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产品型号3606BG的概述

芯片3606BG的概述 芯片3606BG是近年来在电子行业中广泛应用的一款集成电路(IC),主要用于电源管理领域。作为一种高效能的电源管理芯片,3606BG在电源调节和电能转换方面展现出了极大的应用潜力。其设计旨在满足现代数字设备对低功耗、高效率及高度集成化的需求,特别是在消费电子、通信以及工业控制等多个领域。 芯片采用了先进的半导体材料与工艺,使其在性能、稳定性以及散热方面表现出色。3606BG不仅兼容多种工作环境要求,同时也具备灵活的外部接口,方便用户进行应用和集成。这款芯片的功能强大,使其在市场上赢得了良好的口碑,越来越多的工程师和设计师将其作为他们新项目的首选。 芯片3606BG的详细参数 芯片3606BG的技术参数包括: - 输入电压范围:3.0V到36V - 输出电压范围:可调,范围通常在1.2V到30V之间 - 最大输出电流:1A - 开关频率:高达500kHz - 功率...

产品型号3606BG的Datasheet PDF文件预览

SBOS170  
PACKAGE OPTION ADDENDUM  
www.ti.com  
3-Aug-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
3606BG  
NRND  
CDIP  
JNC  
32  
TBD  
Call TI  
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Applications  
Audio  
Automotive  
Broadband  
Digital Control  
Medical  
Military  
Optical Networking  
Security  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
www.ti.com/audio  
Data Converters  
DLP® Products  
DSP  
Clocks and Timers  
Interface  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/medical  
www.ti.com/military  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
dsp.ti.com  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
power.ti.com  
microcontroller.ti.com  
www.ti-rfid.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
Telephony  
Video & Imaging  
Wireless  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2009, Texas Instruments Incorporated  
配单直通车
3606BG产品参数
型号:3606BG
是否Rohs认证: 不符合
生命周期:Transferred
IHS 制造商:BURR-BROWN CORP
Reach Compliance Code:unknown
风险等级:5.61
Is Samacsys:N
放大器类型:INSTRUMENTATION AMPLIFIER
最大平均偏置电流 (IIB):0.02 µA
标称带宽 (3dB):0.1 MHz
最小共模抑制比:90 dB
最大输入失调电压:2020 µV
JESD-30 代码:R-CDIP-P32
JESD-609代码:e0
标称负供电电压 (Vsup):-15 V
最大非线性:0.01%
功能数量:1
端子数量:32
最高工作温度:85 °C
最低工作温度:-25 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DIP
封装等效代码:DIP32,.9
封装形状:RECTANGULAR
封装形式:IN-LINE
电源:5,+-15 V
认证状态:Not Qualified
标称压摆率:0.5 V/us
子类别:Instrumentation Amplifiers
标称供电电压 (Vsup):15 V
表面贴装:NO
技术:HYBRID
温度等级:OTHER
端子面层:Tin/Lead (Sn/Pb)
端子形式:PIN/PEG
端子节距:2.54 mm
端子位置:DUAL
最大电压增益:1024
最小电压增益:1
Base Number Matches:1
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