Features
■ RoHS compliant*
■ Recommended for rosin flux and solvent
clean or no clean flux processes
■ Medium profile offers increased power
handling
■ Wide assortment of pin packages enhances
design flexibility
■ Marking on contrasting background for
permanent identification
■ Ammo-pak packaging available
4600M Series - Thick Film Conformal SIPs
Package Power Temp. Derating Curve
Product Characteristics
Product Dimensions
6.35
(.250)
Resistance Range
A
MAX.
MAXIMUM
.................... 10 ohms to 10 megohms
Maximum Operating Voltage.........100 V
Temperature Coefficient of Resistance
50 Ω to 2.2 megohms.....±100 ppm/°C
below 50 Ω.....................±250 ppm/°C
above 2.2 megohms.......±250 ppm/°C
TCR Tracking.........................50 ppm/°C
maximum; equal values
3.50
3.00
PIN #1
REF.
MAX. 1.24
2.50
3.3 +0.5/-0.3
(.130 +.020/ -.012)
BOTH ENDS (.049)
.508 ± .050
(.020 ± .002)
4614M
TYP.
2.00
4612M
Resistor Tolerance............... See circuits
Insulation Resistance
2.54 ± .07
4610M
1.50
(.100 ± .003*)
TYP.
Pin
A Maximum
Count mm (Inches)
................ 10,000 megohms minimum
Dielectric Withstanding Voltage
...........................................200 VRMS
Operating Temperature
4608M
NON-ACCUM.
4606M
1.00
.50
4
5
10.11 (.398)
12.65 (.498)
15.19 (.598)
17.73 (.698)
20.27 (.798)
22.81 (.898)
25.35 (.998)
27.89 (1.098)
30.43 (1.198)
32.97 (1.298)
35.51 (1.398)
4604M
6
2.49
(.098)
MAX.
7
................................-55 °C to +125 °C
8
9
10
11
12
13
14
Environmental Characteristics
0
25
70
AMBIENT TEMPERATURE ( C )
125
°
TESTS PER MIL-STD-202...... ∆R MAX.
Short Time Overload..................±0.25 %
Load Life....................................±2.00 %
Moisture Resistance..................±0.50 %
Resistance to Soldering Heat
...............................................±0.50 %
Terminal Strength ......................±0.25 %
Thermal Shock ..........................±0.25 %
.254 ± .050
(.010 ± .002)
TYP.
Package Power Ratings (Watts)
Maximum package length is equal to 2.54mm (.100") times the
number of pins, less .005mm (.002").
Ambient
Temp.
70 °C
0.60
0.75
0.90
1.05
1.20
1.35
Ambient
Temp.
70 °C
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
Pkg.
Pkg.
4604M
4605M
4606M
4607M
4608M
4609M
4610M
4611M
4612M
4613M
4614M
1.50
1.65
1.80
1.95
2.10
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
Physical Characteristics
Flammability ........ Conforms to UL94V-0
Body Material....................... Epoxy resin
Standard Packaging
For Standard Values Used in
Capacitors, Inductors, and Resistors,
click here.
.................. Bulk, Ammo-pak available
How To Order
Typical Part Marking
Represents total content. Layout may
vary.
46 06 M - 101 - 222 __ LF
Model
(46 = Conformal
SIP)
Number of Pins
Physical Configuration
(M = Thick Film Medium
Profile)
Part Number
Part Number
6M-1-RC
4606M-101-RC
4608M-102-RC
4610M-104-RC/RC
8M-2-RC
10M-4-RC/RC
Electrical Configuration
• 101 = Bussed
• 102 = Isolated
RC = ohmic value, 3-digit resistance
code.
• 104 = Dual Terminator
• AP1 = Bussed Ammo**
• AP2 = Isolated Ammo**
• AP4 = Dual Ammo**
CIRCUIT
NUMBER OF PINS
RESISTANCE
6M-2-222
YYWW
CODE
DATE CODE
PIN ONE
INDICATOR
Resistance Code
• First 2 digits are significant
• Third digit represents the
number of zeros to follow.
MANUFACTURER'S
TRADEMARK
Resistance Tolerance
• Blank = ±2 % (see “Resistance Tolerance”
on next page for resistance range)
• F = ±1 % (100 ohms - 5 megohms)
Terminations
• All electrical configurations EXCEPT 104 & AP4:
LF = Sn/Ag/Cu-plated (RoHS compliant)
• ONLY electrical configurations 104 & AP4:
L = Sn/Ag/Cu-plated (RoHS compliant)
Consult factory for other available options.
**Available for packages with 10 pins or less.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary
in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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