodꢀ215
Noꢀchange
MIL-STD-883C,ꢀMethodꢀ2007.1,ꢀ
ConditionꢀA
Noꢀchange
ꢂ
0805L Series
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©2006 Littelfuse
Electronics Designers Guide
Specifications are subject to change without notice.