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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • 1SMB8.0AT3G
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  • 1SMB8.0AT3G 优势库存
  • 数量45000 
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  • 1SMB8.0AT3G
  • 数量15000 
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  • 1SMB8.0AT3G
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  • 1SMB8.0AT3G
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  • 北京元坤伟业科技有限公司

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  • 1SMB8.0AT3G
  • 数量5000 
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  • 数量236000 
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  • 封装TVS二极管 
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  • 北京元坤伟业科技有限公司

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  • 1SMB8.0AT3G
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  • 深圳市华斯顿电子科技有限公司

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  • 数量20844 
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  • 数量2019 
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产品型号1SMB8.0AT3G的概述

芯片1SMB8.0AT3G的概述 1SMB8.0AT3G是一种高性能的瞬态电压抑制器(TVS),专用于保护敏感电子设备免受过电压冲击。该芯片通常应用于电信、计算机、消费电子及工业设备等领域。其设计理念是通过在电压超过预定值时,将多余电压转移到地,从而有效地保护后端电路的完整性。 这款TVS二极管具有快速响应时间、低漏电流和高功率处理能力,使其成为保护电路的理想选择。它的结构使其在瞬态电压或静电放电(ESD)事件中能够快速反应,吸收多余的电压,防止元件发生损坏。 芯片1SMB8.0AT3G的详细参数 1SMB8.0AT3G的关键参数包括: 1. 最大反向工作电压:8V 2. 钳位电压(Vwm):常规工作下为9.5V 3. 峰值脉冲功率:达到400W(对于一个20ms的脉冲) 4. 静态电容:约为100 pF 5. 操作温度范围:-55°C到+150°C 6. 封装形式:SMB,具有标准的...

产品型号1SMB8.0AT3G的Datasheet PDF文件预览

1SMB5.0AT3 Series  
600 Watt Peak Power Zener  
Transient Voltage  
Suppressors  
Unidirectional*  
http://onsemi.com  
The SMB series is designed to protect voltage sensitive  
components from high voltage, high energy transients. They have  
excellent clamping capability, high surge capability, low zener  
impedance and fast response time. The SMB series is supplied in  
ON Semiconductor’s exclusive, cost-effective, highly reliable  
Surmetict package and is ideally suited for use in communication  
systems, automotive, numerical controls, process controls, medical  
equipment, business machines, power supplies and many other  
industrial/consumer applications.  
PLASTIC SURFACE MOUNT  
ZENER OVERVOLTAGE  
TRANSIENT SUPPRESSORS  
5.0 V − 170 V,  
600 W PEAK POWER  
Features  
Cathode  
Anode  
Working Peak Reverse Voltage Range − 5.0 V to 170 V  
Standard Zener Breakdown Voltage Range − 6.7 V to 199 V  
Peak Power − 600 W @ 1.0 ms  
ESD Rating of Class 3 (>16 kV) per Human Body Model  
Maximum Clamp Voltage @ Peak Pulse Current  
Low Leakage < 5.0 mA Above 10 V  
UL 497B for Isolated Loop Circuit Protection  
Response Time is Typically < 1.0 ns  
Pb−Free Packages are Available  
SMB  
CASE 403A  
PLASTIC  
MARKING DIAGRAM  
AYWW  
xx G  
G
A
Y
= Assembly Location  
= Year  
Mechanical Characteristics  
CASE: Void-free, transfer-molded, thermosetting plastic  
FINISH: All external surfaces are corrosion resistant and leads are  
readily solderable  
WW = Work Week  
xx  
= Device Code (Refer to page 3)  
= Pb−Free Package  
G
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
(Note: Microdot may be in either location)  
260°C for 10 Seconds  
LEADS: Modified L−Bend providing more contact area to bond pads  
POLARITY: Cathode indicated by polarity band  
MOUNTING POSITION: Any  
ORDERING INFORMATION  
Device  
Package  
Shipping  
1SMBxxxAT3  
1SMBxxxAT3G  
SMB  
2500/Tape & Reel  
2500/Tape & Reel  
SMB  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
©
Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
February, 2007 − Rev. 10  
1SMB5.0AT3/D  
1SMB5.0AT3 Series  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
600  
Unit  
W
Peak Power Dissipation (Note 1) @ T = 25°C, Pulse Width = 1 ms  
P
L
PK  
DC Power Dissipation @ T = 75°C  
P
3.0  
W
L
D
Measured Zero Lead Length (Note 2)  
Derate Above 75°C  
Thermal Resistance from Junction−to−Lead  
40  
25  
mW/°C  
°C/W  
R
q
JL  
DC Power Dissipation (Note 3) @ T = 25°C  
P
0.55  
4.4  
226  
W
mW/°C  
°C/W  
A
D
Derate Above 25°C  
Thermal Resistance from Junction−to−Ambient  
R
q
JA  
Forward Surge Current (Note 4) @ T = 25°C  
I
100  
A
A
FSM  
Operating and Storage Temperature Range  
T , T  
−65 to +150  
°C  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. 10 X 1000 ms, non−repetitive.  
2. 1 in square copper pad, FR−4 board.  
3. FR−4 board, using ON Semiconductor minimum recommended footprint, as shown in 403A case outline dimensions spec.  
4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum.  
ELECTRICAL CHARACTERISTICS (T = 25°C unless  
I
A
otherwise noted, V = 3.5 V Max. @ I (Note 5) = 30 A)  
F
F
I
F
Symbol  
Parameter  
I
Maximum Reverse Peak Pulse Current  
Clamping Voltage @ I  
PP  
V
C
PP  
V
V
V
BR RWM  
V
Working Peak Reverse Voltage  
C
RWM  
V
I
V
R
T
F
I
Maximum Reverse Leakage Current @ V  
I
R
RWM  
V
Breakdown Voltage @ I  
Test Current  
BR  
T
I
T
F
I
Forward Current  
I
PP  
V
Forward Voltage @ I  
F
F
5. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms,  
non−repetitive duty cycle.  
Uni−Directional TVS  
http://onsemi.com  
2
 
1SMB5.0AT3 Series  
ELECTRICAL CHARACTERISTICS (Devices listed in bold, italic are ON Semiconductor Preferred devices.)  
Breakdown Voltage  
V
@ I (Note 8)  
C
PP  
V
C
typ  
RWM  
V
(Note 7) Volts  
@ I  
V
I
(Note 6)  
(Note 9)  
I
@ V  
RWM  
BR  
T
C
PP  
R
Device  
V
mA  
Min  
Nom  
Max  
mA  
V
A
pF  
Marking  
Device*  
1SMB5.0AT3, G  
1SMB6.0AT3, G  
1SMB6.5AT3, G  
1SMB7.0AT3, G  
KE  
KG  
KK  
KM  
5.0  
6.0  
6.5  
7.0  
800  
800  
500  
500  
6.40  
6.67  
7.22  
7.78  
6.7  
7.02  
7.6  
7.0  
7.37  
7.98  
8.6  
10  
10  
10  
10  
9.2  
65.2  
58.3  
53.6  
50.0  
2700  
2300  
2140  
2005  
10.3  
11.2  
12.0  
8.19  
1SMB7.5AT3, G  
1SMB8.0AT3, G  
1SMB8.5AT3, G  
1SMB9.0AT3, G  
KP  
KR  
KT  
KV  
7.5  
8.0  
8.5  
9.0  
100  
50  
10  
8.33  
8.89  
9.44  
10.0  
8.77  
9.36  
9.92  
9.21  
9.83  
10.4  
11.1  
1.0  
1.0  
1.0  
1.0  
12.9  
13.6  
14.4  
15.4  
46.5  
44.1  
41.7  
39.0  
1890  
1780  
1690  
1605  
5.0  
10.55  
1SMB10AT3, G  
1SMB11AT3, G  
1SMB12AT3, G  
1SMB13AT3, G  
KX  
KZ  
LE  
LG  
10  
11  
12  
13  
5.0  
5.0  
5.0  
5.0  
11.1  
12.2  
13.3  
14.4  
11.7  
12.85  
14  
12.3  
13.5  
14.7  
15.9  
1.0  
1.0  
1.0  
1.0  
17.0  
18.2  
19.9  
21.5  
35.3  
33.0  
30.2  
27.9  
1460  
1345  
1245  
1160  
15.15  
1SMB14AT3, G  
1SMB15AT3, G  
1SMB16AT3, G  
1SMB17AT3, G  
LK  
LM  
LP  
LR  
14  
15  
16  
17  
5.0  
5.0  
5.0  
5.0  
15.6  
16.7  
17.8  
18.9  
16.4  
17.6  
18.75  
19.9  
17.2  
18.5  
19.7  
20.9  
1.0  
1.0  
1.0  
1.0  
23.2  
24.4  
26.0  
27.6  
25.8  
24.0  
23.1  
21.7  
1085  
1020  
965  
915  
1SMB18AT3, G  
1SMB20AT3, G  
1SMB22AT3, G  
1SMB24AT3, G  
LT  
LV  
LX  
LZ  
18  
20  
22  
24  
5.0  
5.0  
5.0  
5.0  
20.0  
22.2  
24.4  
26.7  
21.05  
23.35  
25.65  
28.1  
22.1  
24.5  
26.9  
29.5  
1.0  
1.0  
1.0  
1.0  
29.2  
32.4  
35.5  
38.9  
20.5  
18.5  
16.9  
15.4  
870  
790  
730  
675  
1SMB26AT3, G  
1SMB28AT3, G  
1SMB30AT3, G  
1SMB33AT3, G  
ME  
MG  
MK  
MM  
26  
28  
30  
33  
5.0  
5.0  
5.0  
5.0  
28.9  
31.1  
33.3  
36.7  
30.4  
32.75  
35.05  
38.65  
31.9  
34.4  
36.8  
40.6  
1.0  
1.0  
1.0  
1.0  
42.1  
45.4  
48.4  
53.3  
14.2  
13.2  
12.4  
11.3  
630  
590  
555  
510  
1SMB36AT3, G  
1SMB40AT3, G  
1SMB43AT3, G  
1SMB45AT3, G  
MP  
MR  
MT  
MV  
36  
40  
43  
45  
5.0  
5.0  
5.0  
5.0  
40.0  
44.4  
47.8  
50.0  
42.1  
46.75  
50.3  
44.2  
49.1  
52.8  
55.3  
1.0  
1.0  
1.0  
1.0  
58.1  
64.5  
69.4  
72.7  
10.3  
9.3  
8.6  
8.3  
470  
430  
400  
385  
52.65  
1SMB48AT3, G  
1SMB51AT3, G  
1SMB54AT3, G  
1SMB58AT3, G  
MX  
MZ  
NE  
NG  
48  
51  
54  
58  
5.0  
5.0  
5.0  
5.0  
53.3  
56.7  
60.0  
64.4  
56.1  
59.7  
63.15  
67.8  
58.9  
62.7  
66.3  
71.2  
1.0  
1.0  
1.0  
1.0  
77.4  
82.4  
87.1  
93.6  
7.7  
7.3  
6.9  
6.4  
365  
345  
330  
310  
1SMB60AT3, G  
1SMB64AT3, G  
1SMB70AT3, G  
1SMB75AT3, G  
NK  
NM  
NP  
NR  
60  
64  
70  
75  
5.0  
5.0  
5.0  
5.0  
66.7  
71.1  
77.8  
83.3  
70.2  
74.85  
81.9  
73.7  
78.6  
86  
1.0  
1.0  
1.0  
1.0  
96.8  
103  
113  
121  
6.2  
5.8  
5.3  
4.9  
300  
280  
260  
245  
87.7  
92.1  
1SMB85AT3, G  
1SMB90AT3, G  
1SMB100AT3, G  
NV  
NX  
NZ  
85  
90  
100  
55.0  
5.0  
5.0  
94.4  
100  
111  
99.2  
105.5  
117  
104  
111  
123  
1.0  
1.0  
1.0  
137  
146  
162  
4.4  
4.1  
3.7  
220  
210  
190  
1SMB110AT3, G  
1SMB120AT3, G  
1SMB130AT3, G  
1SMB150AT3, G  
PE  
PG  
PK  
PM  
110  
120  
130  
150  
5.0  
5.0  
5.0  
5.0  
122  
133  
144  
167  
128.5  
140  
151.5  
176  
135  
147  
159  
185  
1.0  
1.0  
1.0  
1.0  
177  
193  
209  
243  
3.4  
3.1  
2.9  
2.5  
175  
160  
150  
135  
1SMB160AT3, G  
1SMB170AT3, G  
PP  
PR  
160  
170  
5.0  
5.0  
178  
189  
187.5  
199  
197  
209  
1.0  
1.0  
259  
275  
2.3  
2.2  
125  
120  
6. A transient suppressor is normally selected according to the working peak reverse voltage (V ), which should be equal to or greater than  
RWM  
the DC or continuous peak operating voltage level.  
7. V measured at pulse test current I at an ambient temperature of 25°C.  
BR  
T
8. Surge current waveform per Figure 2 and derate per Figure 4 of the General Data − 600 W at the beginning of this group.  
9. Bias Voltage = 0 V, F = 1 MHz, T = 25°C  
J
†Please see 1SMB10CAT3 to 1SMB78CAT3 for Bidirectional devices.  
* The “G” suffix indicates Pb−Free package available.  
http://onsemi.com  
3
 
1SMB5.0AT3 Series  
100  
10  
PULSE WIDTH (t ) IS DEFINED AS  
P
NONREPETITIVE  
THAT POINT WHERE THE PEAK  
CURRENT DECAYS TO 50% OF  
t 10 ms  
rꢀ  
PULSE WAVEFORM  
SHOWN IN FIGURE 2  
I .  
PP  
100  
50  
0
PEAK VALUE − I  
PP  
I
PP  
2
HALF VALUE −  
1
t
P
0.1  
0.1 ms  
1 ms  
10 ms  
100 ms  
1 ms  
10 ms  
0
1
2
3
4
5
t , PULSE WIDTH  
P
t, TIME (ms)  
Figure 1. Pulse Rating Curve  
Figure 2. Pulse Waveform  
160  
140  
120  
10,000  
1000  
T = 25°C  
J
f = 1 MHz  
1SMB5.0AT3G  
1SMB10AT3G  
100  
80  
100  
10  
1
1SMB48AT3G  
60  
1SMB170AT3G  
40  
20  
0
0
25  
50  
75  
100  
125  
150  
1
10  
100  
1000  
T , AMBIENT TEMPERATURE (°C)  
A
BIAS VOLTAGE (VOLTS)  
Figure 4. Typical Junction Capacitance vs.  
Bias Voltage  
Figure 3. Pulse Derating Curve  
Z
in  
LOAD  
V
in  
V
L
Figure 5. Typical Protection Circuit  
http://onsemi.com  
4
 
1SMB5.0AT3 Series  
APPLICATION NOTES  
RESPONSE TIME  
minimum lead lengths and placing the suppressor device as  
close as possible to the equipment or components to be  
protected will minimize this overshoot.  
In most applications, the transient suppressor device is  
placed in parallel with the equipment or component to be  
protected. In this situation, there is a time delay associated  
with the capacitance of the device and an overshoot  
condition associated with the inductance of the device and  
the inductance of the connection method. The capacitive  
effect is of minor importance in the parallel protection  
scheme because it only produces a time delay in the  
transition from the operating voltage to the clamp voltage as  
shown in Figure 6.  
The inductive effects in the device are due to actual  
turn-on time (time required for the device to go from zero  
current to full current) and lead inductance. This inductive  
effect produces an overshoot in the voltage across the  
equipment or component being protected as shown in  
Figure 7. Minimizing this overshoot is very important in the  
application, since the main purpose for adding a transient  
suppressor is to clamp voltage spikes. The SMB series have  
a very good response time, typically < 1.0 ns and negligible  
inductance. However, external inductive effects could  
produce unacceptable overshoot. Proper circuit layout,  
Some input impedance represented by Z is essential to  
in  
prevent overstress of the protection device. This impedance  
should be as high as possible, without restricting the circuit  
operation.  
DUTY CYCLE DERATING  
The data of Figure 1 applies for non-repetitive conditions  
and at a lead temperature of 25°C. If the duty cycle increases,  
the peak power must be reduced as indicated by the curves  
of Figure 8. Average power must be derated as the lead or  
ambient temperature rises above 25°C. The average power  
derating curve normally given on data sheets may be  
normalized and used for this purpose.  
At first glance the derating curves of Figure 8 appear to be  
in error as the 10 ms pulse has a higher derating factor than  
the 10 ms pulse. However, when the derating factor for a  
given pulse of Figure 8 is multiplied by the peak power  
value of Figure 1 for the same pulse, the results follow the  
expected trend.  
http://onsemi.com  
5
1SMB5.0AT3 Series  
V
in  
(TRANSIENT)  
OVERSHOOT DUE TO  
INDUCTIVE EFFECTS  
V
V
V
in  
(TRANSIENT)  
V
L
V
L
V
in  
t
d
t
= TIME DELAY DUE TO CAPACITIVE EFFECT  
t
D
t
Figure 6.  
Figure 7.  
1
0.7  
0.5  
0.3  
0.2  
PULSE WIDTH  
10 ms  
0.1  
0.07  
0.05  
1 ms  
0.03  
0.02  
100 ms  
10 ms  
10 20  
D, DUTY CYCLE (%)  
0.01  
0.1 0.2  
0.5  
1
2
5
50 100  
Figure 8. Typical Derating Factor for Duty Cycle  
UL RECOGNITION  
The entire series has Underwriters Laboratory  
Recognition for the classification of protectors (QVGV2)  
under the UL standard for safety 497B and File #E210057.  
Many competitors only have one or two devices recognized  
or have recognition in a non-protective category. Some  
competitors have no recognition at all. With the UL497B  
recognition, our parts successfully passed several tests  
including Strike Voltage Breakdown test, Endurance  
Conditioning, Temperature test, Dielectric  
Voltage-Withstand test, Discharge test and several more.  
Whereas, some competitors have only passed a  
flammability test for the package material, we have been  
recognized for much more to be included in their Protector  
category.  
http://onsemi.com  
6
1SMB5.0AT3 Series  
PACKAGE DIMENSIONS  
SMB  
CASE 403A−03  
ISSUE F  
H
E
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.  
E
2. CONTROLLING DIMENSION: INCH.  
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.  
MILLIMETERS  
INCHES  
DIM  
A
A1  
b
c
D
MIN  
1.90  
0.05  
1.96  
0.15  
3.30  
4.06  
5.21  
0.76  
NOM  
2.13  
0.10  
2.03  
0.23  
3.56  
4.32  
5.44  
1.02  
MAX  
MIN  
NOM  
0.084  
0.004  
0.080  
0.009  
0.140  
0.170  
0.214  
0.040  
MAX  
0.096  
0.008  
0.087  
0.012  
0.156  
0.181  
0.220  
0.063  
2.45  
0.20  
2.20  
0.31  
3.95  
4.60  
5.60  
1.60  
0.075  
0.002  
0.077  
0.006  
0.130  
0.160  
0.205  
0.030  
b
D
E
H
E
L
0.51 REF  
L1  
0.020 REF  
A
A1  
c
L
L1  
SOLDERING FOOTPRINT*  
2.261  
0.089  
2.743  
0.108  
2.159  
0.085  
mm  
inches  
ǒ
Ǔ
SCALE 8:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
SURMETIC is a trademark of Semiconductor Components Industries, LLC.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5773−3850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
1SMB5.0AT3/D  
配单直通车
1SMB8.0AT3G产品参数
型号:1SMB8.0AT3G
是否Rohs认证:符合
生命周期:Obsolete
IHS 制造商:LITTELFUSE INC
包装说明:R-PDSO-C2
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8541.10.00.50
风险等级:5.7
Is Samacsys:N
其他特性:EXCELLENT CLAMPING CAPABILITY, LOW IMPEDANCE, HIGH RELIABILITY, UL RECOGNIZED
最大击穿电压:9.83 V
最小击穿电压:8.89 V
配置:SINGLE
二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码:DO-214AA
JESD-30 代码:R-PDSO-C2
JESD-609代码:e3
最大非重复峰值反向功率耗散:600 W
元件数量:1
端子数量:2
最高工作温度:150 °C
最低工作温度:-65 °C
封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL
最大功率耗散:0.55 W
认证状态:Not Qualified
最大重复峰值反向电压:8 V
表面贴装:YES
技术:ZENER
端子面层:Matte Tin (Sn)
端子形式:C BEND
端子位置:DUAL
处于峰值回流温度下的最长时间:40
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