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产品型号5002的概述

芯片5002的概述芯片5002是一款广泛应用于电子设备中的集成电路，以其出色的性能和稳定性而受到各界的青睐。作为一种高集成度的电子元件，5002芯片通常用于数据处理、信号传输和控制系统等领域，其多样化的应用场景使其成为电子工程师设计电路时的重要选择。芯片的规格和功能使其能够满足现代电子设备日益增长的需求，包括但不限于通讯、消费电子以及工业自动化等行业。芯片5002的详细参数芯片5002的技术参数包括： - 工作电压: 3.3V至5V，这一电压范围使其适用于多种应用场景。 - 功耗: 在工作状态下，功耗通常不超过100mW，这使得其在低功耗设备中表现优越。 - 工作温度范围: -40°C至85°C，保证了其在各种环境条件下的可靠性。 - 存储器: 可选的内置存储容量，从256KB到2MB不等，以适应不同的数据处理需求。 - 接口类型: 该芯片支持多种接口，包括I2C、SPI和UAR...

产品型号5002的Datasheet PDF文件预览

User's Guide

SLOU310–September 2011

TPA2025D1 Audio Power Amplifier Evaluation Module

This document describes the operation of the TPA2025D1 evaluation module that users may use to

evaluate the TPA2025D1 Audio Power Amplifier. Included are the TPA2025D1EVM schematic, board art,

and bill of materials.

Contents

Introduction .................................................................................................................. 1

1.1

1.2

Description .......................................................................................................... 1

TPA2025D1 Specifications ....................................................................................... 2

Operation ..................................................................................................................... 2

2.1

2.2

2.3

Quick-Start List for Stand-Alone Operation ..................................................................... 2

Boost Settings ...................................................................................................... 3

Power Up ............................................................................................................ 4

Reference .................................................................................................................... 5

3.1

3.2

3.3

TPA2025D1EVM Schematic ...................................................................................... 5

TPA2025D1EVM PCB Layers .................................................................................... 6

TPA2025D1EVM Bill of Materials ................................................................................ 9

List of Figures

TPA2025D1EVM Schematic...............................................................................................

EVM Assembly Layer.......................................................................................................

EVM Top Layer..............................................................................................................

EVM Layer 2.................................................................................................................

EVM Layer 3.................................................................................................................

EVM Bottom Layer..........................................................................................................

List of Tables

TPA2025D1EVM Bill of Materials.........................................................................................

Introduction

This section provides an overview of the Texas Instruments (TI) TPA2025D1 audio power amplifier

evaluation module (EVM). It includes a brief description of the module and a list of specifications.

1.1 Description

The TPA2025D1 is a high-efficiency, class-D, audio power amplifier and an integrated boost converter. It

drives up to 2 W into a 4-Ω speaker from low supply voltages.

The TPA2025D1 audio power amplifier EVM is a complete, stand-alone audio amplifier. It contains the

TPA2025D1 WCSP (YZG) Class-D audio power amplifier with an integrated boost converter. All

components and the EVM are Pb-Free.

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1.2 TPA2025D1 Specifications

V_BAT

I_DD

P_O

V_I

Supply voltage range

2.5 V to 5.2 V

Supply current

3 A Maximum

2 W

Continuous output power per channel, 4 Ω, V_BAT= 3.6 V

Audio input voltage

0 V to V_BAT

4 Ω

R_L

Minimum load impedance

Operation

This section describes how to operate the TPA2025D1EVM.

2.1 Quick-Start List for Stand-Alone Operation

Use the following steps when operating the TPA2025D1EVM as a stand-alone or when connecting the

EVM into existing circuits or equipment.

2.1.1

2.1.2

Power and Ground

1. Ensure the external power sources are set to OFF.

2. Set the power supply voltage between 2.3 V and 5.2 V. When connecting the power supply to the

EVM, attach the power supply ground connection to the GND connector first, and then connect the

positive supply to the VDD connector. Verify that correct connections are made to the banana jacks.

Audio

1. Ensure that the audio source is set to the minimum level.

2. Connect the audio source to the input RCA jack IN. In case of differential audio input, ensure that the

jumper, JP SE, is not inserted. In case of a single-ended audio input, ensure that the jumper, JP SE, is

inserted, thereby grounding IN+ through the input capacitor C2.

3. Connect a speaker (4 Ω to 32 Ω) to the output banana jacks, OUT+ and OUT–.

4. FLT Out+ and FLT OUT- test points allow the user to connect the outputs of the amplfier through an

RC filter for audio measurements. (Many audio analyzers will not give the correct readings on a

Class-D amplifier without additional filtering.) Note that the user must provide the necessary resistors,

R7 and R8 to complete the filters. The typical value for R7 and R8 is 1.0 kΩ.

5. The filtered output of the TPA2025D1 can be measured between test points FILT OUT– and FILT

OUT+

2.1.3

AGC Control

The TPA2025D1 has three selectable inflection point settings: 3.25 V, 3.55 V, and 3.75 V.

1. Remove the jumper, AGC, to select the 3.25-V inflection point (AGC1).

2. Install the jumper, AGC, between pins 2 and 3 to select the 3.55-V inflection point (AGC2).

3. Install the jumper, AGC, between pins 1 and 2 to select the 3.75-V inflection point (AGC3).

2.1.4

2.1.5

Amplifier Gain

The TPA2025D1 has a fixed setting of 20 dB.

Shutdown Controls

1. The TPA2025D1 provides shutdown control for the Class-D amplifier and the boost converter. The EN

pin enables the boost converter and Class-D amplifier. It is active high.

2. Press and hold pushbutton S1 to place the boost converter and the Class-D amplifier in shutdown.

Release pushbutton S1 to activate the Class-D amplifier and boost converter. The boost converter only

turns on if an audio signal (> 2 V_PEAK) is present at one of the outputs (OUT+ or OUT-).

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Operation

NOTE: The TPA2025D1 has an auto pass-through mode. Under normal operation (EN = HIGH), the

boost converter automatically turns off if no audio signal is present at one of the inputs (IN+

or IN-).

2.2 Boost Settings

The default voltage for the boost converter is 5.9 V (unloaded) and cannot be changed. If no audio signal

is present, the boost converter is automatically disabled. Once the audio signal is present at IN+ and IN-,

the boost converter enables automatically, when the output signal exceeds 2 V_PEAK

2.2.1

Boost Terms

The following is a list of terms and definitions:

C_MIN

Minimum boost capacitance required for a given ripple voltage on PVOUT (PVDD)

Boost inductor

f_boost

Switching frequency of the boost converter

I_PVDD

Current pulled by the class-D amplifier from the boost converter

Current through the boost inductor.

I_PVDD

I_L

PVDD (PVOUT)

Supply voltage for the class-D amplifier (Voltage generated by the boost converter

output)

VBAT (VDD)

Supply voltage to the TPA2025D1 (Supply voltage to the EVM).

Ripple current through the inductor.

ΔI_L

ΔV

Ripple voltage on PVOUT (PVDD) due to capacitance

2.2.2

Changing the Boost Inductor

Working inductance decreases as inductor current increases. If the drop in working inductance is severe

enough, it may cause the boost converter to become unstable, or cause the TPA2025D1 to reach its

current limit at a lower output power than expected. Inductor vendors specify currents at which inductor

values decrease by a specific percentage. This can vary by 10% to 35%. Inductance is also affected by dc

current and temperature.

Inductor current rating is determined by the requirements of the load. The inductance is determined by two

factors: the minimum value required for stability and the maximum ripple current permitted in the

application.

Use Equation 1 to determine the required current rating. Equation 1 shows the approximate relationship

between the average inductor current, I_L, to the load current, load voltage, and input voltage (I_PVDD

PVOUT, and VBAT, respectively.) Insert I_PVDD, PVDD, and VBAT into Equation 1 to solve for I_L. The

inductor must maintain at least 90% of its initial inductance value at this current.

PVDD

I_L= I_PVDD

VBAT ´ 0.8

(1)

The minimum working inductance is 1.3 μH. A lower value may cause instability.

Ripple current, ΔI_L, is peak-to-peak variation in inductor current. Smaller ripple current reduces core losses

in the inductor as well as the potential for EMI. Use Equation 2 to determine the value of the inductor, L.

Equation 2 shows the relationships among inductance L, VBAT, PVDD, the switching frequency, f_boost, and

ΔI_L. Insert the maximum acceptable ripple current into Equation 2 to solve for L.

VBAT ´ (PVDD - VBAT)

L =

ΔI_L´ f_BOOST´ PVDD

(2)

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ΔI_Lis inversely proportional to L. Minimize ΔI_Las much as is necessary for a specific application. Increase

the inductance to reduce the ripple current. Note that making the inductance too large prevents the boost

converter from responding to fast load changes properly. Typical inductor values for the TPA2025D1 are

2.2 μH to 4.7 μH.

Select an inductor with a small dc resistance, DCR. DCR reduces the output power due to the voltage

drop across the inductor.

2.2.3

Changing the Boost Capacitor

The value of the boost capacitor is determined by the minimum value of working capacitance required for

stability and the maximum voltage ripple allowed on PVOUT in the application. The minimum value of

working capacitance is 4.7 μF. Do not use any component with a working capacitance less than 4.7 μF.

Working capacitance is defined as the rated capacitance reduced by the DC Bias factor, temperature, and

aging parameters of the capacitor being used. It may be necessary to request these parameters from the

capacitor manufacturer. For best performance, only consider ceramic capacitors with X5R or X7R

dielectric.

For X5R or X7R ceramic capacitors, Equation 3 shows the relationships among the boost capacitance, C,

to load current, load voltage, ripple voltage, input voltage, and switching frequency (I_PVOUT, PVOUT, ΔV,

VDD, f_boostrespectively). Insert the maximum allowed ripple voltage into Equation 3 to solve for C. A factor

of about 1.5 is included to account for capacitance loss due to dc voltage and temperature.

´ (PVDD - VBAT)

PVDD

C = 1.5 ´

DV ´ f

´ PVDD

BOOST

(3)

For aluminum or tantalum capacitors, Equation 4 shows the relationships among the boost capacitance,

C, to load current, load voltage, ripple voltage, input voltage, and switching frequency (I_PVOUT, PVOUT, ΔV,

VDD, f_boostrespectively). Insert the maximum allowed ripple voltage into Equation 4 to solve for C. Solve

this equation assuming ESR is zero.

´ (PVDD - VBAT)

PVDD

C =

DV ´ f

´ PVDD

BOOST

(4)

Capacitance of aluminum and tantalum capacitors is normally insensitive to applied voltage, so no factor

of 1.5 is included in Equation 4. However, the ESR in aluminum and tantalum capacitors can be

significant. Choose an aluminum or tantalum capacitor with an ESR around 30 mΩ. For best performance

with tantalum capacitors, use at least a 10-V rating. Note that tantalum capacitors must generally be used

at voltages of half their ratings or less.

2.3 Power Up

1. Verify that the correct connections are as described in Section 2.1.

2. Verify that the voltage setting of the power supply is between 2.5 V and 5.2 V, and turn on the power

supply. Proper operation of the EVM begins.

3. Adjust the audio signal source as needed.

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Reference

This section includes the EVM schematic, board layout reference, and parts list.

3.1 TPA2025D1EVM Schematic

Vdd

VDD

Vdd

GND

2.2uH

GND

C11

0.1ufd/16V

10ufd/10V

DNP

FLT OUT+

TP1 GND

GND

22ufd/10V

C12

1.0ufd/10V

DNP

GND

0.1ufd/16V

4700pfd/50V

1.00K

GND

DNP

6.8V

GND

FB1

R100

1.0ufd/10V

OUT+

GND

MPZ2012S101A

0.0

JP SE

100ohms/4A

IN+

OUT+

1000pfd/50V

TPA2025D1YZG

AGC

DNP

GND

OUT-

GND

1000pfd/50V

FB2

R101

OUT-

MPZ2012S101A

0.0

GND

TP2 GND

100ohms/4A

TVS1

DNP

TVS2

DNP

FLT OUT-

GND

DNP

Vdd

C10

GND

4700pfd/50V

100K

GND

STANDOFF HARDWARE

0.5in

GND GND GND GND

0.5in

0.5in 0.5in 0.5in

Figure 1. TPA2025D1EVM Schematic

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3.2 TPA2025D1EVM PCB Layers

Figure 2. EVM Assembly Layer

Spacer

Figure 3. EVM Top Layer

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Reference

Figure 4. EVM Layer 2

Spacer

Figure 5. EVM Layer 3

SLOU310–September 2011

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Figure 6. EVM Bottom Layer

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Reference

3.3 TPA2025D1EVM Bill of Materials

Table 1. TPA2025D1EVM Bill of Materials

REF

DESIGNATORS

ITEM MANU PARTNUM

QTY

VENDOR PARTNUM DESCRIPTION

VENDOR

MANUFACTURER

TEXAS

INSTRUMENTS

TEXAS

INSTRUMENTS

TPA2025D1YZG

Audio Power Amplifier

SEMICONDUCTORS

TRANSIENT VOLTAGE SUPPRESSION

BIDIR 6.1V 9A SOD-882 ROHS

ESDALC6V1-1BT2

(0) DNP

TVS1,TVS2

ESDALC6V1-1BT2

MOUSER

MICROELECTRONI

CAPACITORS

CAP SMD0603 CERM 1000PFD 50V 5%

COG ROHS

C1608C0G1H102J

ECJ-1VB1H472K

C7,C8

C9,C10

445-1293-1

PCC1780CT

490-3905-1

587-1958-1

PCC1762CT

490-3893-1

DIGI-KEY

TDK CORP.

PANASONIC

MURATA

CAP SMD0603 CERM 4700PFD 50V 10%

X7R ROHS

CAP SMD0805 CERM 10UFD 10V10% X7R

ROHS

GRM21BR71A106KE51L

LMK212BJ226MG-T

ECJ-1VB1C104K

CAP SMD0805 CERM 22UFD 10V 20% X5R

ROHS

TAIYO YUDEN

PANASONIC

MURATA

CAP SMD0603 CERM 0.1UFD 16V 10% X7R

ROHS

C11,C12

C1,C2

CAP SMD0603 CERM 1.0UFD 10V 10% X5R

ROHS

GRM185R61A105KE36D

RESISTORS

P100KGCT

RESISTOR SMD0603 100K OHM 5% THICK

FILM 1/10W ROHS

ERJ-3GEYJ104V

RC0603FR-071KL

ERJ-3GEY0R00V

DIGI-KEY

PANASONIC

YAGEO

RESISTOR SMD0603 THICK FILM 1.00K

OHM 1% 1/10W ROHS

311-1.00KHRCT

P0.0GCT

RESISTOR SMD0603 0.0 OHM 5% THICK

FILM 1/10W ROHS

R100,R101

PANASONIC

INDUCTORS

INDUCTOR POWER SMD1008 2.2uH

RDC=80mOHMS 2.3A DFE252012C ROHS

1239AS-H-2R2N=P2

MMSZ5235BT1

1239AS-H-2R2N=P2

TOKO JAPAN

DIGI-KEY

TOKO JAPAN

TDK

(0) DNP

ZENER DIODE,6.8V,SMT SOD-123

FERRITE BEAD, 100 Ohms 4A 100MHz

SM0805 ROHS

MPZ2012S101A

FB1,FB2

445-1567-1

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Table 1. TPA2025D1EVM Bill of Materials (continued)

REF

DESIGNATORS

ITEM MANU PARTNUM

QTY

VENDOR PARTNUM DESCRIPTION

VENDOR

MANUFACTURER

HEADERS, JACKS, AND SHUNTS

26630301RP2

AGC

2663S-03

HEADER 3 PIN, PCB 2.0MM ROHS

HEADER 2 PIN, PCB 2.0MM ROHS

JACK, RCA 3-PIN PCB-RA BLACK ROHS

SHUNT, BLACK AU FLASH 2 MM ROHS

DIGI-KEY

NEWARK

DIGI-KEY

NORCOMP

SWITCHCRAFT

NORCOMP

26630201RP2

JP SE

2663S-02

65K7770

SP2-001E

PJRAN1X1U01X

810-002-SP2L001

JP SE, AGC⁽¹⁾

TESTPOINTS AND SWITCHES

KEYSTONE

ELECTRONICS

5002

5001

5000

FLT OUT-

5002K

PC TESTPOINT, WHITE, ROHS

PC TESTPOINT, BLACK, ROHS

PC TESTPOINT, RED, ROHS

DIGI-KEY

KEYSTONE

ELECTRONICS

TP1 GND,TP2 GND 5001K

KEYSTONE

ELECTRONICS

FLT OUT+

5000K

STANDOFFS AND HARDWARE

TL1015AF160QG

2027

EG4344CT

SWITCH, MOM, 160G SMT 4X3MM ROHS

DIGI-KEY

E-SWITCH

STANDOFF,4-40,0.5INx3/16IN,ALUM RND

F-F

KEYSTONE

ELECTRONICS

SO1,SO2,SO3,SO4

2027K

GND, VDD, OUT+,

OUT-

111-2223-001

J587

BINDING-POST,NONINS,THRU,ROHS

DIGI-KEY

EMERSON NPCS

COMPONENTS NOT ASSEMBLED

R0603_DNP

C0603_DNP

R7, R8

C4, C6

(1)

Place Shunts Only On Pin2 of JP SE and on Pin3 of AGC

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Evaluation Board/Kit Important Notice

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION

PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the

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Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30

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It is important to operate this EVM within the input voltage range of –0.3 V to 6 V and the output voltage range of –0.3 V to VDD

+0.3 V .

Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are

questions concerning the input range, please contact a TI field representative prior to connecting the input power.

Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the

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specification, please contact a TI field representative.

During normal operation, some circuit components may have case temperatures greater than 85°C. The EVM is designed to

operate properly with certain components above 85°C as long as the input and output ranges are maintained. These components

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devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near

these devices during operation, please be aware that these devices may be very warm to the touch.

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power.ti.com

microcontroller.ti.com

www.ti-rfid.com

Video and Imaging

www.ti.com/video

OMAP Mobile Processors www.ti.com/omap

Wireless Connctivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page

e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

配单直通车

柒号芯城电子商务（深圳）有限公司服务专线: 0755-83209937 在线联系:

QQ：2881677436 复制

QQ：2881620402 复制

深圳市中利达电子科技有限公司服务专线: 0755-83200645/13686833545 在线联系:

QQ：1902134819 复制

QQ：2881689472 复制

深圳市芯福林电子有限公司服务专线: 13418564337 在线联系:

QQ：2881495808 复制

QQ：308365177 复制

首天国际（深圳）科技有限公司服务专线: 0755-82807802/82807803 在线联系:

QQ：528164397 复制

QQ：1318502189 复制

北京元坤伟业科技有限公司服务专线: 010-62104931621064316210489162104791 在线联系:

QQ：857273081 复制

QQ：1594462451 复制

5002产品参数

型号:	5002
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	KEYSTONE ELECTRONICS CORP
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8536.69.40.40
风险等级：	0.6
连接器类型：	INTERCONNECTION DEVICE
联系完成终止：	Silver (Ag)
JESD-609代码：	e4
Base Number Matches：	1

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