欢迎访问ic37.com |
会员登录 免费注册
发布采购
所在地: 型号: 精确
  • 批量询价
  •  
  • 供应商
  • 型号
  • 数量
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
  •  
  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • 5962-9453001VEA
  • 数量-
  • 厂家-
  • 封装-
  • 批号-
  • -
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931、62106431、62104891、62104791 QQ:857273081QQ:1594462451
更多
  • 5962-9453001VEA图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • 5962-9453001VEA 现货库存
  • 数量
  • 厂家TI 
  • 封装CDIP (J) 
  • 批号新批次 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:2881512844QQ:2881512844 复制
  • 075584507705 QQ:2881512844
  • 5962-9453001VEA图
  • 深圳市鹏和科技有限公司

     该会员已使用本站16年以上
  • 5962-9453001VEA
  • 数量1878 
  • 厂家TI 
  • 封装CDIP 
  • 批号23+ 
  • 原装正品 代理渠道
  • QQ:3004290789QQ:3004290789 复制
    QQ:3004290786QQ:3004290786 复制
  • 755-83990319 QQ:3004290789QQ:3004290786
  • 5962-9453001VEA图
  • 深圳市珩瑞科技有限公司

     该会员已使用本站2年以上
  • 5962-9453001VEA
  • 数量
  • 厂家21+ 
  • 封装12000 
  • 批号 
  • ███全新原装正品,可配单
  • QQ:2938238007QQ:2938238007 复制
    QQ:1840507767QQ:1840507767 复制
  • -0755-82578309 QQ:2938238007QQ:1840507767
  • 5962-9453001VEA图
  • 万三科技(深圳)有限公司

     该会员已使用本站2年以上
  • 5962-9453001VEA
  • 数量6500000 
  • 厂家TI 
  • 封装原厂原装 
  • 批号22+ 
  • 万三科技 秉承原装 实单可议
  • QQ:3008961396QQ:3008961396 复制
  • 0755-21008751 QQ:3008961396
  • 5962-9453001VEA=UC1856图
  • 麦尔集团

     该会员已使用本站10年以上
  • 5962-9453001VEA=UC1856
  • 数量100 
  • 厂家TI 
  • 封装十五周年庆典 
  • 批号17+ 
  • TI常订型号,特价热卖!可加单
  • QQ:1716771758QQ:1716771758 复制
    QQ:2574148071QQ:2574148071 复制
  • 88266576 QQ:1716771758QQ:2574148071
  • 5962-9453001VEA图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • 5962-9453001VEA
  • 数量
  • 厂家TI 
  • 封装CDIP (J) 
  • 批号新批次 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:2881512844QQ:2881512844 复制
  • 075584507705 QQ:2881512844
  • 5962-9453001VEA图
  • 昂富(深圳)电子科技有限公司

     该会员已使用本站4年以上
  • 5962-9453001VEA
  • 数量87270 
  • 厂家TI/德州仪器 
  • 封装CDIP 
  • 批号23+ 
  • 一站式BOM配单,短缺料找现货,怕受骗,就找昂富电子.
  • QQ:GTY82dX7
  • 0755-23611557【陈妙华 QQ:GTY82dX7
  • 5962-9453001VEA图
  • 深圳市创思克科技有限公司

     该会员已使用本站2年以上
  • 5962-9453001VEA
  • 数量5623 
  • 厂家TI 
  • 封装CDIP (J)16 
  • 批号21+ 
  • 全新原装原厂实力挺实单欢迎来撩
  • QQ:1092793871QQ:1092793871 复制
  • -0755-88910020 QQ:1092793871

产品型号5962-9453001VEA的Datasheet PDF文件预览

PACKAGE OPTION ADDENDUM  
www.ti.com  
5-Dec-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
5962-9453001M2A  
5962-9453001MEA  
UC1856J  
ACTIVE  
ACTIVE  
LCCC  
CDIP  
FK  
J
20  
16  
16  
16  
28  
20  
20  
28  
16  
1
1
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
A42  
Call TI  
Call TI  
ACTIVE  
CDIP  
J
N / A for Pkg Type  
N / A for Pkg Type  
Call TI  
UC1856J883B  
UC1856L  
ACTIVE  
CDIP  
J
A42  
OBSOLETE  
ACTIVE  
TO/SOT  
LCCC  
LCCC  
TO/SOT  
SOIC  
L
Call TI  
UC1856L20  
FK  
FK  
L
1
1
POST-PLATE N / A for Pkg Type  
POST-PLATE N / A for Pkg Type  
UC1856L20883B  
UC1856L883B  
UC2856DW  
ACTIVE  
OBSOLETE  
ACTIVE  
Call TI  
Call TI  
DW  
40  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
UC2856DWG4  
UC2856DWTR  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
DW  
DW  
DW  
16  
16  
16  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
UC2856DWTRG4  
Green (RoHS  
& no Sb/Br)  
UC2856J  
UC2856N  
ACTIVE  
ACTIVE  
CDIP  
PDIP  
J
16  
16  
1
TBD  
A42  
N / A for Pkg Type  
N
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
UC2856NG4  
UC3856DW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
N
16  
16  
16  
16  
16  
16  
16  
25  
40  
Green (RoHS  
& no Sb/Br)  
DW  
DW  
DW  
DW  
N
Green (RoHS  
& no Sb/Br)  
UC3856DWG4  
UC3856DWTR  
UC3856DWTRG4  
UC3856N  
40  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
UC3856NG4  
N
25  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
5-Dec-2011  
Status (1)  
ACTIVE  
ACTIVE  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
UC3856Q  
PLCC  
PLCC  
FN  
FN  
20  
20  
46  
46  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
UC3856QG3  
Green (RoHS  
& no Sb/Br)  
CU SN  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF UC1856, UC2856, UC2856M, UC3856 :  
Catalog: UC3856, UC2856  
Automotive: UC2856-Q1, UC2856-Q1  
Military: UC2856M, UC1856  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
5-Dec-2011  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects  
Military - QML certified for Military and Defense Applications  
Addendum-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
7-Oct-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
UC2856DWTR  
UC3856DWTR  
SOIC  
SOIC  
DW  
DW  
16  
16  
2000  
2000  
330.0  
330.0  
16.4  
16.4  
10.85 10.8  
10.85 10.8  
2.7  
2.7  
12.0  
12.0  
16.0  
16.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
7-Oct-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
UC2856DWTR  
UC3856DWTR  
SOIC  
SOIC  
DW  
DW  
16  
16  
2000  
2000  
346.0  
346.0  
346.0  
346.0  
33.0  
33.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Audio  
Applications  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Medical  
Security  
Logic  
Space, Avionics and Defense www.ti.com/space-avionics-defense  
Transportation and Automotive www.ti.com/automotive  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
microcontroller.ti.com  
www.ti-rfid.com  
Video and Imaging  
www.ti.com/video  
OMAP Mobile Processors www.ti.com/omap  
Wireless Connectivity www.ti.com/wirelessconnectivity  
TI E2E Community Home Page  
e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2011, Texas Instruments Incorporated  
配单直通车
5962-9453001VEA产品参数
型号:5962-9453001VEA
Brand Name:Texas Instruments
生命周期:Active
包装说明:DIP,
Reach Compliance Code:not_compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:6 weeks
风险等级:5.74
其他特性:LG-MAX
模拟集成电路 - 其他类型:SWITCHING CONTROLLER
控制模式:CURRENT-MODE
控制技术:PULSE WIDTH MODULATION
最大输入电压:40 V
最小输入电压:8 V
标称输入电压:15 V
JESD-30 代码:R-GDIP-T16
长度:21.34 mm
功能数量:1
端子数量:16
最高工作温度:125 °C
最低工作温度:-55 °C
最大输出电流:2 A
标称输出电压:5.1 V
封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DIP
封装形状:RECTANGULAR
封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Qualified
筛选级别:MIL-STD-883
座面最大高度:5.08 mm
表面贴装:NO
切换器配置:PUSH-PULL
温度等级:MILITARY
端子形式:THROUGH-HOLE
端子节距:2.54 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mm
Base Number Matches:1
  •  
  • 供货商
  • 型号 *
  • 数量*
  • 厂商
  • 封装
  • 批号
  • 交易说明
  • 询价
批量询价选中的记录已选中0条,每次最多15条。
 复制成功!