5962-8974701CA全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

SN54HCT04, SN74HCT04

HEX INVERTERS

SCLS042D – JULY 1986 – REVISED JULY 2003

Operating Voltage Range of 4.5 V to 5.5 V

Outputs Can Drive Up To 10 LSTTL Loads

Typical t = 13 ns

pd

±4-mA Output Drive at 5 V

Low Power Consumption, 20-µA Max I

Low Input Current of 1 µA Max

CC

Inputs Are TTL-Voltage Compatible

SN54HCT04 . . . J PACKAGE

SN74HCT04 . . . D, N, NS, OR PW PACKAGE

(TOP VIEW)

SN54HCT04 . . . FK PACKAGE

(TOP VIEW)

14

13

12

11

10

9

1A

1Y

V

CC

1

2

3

4

5

6

7

3

2

1

20 19

18

6A

6Y

5A

5Y

4A

4Y

6Y

NC

5A

2A

NC

2Y

4

5

6

7

8

2A

17

16

2Y

3A

15 NC

14

9 10 11 12 13

NC

3A

3Y

5Y

8

GND

NC – No internal connection

description/ordering information

These devices contain six independent inverters. They perform the Boolean function Y = A in positive logic.

ORDERING INFORMATION

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

†

PACKAGE

T

A

PDIP – N

Tube of 25

Tube of 50

Reel of 2500

Reel of 250

Reel of 2000

Tube of 90

Reel of 2000

Reel of 250

Tube of 25

Tube of 55

SN74HCT04N

SN74HCT04D

SOIC – D

SN74HCT04DR

SN74HCT04DT

SN74HCT04NSR

SN74HCT04PW

SN74HCT04PWR

SN74HCT04PWT

SNJ54HCT04J

SNJ54HCT04FK

HCT04

–40°C to 85°C

SOP – NS

TSSOP – PW

HCT04

HT04

CDIP – J

SNJ54HCT04J

–55°C to 125°C

LCCC – FK

SNJ54HCT04FK

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

FUNCTION TABLE

(each inverter)

INPUT

A

OUTPUT

Y

H

L

H

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

On products compliant to MIL-PRF-38535, all parameters are tested

unless otherwise noted. On all other products, production

processing does not necessarily include testing of all parameters.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

1

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54HCT04, SN74HCT04

HEX INVERTERS

SCLS042D – JULY 1986 – REVISED JULY 2003

logic diagram (positive logic)

A

Y

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V

CC

I

Input clamp current, I (V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA

IK

I

CC

Output clamp current, I

(V < 0 or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA

OK

O O CC

Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA

Continuous current through V

Package thermal impedance, θ (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W

O

CC

or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA

JA

N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W

NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W

PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C

stg

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions (see Note 3)

SN54HCT04

MIN NOM

SN74HCT04

MIN NOM

UNIT

MAX

V

Supply voltage

4.5

2

5

5.5

4.5

2

5

5.5

V

CC

IH

IL

I

High-level input voltage

Low-level input voltage

Input voltage

V

= 4.5 V to 5.5 V

CC

0.8

V

CC

0

V

0

V

CC

Output voltage

V

O

CC

∆t/∆v

Input transition rise/fall time

Operating free-air temperature

500

125

500

85

ns

°C

T

A

–55

–40

NOTE 3: All unused inputs of the device must be held at V

or GND to ensure proper device operation. Refer to the TI application report,

CC

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

2

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54HCT04, SN74HCT04

HEX INVERTERS

SCLS042D – JULY 1986 – REVISED JULY 2003

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

T

= 25°C

SN54HCT04

SN74HCT04

A

PARAMETER

TEST CONDITIONS

V

UNIT

V

CC

MIN

TYP

MAX

MIN

4.4

MAX

MIN

4.4

MAX

I

= –20 µA

= –4 mA

= 20 µA

= 4 mA

4.4 4.499

OH

OL

V

V = V or V

IH

4.5 V

OH

OL

I

IL

3.98

4.3

0.001

0.17

3.7

3.84

0.1

0.26

±100

2

0.1

0.4

0.1

0.33

V

V = V or V

V

I

IH

IL

I

V = V

I

or 0

5.5 V

±0.1

±1000

40

±1000

20

nA

I

CC

V = V

I

or 0,

I

O

= 0

µA

CC

One input at 0.5 V or 2.4 V,

Other inputs at 0 or V

†

5.5 V

1.4

3

2.4

10

3

2.9

10

mA

pF

∆I

CC

4.5 V

to 5.5 V

C

10

i

†

This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or V

CC

.

switching characteristics over recommended operating free-air temperature range, C = 50 pF

L

(unless otherwise noted) (see Figure 1)

T

A

= 25°C

TYP

14

SN54HCT04

SN74HCT04

FROM

(INPUT)

TO

(OUTPUT)

PARAMETER

V

UNIT

ns

CC

MIN

MAX

20

MIN

MAX

30

MIN

MAX

25

4.5 V

5.5 V

4.5 V

5.5 V

t

A

Y

pd

13

18

27

23

9

15

22

19

ns

t

8

14

20

17

operating characteristics, T = 25°C

A

PARAMETER

Power dissipation capacitance per inverter

TEST CONDITIONS

TYP

UNIT

C

No load

20

pF

pd

3

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

SN54HCT04, SN74HCT04

HEX INVERTERS

SCLS042D – JULY 1986 – REVISED JULY 2003

PARAMETER MEASUREMENT INFORMATION

3 V

0 V

From Output

Under Test

Test

Point

Input

1.3 V

C

= 50 pF

L

t

PLH

PHL

90%

(see Note A)

V

OH

In-Phase

Output

90%

t

1.3 V

10%

1.3 V

10%

LOAD CIRCUIT

OL

t

r

f

t

PLH

PHL

90%

3 V

0 V

V

OH

2.7 V

Input

1.3 V

0.3 V

1.3 V

0.3 V

90%

t

Out-of-Phase

Output

1.3 V

10%

1.3 V

10%

OL

t

r

f

r

VOLTAGE WAVEFORM

INPUT RISE AND FALL TIMES

VOLTAGE WAVEFORMS

PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES

NOTES: A.

B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following

characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 6 ns, t = 6 ns.

C includes probe and test-fixture capacitance.

L

O

r

f

C. The outputs are measured one at a time with one input transition per measurement.

D. and t are the same as t

t

.

pd

PLH

PHL

Figure 1. Load Circuit and Voltage Waveforms

4

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

LCCC

CDIP

CFP

Drawing

5962-89747012A

5962-8974701CA

5962-8974701VCA

5962-8974701VDA

JM38510/65751BCA

SN54HCT04J

ACTIVE

FK

J

20

14

1

None

Call TI

Level-NC-NC-NC

Call TI

J

W

J

CDIP

J

SN74HCT04APWLE

SN74HCT04D

OBSOLETE TSSOP

PW

D

ACTIVE

SOIC

PDIP

SO

50

2500

250

25

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

SN74HCT04DR

SN74HCT04DT

SN74HCT04N

D

14

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

N

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

SN74HCT04NSR

SN74HCT04PW

NS

PW

2000

90

Pb-Free

(RoHS)

CU NIPDAU Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

TSSOP

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

SN74HCT04PWLE

SN74HCT04PWR

OBSOLETE TSSOP

PW

14

None

Call TI

ACTIVE

TSSOP

2000

250

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

SN74HCT04PWT

ACTIVE

TSSOP

PW

14

Pb-Free

(RoHS)

CU NIPDAU Level-1-250C-UNLIM

SNJ54HCT04FK

SNJ54HCT04J

ACTIVE

LCCC

CDIP

FK

J

20

14

1

None

Call TI

Level-NC-NC-NC

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MLCC006B – OCTOBER 1996

FK (S-CQCC-N**)

LEADLESS CERAMIC CHIP CARRIER

28 TERMINAL SHOWN

A

B

NO. OF

TERMINALS

**

18 17 16 15 14 13 12

MIN

MAX

MIN

MAX

0.342

(8,69)

0.358

(9,09)

0.307

(7,80)

0.358

(9,09)

19

20

11

10

9

20

28

44

52

68

84

0.442

(11,23)

0.458

(11,63)

0.406

(10,31)

0.458

(11,63)

21

B SQ

22

0.640

(16,26)

0.660

(16,76)

0.495

(12,58)

0.560

(14,22)

8

A SQ

23

0.739

(18,78)

0.761

(19,32)

0.495

(12,58)

0.560

(14,22)

7

24

25

6

0.938

(23,83)

0.962

(24,43)

0.850

(21,6)

0.858

(21,8)

5

1.141

(28,99)

1.165

(29,59)

1.047

(26,6)

1.063

(27,0)

26 27 28

1

2

3

4

0.080 (2,03)

0.064 (1,63)

0.020 (0,51)

0.010 (0,25)

0.020 (0,51)

0.010 (0,25)

0.055 (1,40)

0.045 (1,14)

0.035 (0,89)

0.045 (1,14)

0.035 (0,89)

0.028 (0,71)

0.022 (0,54)

0.050 (1,27)

4040140/D 10/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a metal lid.

D. The terminals are gold plated.

E. Falls within JEDEC MS-004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

M

0,10

0,65

14

8

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

1

7

0°–8°

A

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

8

14

16

20

24

28

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for

such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

product or service voids all express and any implied warranties for the associated TI product or service and

is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

Audio

Amplifiers

amplifier.ti.com

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DSP

dsp.ti.com

Broadband

Digital Control

Military

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Interface

Logic

interface.ti.com

logic.ti.com

Power Mgmt

Microcontrollers

power.ti.com

Optical Networking

Security

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

microcontroller.ti.com

Telephony

Video & Imaging

Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265

型号:	5962-8974701CA
是否Rohs认证：	不符合
生命周期：	Obsolete
IHS 制造商：	INTERSIL CORP
零件包装代码：	DIP
包装说明：	CERAMIC, DIP-14
针数：	14
Reach Compliance Code：	not_compliant
HTS代码：	8542.39.00.01
风险等级：	5.12
Is Samacsys：	N
系列：	HCT
JESD-30 代码：	R-GDIP-T14
JESD-609代码：	e0
负载电容（CL）：	50 pF
逻辑集成电路类型：	INVERTER
最大I（ol）：	0.004 A
功能数量：	6
输入次数：	1
端子数量：	14
最高工作温度：	125 °C
最低工作温度：	-55 °C
封装主体材料：	CERAMIC, GLASS-SEALED
封装代码：	DIP
封装等效代码：	DIP14,.3
封装形状：	RECTANGULAR
封装形式：	IN-LINE
峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	5 V
Prop。Delay @ Nom-Sup：	30 ns
传播延迟（tpd）：	30 ns
认证状态：	Not Qualified
施密特触发器：	NO
筛选级别：	MIL-STD-883
座面最大高度：	5.08 mm
子类别：	Gates
最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	4.5 V
标称供电电压 (Vsup)：	5 V
表面贴装：	NO
技术：	CMOS
温度等级：	MILITARY
端子面层：	Tin/Lead (Sn/Pb) - hot dipped
端子形式：	THROUGH-HOLE
端子节距：	2.54 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	7.62 mm
Base Number Matches：	1

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