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产品型号671M-06ILF的Datasheet PDF文件预览

DATASHEET  
3.3 V ZERO DELAY LOW SKEW BUFFER  
ICS671-06  
Description  
Features  
The ICS671-06 is a low phase noise, high-speed  
PLL-based, 8 output, low skew zero delay buffer. Based on  
ICS’ proprietary low jitter Phase-Locked Loop (PLL)  
techniques, the device provides eight low skew outputs at  
speeds up to 133 MHz at 3.3 V. The outputs can be  
generated from the PLL (for zero delay), or directly from the  
input (for testing), and can be set to tri-state mode or to stop  
at a low level. For normal operation as a zero delay buffer,  
any output clock is tied to the FBIN pin.  
Clock outputs from 10 to 133 MHz  
Zero input-output delay  
Eight low skew (<200 ps) outputs  
Device-to-device skew <700 ps  
Low jitter (<200 ps)  
Full CMOS outputs with 25 mA output drive capability at  
TTL levels  
5 V tolerant FBIN and CLKIN pins  
Tri-state mode for board-level testing  
Advanced, low power, sub-micron CMOS process  
Operating voltage of 3.3 V  
ICS manufactures the largest variety of clock generators  
and buffers and is the largest clock supplier in the world.  
Industrial temperature range available  
Packaged in 16-pin SOIC  
Available in Pb (lead) free package  
Not recommended for new designs. See the  
MK2308-1H for new designs.  
Block Diagram  
VDD  
2
Control  
Logic  
2
S2, S1  
CLKA1  
CLKA2  
CLKA3  
CLKIN  
FBIN  
CLKA4  
1
Clock  
Synthesis  
PLL  
0
CLKB1  
CLKB2  
CLKB3  
CLKB4  
2
Feedback is shown from CLKB4 for  
illustration, but may come from any output.  
GND  
IDT™ / ICS™ 3.3 V ZERO DELAY LOW SKEW BUFFER  
1
ICS671-06  
REV D 050405  
ICS671-06  
3.3 V ZERO DELAY LOW SKEW BUFFER  
ZERO DELAY BUFFER  
Pin Assignment  
CLKIN  
CLKA1  
CLKA2  
VDD  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
FBIN  
CLKA4  
CLKA3  
VDD  
GND  
GND  
CLKB1  
CLKB2  
S2  
CLKB4  
CLKB3  
S1  
16 pin narrow (150 m il) SOIC  
and 16pin (173m il ) TSSOP  
Output Clock Mode Select Table  
S2  
0
S1  
0
CLKA1:A4  
Tri-state (note 1)  
Running  
CLKB1:B4  
Tri-state (note 1)  
Tri-state (note 1)  
Running  
A & B Source  
PLL  
PLL Status  
OFF  
0
1
PLL  
ON  
1
0
Running  
CLKIN (note 2)  
PLL  
OFF  
1
1
Running  
Running  
ON  
Note 1. Outputs are in high impedance state.  
Note 2. Buffer mode only; not zero delay between input and output.  
Pin Descriptions  
Pin  
Pin  
Pin Type  
Pin Description  
Number  
Name  
1
CLKIN  
CLKA1:A4  
VDD  
Input  
Clock input.  
2 - 3, 14 - 15  
Output Clock outputs A1:A4. See table above.  
4
Power  
Power  
Power supply. Connect to 3.3 V.  
Connect to ground.  
5
GND  
6 - 7, 10 - 11  
CLKB1:B4  
S2  
Output Clock outputs B1:B4. See table above.  
8
Input  
Input  
Select input 2. See table above. Internal pull-up.  
Select input 1. See table above. Internal pull-up.  
Connect to ground.  
9
S1  
12  
13  
16  
GND  
Power  
Power  
Input  
VDD  
Power supply. Connect to 3.3 V.  
FBIN  
Feedback input. Connect to any output under normal operation.  
IDT™ / ICS™ 3.3 V ZERO DELAY LOW SKEW BUFFER  
2
ICS671-06  
REV D 050405  
ICS671-06  
3.3 V ZERO DELAY LOW SKEW BUFFER  
ZERO DELAY BUFFER  
External Components  
The ICS671-06 requires a minimum number of external components for proper operation. Decoupling capacitors of  
0.01µF should be connected between VDD and GND on pins 4 and 5, and VDD and GND on pins 13 and 12, as  
close to the device as possible. A series termination resistor of 33may be used to each clock output pin to reduce  
reflections.  
Absolute Maximum Ratings  
Stresses above the ratings listed below can cause permanent damage to the ICS671-06. These ratings, which are  
standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at  
these or any other conditions above those indicated in the operational sections of the specifications is not implied.  
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical  
parameters are guaranteed only over the recommended operating temperature range.  
Item  
Rating  
Supply Voltage, VDD  
All Inputs and Outputs  
CLKIN and FBIN inputs  
Electrostatic Discharge  
7 V  
-0.5 V to VDD+0.5 V  
-0.5 V to 5.5 V  
2000 V  
Ambient Operating Temperature  
Storage Temperature  
-40 to +85° C  
-65 to +150° C  
150°C  
Junction Temperature  
Soldering Temperature  
260°C  
Recommended Operation Conditions  
Parameter  
Min.  
Typ.  
Max.  
+85  
Units  
° C  
Ambient Operating Temperature  
Power Supply Voltage (measured in respect to GND)  
-40  
+3.0  
+3.6  
V
DC Electrical Characteristics  
VDD=3.3 V ±5%, Ambient temperature -40 to +85°C, unless stated otherwis  
Parameter  
Operating Voltage  
Input High Voltage  
Input Low Voltage  
Input Low Current  
Input High Current  
Output High Voltage  
Output Low Voltage  
Symbol  
Conditions  
Min.  
3.0  
2
Typ.  
Max. Units  
VDD  
3.6  
V
V
V
IH  
V
0.8  
50  
V
IL  
I
VIN = 0V  
VIN = VDD  
mA  
uA  
V
IL  
I
100  
IH  
V
I
I
= -12 mA  
= 12 mA  
2.4  
OH  
OH  
OL  
V
0.4  
V
OL  
IDT™ / ICS™ 3.3 V ZERO DELAY LOW SKEW BUFFER  
3
ICS671-06  
REV D 050405  
ICS671-06  
3.3 V ZERO DELAY LOW SKEW BUFFER  
ZERO DELAY BUFFER  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max. Units  
Output High Voltage,  
CMOS level  
V
I
= -12 mA  
VDD-0.4  
V
OH  
OH  
Operating Supply Current  
IDD  
IDD  
No Load, S2 = 1, S1 = 1,  
Note 1  
35  
mA  
Power Down Supply  
Current  
CLKIN = 0, S2 = 0, S1 = 1  
CLKIN = 0, Note 2  
Each output  
12  
12  
±50  
5
µA  
µA  
mA  
pF  
Short Circuit Current  
Input Capacitance  
I
OS  
C
S2, S1, FBIN  
IN  
AC Electrical Characteristics  
VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C, C  
at CLK = 15 pF, unless stated otherwise  
LOAD  
Parameter  
Symbol  
Conditions  
See table on page 2  
See table on page 2  
0.8 to 2.0 V, CL = 30 pF  
2.0 to 0.8 V, CL = 30 pF  
Measured at VDD/2  
Min. Typ. Max. Units  
Input Clock Frequency  
Output Clock Frequency  
Output Rise Time  
f
10  
10  
133  
133  
2.5  
MHz  
MHz  
ns  
IN  
t
OR  
Output Fall Time  
t
2.5  
ns  
OF  
Output Clock Duty Cycle  
Device to Device Skew  
Output to Output Skew  
Input to Output Skew  
t
45  
50  
55  
%
DC  
Rising edges at VDD/2  
Rising edges at VDD/2  
700  
200  
±250  
ps  
ps  
Rising edges at VDD/2, FBIN to  
CLKA4, S1 = 1, S0 = 1, Note 1  
ps  
Maximum Absolute JItter  
Cycle to Cycle Jitter  
130  
200  
200  
200  
100  
1.0  
ps  
ps  
ps  
ps  
ms  
30 pF, measured at 66.67M  
15 pF, measured at 66.67M  
15 pF, measured at 133.33M  
Note 3  
PLL Lock Time  
Note 1: With CLKIN = 100MHz, FBIN to CLKA4, all outputs at 100 MHz.  
Note 2: When there is no clock signal present at CLKIN, the ICS671-06 will enter power down mode. The PLL is  
stopped and the outputs are tri-state.  
Note 3: With VDD at a steady rate and valid clocks at CLKIN and FBIN.  
Thermal Characteristics (16 pin SOIC)  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
θ
Still air  
120  
115  
105  
58  
° C/W  
° C/W  
° C/W  
° C/W  
JA  
θ
1 m/s air flow  
3 m/s air flow  
JA  
θ
JA  
Thermal Resistance Junction to Case  
θ
JC  
IDT™ / ICS™ 3.3 V ZERO DELAY LOW SKEW BUFFER  
4
ICS671-06  
REV D 050405  
ICS671-06  
3.3 V ZERO DELAY LOW SKEW BUFFER  
ZERO DELAY BUFFER  
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
Millimeters  
Inches  
16  
Symbol  
Min  
1.35  
0.10  
0.33  
0.19  
9.80  
3.80  
Max  
1.75  
0.25  
0.51  
0.25  
10.00  
4.00  
Min  
Max  
A
A1  
B
C
D
E
e
.0532  
.0040  
.013  
.0688  
.0098  
.020  
E
H
INDEX  
AREA  
.0075  
.3859  
.1497  
.0098  
.3937  
.1574  
1.27 BASIC  
0.050 BASIC  
1
2
H
h
5.80  
0.25  
0.40  
0°  
6.20  
0.50  
1.27  
8°  
.2284  
.010  
.016  
0°  
.2440  
.020  
.050  
8°  
D
L
α
A
h x 45  
A1  
C
- C -  
e
SEATING  
PLANE  
B
L
.10 (.004)  
C
Ordering Information  
Part / Order Number  
Marking  
Shipping Packaging  
Tubes  
Package  
16-pin SOIC  
16-pin SOIC  
16-pin SOIC  
16-pin SOIC  
Temperature  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
671M-06I  
671M-06IT  
ICS671M-06I  
ICS671M-06I  
ICS671M-06IL  
ICS671M-06IL  
Tape and Reel  
Tubes  
671M-06ILF  
671M-06ILFT  
Tape and Reel  
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no responsibility for  
either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are  
implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range,  
high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to  
change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical  
instruments.  
IDT™ / ICS™ 3.3 V ZERO DELAY LOW SKEW BUFFER  
5
ICS671-06  
REV D 050405  
ICS671-06  
3.3 V ZERO DELAY LOW SKEW BUFFER  
ZERO DELAY BUFFER  
Innovate with IDT and accelerate your future networks. Contact:  
www.IDT.com  
For Sales  
800-345-7015  
408-284-8200  
Fax: 408-284-2775  
For Tech Support  
<product line email>  
<product line phone>  
Corporate Headquarters  
Integrated Device Technology, Inc.  
6024 Silver Creek Valley Road  
San Jose, CA 95138  
Asia Pacific and Japan  
Integrated Device Technology  
Singapore (1997) Pte. Ltd.  
Reg. No. 199707558G  
435 Orchard Road  
Europe  
IDT Europe, Limited  
Prime House  
Barnett Wood Lane  
Leatherhead, Surrey  
United Kingdom KT22 7DE  
+44 1372 363 339  
United States  
800 345 7015  
#20-03 Wisma Atria  
+408 284 8200 (outside U.S.)  
Singapore 238877  
+65 6 887 5505  
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device  
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered  
trademarks used to identify products or services of their respective owners.  
Printed in USA  
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