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产品型号74AHC04PW的概述

74AHC04PW 芯片概述 74AHC04PW 是一种六个反相器的 CMOS 集成电路，广泛应用于数字电路中，能够提供高性能的反相器功能。该芯片在现代电子设计中具有重要意义，尤其是在需要大量低功耗和高速度运算的场合。其操作电压范围从 2.0V 至 5.5V，适用于多种电源电压条件下的应用。由于其卓越的转移特性和低功耗特性，74AHC04PW 经常用于逻辑信号的反转和信号的处理。详细参数 74AHC04PW 的关键参数包括： - 工作电压：2.0V 至 5.5V - 工作温度范围：-40°C 至 125°C - 最大输出电流：25 mA - 输入电平高阈值 (VIH)：2.0V (2.0V 电源时) - 输入电平低阈值 (VIL)：0.8V (2.0V 电源时) - 最大功耗：0.1 mA (典型值) - 引脚数量：14 - 封装类型：TSSOP - 高达的传播延迟：大约 5 ns ...

产品型号74AHC04PW的Datasheet PDF文件预览

INTEGRATED CIRCUITS

DATA SHEET

74AHC04; 74AHCT04

Hex inverter

Product speciﬁcation

1999 Sep 27

Supersedes data of 1999 Feb 25

File under Integrated Circuits, IC06

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

FEATURES

QUICK REFERENCE DATA

GND = 0 V; T_amb= 25 °C; t_r= t_f≤ 3.0 ns.

• ESD protection:

HBM EIA/JESD22-A114-A

exceeds 2000 V

MM EIA/JESD22-A115-A

exceeds 200 V

TYPICAL

SYMBOL

PARAMETER

CONDITIONS

UNIT

AHC AHCT

t_PHL/t_PLHpropagation

delay nA to nY

C_L= 15 pF;

V_CC= 5 V

3.0

• Balanced propagation delays

C_I

input

capacitance

V_I= V_CCor GND

4.0

• Inputs accepts voltages higher than

V_CC

C_PD

powerdissipation C_L= 50 pF;

capacitance

13.5

13.9

• For AHC only:

operates with CMOS input levels

f = 1 MHz;

notes 1 and 2

• For AHCT only:

operates with TTL input levels

Notes

• Specified from

−40 to +85 and +125 °C.

1. C_PDis used to determine the dynamic power dissipation (P_Din µW).

P_D= C_PD× V_CC²× f_i+ ∑ (C_L× V_CC²× f_o) where:

f_i= input frequency in MHz;

DESCRIPTION

f_o= output frequency in MHz;

The 74AHC/AHCT04 are high-speed

Si-gate CMOS devices and are pin

compatible with low power Schottky

TTL (LSTTL). They are specified in

compliance with JEDEC standard

No. 7A.

∑ (C_L× V_CC²× f_o) = sum of outputs;

C_L= output load capacitance in pF;

V_CC= supply voltage in Volts.

2. The condition is V_I= GND to V_CC

The 74AHC/AHCT04 provide six

inverting buffers.

PINNING

SYMBOL

1A to 6A

DESCRIPTION

data inputs

1, 3, 5, 9, 11 and 13

FUNCTION TABLE

2, 4, 6, 8, 10 and 12

1Y to 6Y

GND

data outputs

See note 1.

ground (0 V)

INPUT nA

OUTPUT nY

V_CC

DC supply voltage

Note

1. H = HIGH voltage level;

L = LOW voltage level.

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

ORDERING INFORMATION

OUTSIDE NORTH

PACKAGES

NORTH AMERICA

AMERICA

PINS

PACKAGE

MATERIAL

CODE

74AHC04D

plastic

SOT108-1

SOT402-1

SOT108-1

SOT402-1

74AHC04PW

74AHCT04D

74AHCT04PW

74AHC04PW DH

74AHCT04D

TSSOP

74AHCT04PW DH

TSSOP

handbook, halfpage

MNA341

GND

MNA340

Fig.1 Pin configuration.

Fig.2 Logic diagram (one gate).

handbook, halfpage

MNA342

MNA343

Fig.3 Functional diagram.

Fig.4 IEC logic symbol.

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

RECOMMENDED OPERATING CONDITIONS

74AHC

74AHCT

UNIT

SYMBOL

PARAMETER

DC supply voltage

CONDITIONS

MIN. TYP. MAX. MIN. TYP. MAX.

V_CC

V_I

2.0

5.0

−

5.5

4.5

5.0

−

5.5

input voltage

5.5

V_O

output voltage

−

V_CC

+85

−

V_CC

+85

T_amb

operating ambient temperature

range

see DC and AC

characteristics per

device

−40

+25

−40

+25

°C

+125 −40

+125 °C

t_r,t_f(∆t/∆f) input rise and fall times except

V_CC= 3.3 V ±0.3 V

V_CC= 5 V ±0.5 V

−

100

−

ns/V

for Schmitt-trigger inputs

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).

SYMBOL

PARAMETER

DC supply voltage

CONDITIONS

MIN. MAX. UNIT

V_CC

V_I

−0.5 +7.0

input voltage range

I_IK

DC input diode current

DC output diode current

V_I< −0.5 V; note 1

V_O< −0.5 V or V_O> V_CC+ 0.5 V; note 1

−

−20

±20

±25

±75

I_OK

I_O

−

DC output source or sink current −0.5 V < V_O< V_CC+ 0.5 V

DC V_CCor GND current

−

I_CC

T_stg

P_D

−

storage temperature range

−65

−

+150 °C

500 mW

power dissipation per package

for temperature range: −40 to +125 °C; note 2

Notes

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. For SO packages: above 70 °C the value of P_Dderates linearly with 8 mW/K.

For TSSOP packages: above 60 °C the value of P_Dderates linearly with 5.5 mW/K.

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

DC CHARACTERISTICS

74AHC family

Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).

TEST CONDITIONS T_amb(°C)

−40 to +85 −40 to +125 UNIT

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

SYMBOL

PARAMETER

OTHER

V_CC(V)

V_IH

HIGH-level input

voltage

2.0

3.0

5.5

2.0

3.0

5.5

2.0

3.0

4.5

3.0

1.5

2.1

3.85

−

1.5

2.1

3.85

−

1.5

2.1

3.85

−

V_IL

LOW-level input

voltage

−

0.5

0.9

1.65

−

0.5

0.9

1.65

−

0.5

0.9

1.65

−

V_OH

HIGH-level output V_I= V_IHor V_IL;

voltage; all

outputs

1.9

2.9

4.4

2.58

2.0

3.0

4.5

−

1.9

2.9

4.4

2.48

1.9

2.9

4.4

2.40

I_O= −50 µA

−

HIGH-level output V_I= V_IHor V_IL;

−

voltage

I_O= −4.0 mA

V_I= V_IHor V_IL;

4.5

3.94

−

3.8

−

3.70

−

I_O= −8.0 mA

V_OL

LOW-level output V_I= V_IHor V_IL;

2.0

3.0

4.5

3.0

−

0.1

0.36

−

0.1

0.44

−

0.1

0.55

voltage; all

outputs

I_O= 50 µA

LOW-level output V_I= V_IHor V_IL;

voltage

I_O= 4 mA

V_I= V_IHor V_IL;

I_O= 8 mA

4.5

−

0.36

0.1

−

0.44

1.0

±2.5

−

0.55

2.0

I_I

input leakage

current

V_I= V_CCor GND 5.5

µA

I_OZ

I_CC

C_I

3-state output

OFF current

V_I= V_IHor V_IL;

V_O= V_CCor GND

5.5

±0.25 −

±10.0 µA

quiescent supply V_I= V_CCor GND; 5.5

4.0

−

µA

current

I_O= 0

input capacitance

−

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

74AHCT family

Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).

TEST CONDITIONS

OTHER V_CC(V)

4.5 to 5.5 2.0

_amb(°C)

SYMBOL

PARAMETER

−40 to +85 −40 to +125 UNIT

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

V_IH

V_IL

HIGH-level input

voltage

−

2.0

−

2.0

−

LOW-level input

voltage

4.5 to 5.5

4.5

−

0.8

−

0.8

−

0.8

−

V_OH

HIGH-leveloutput V_I= V_IHor V_IL;

4.4 4.5

4.4

voltage; all

outputs

I_O= −50 µA

HIGH-leveloutput V_I= V_IHor V_IL;

voltage I_O= −8.0 mA

LOW-level output V_I= V_IHor V_IL;

4.5

3.94

−

3.8

−

3.70

−

V_OL

−

0.1

−

0.1

−

0.1

voltage; all

outputs

I_O= 50 µA

LOW-level output V_I= V_IHor V_IL;

4.5

5.5

−

0.36

0.1

−

0.44

1.0

−

0.55

2.0

voltage

I_O= 8 mA

I_I

input leakage

current

V_I= V_IHor V_IL

µA

I_OZ

3-state output

OFF current

V_I= V_IHor V_IL;

V_O= V_CCor GND

per input pin;

±0.25 −

±2.5

±10.0 µA

other inputs at

_CCor GND;

I_O= 0

quiescent supply V_I= V_CCor GND; 5.5

I_CC

−

4.0

−

µA

current

I_O= 0

∆I_CC

additional

V_I= V_CC− 2.1 V

4.5 to 5.5

1.35

1.5

quiescent supply other inputs at

current per input

I_O= 0

_CCor GND;

C_I

input capacitance

−

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

AC CHARACTERISTICS

Type 74AHC04

GND = 0 V; t_r= t_f≤ 3.0 ns.

TEST CONDITIONS

WAVEFORMS C_L

_amb(°C)

SYMBOL

PARAMETER

−40 to +85 −40 to +125 UNIT

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

V_CC= 3.0 to 3.6 V; note 1

t_PHL/t_PLH

propagation

delay nA to nY

see Figs 5 and 6 15 pF −

50 pF −

4.0

6.0

8.5

1.0

10.5 1.0

11.0 ns

14.5 ns

11.4 1.0

1.0

V_CC= 4.5 to 5.5 V; note 2

t_PHL/t_PLH

propagation

delay nA to nY

see Figs 5 and 6 15 pF −

50 pF −

3.0

4.5

5.5

7.5

1.0

6.5

8.5

1.0

7.0

9.5

Notes

1. Typical values at V_CC= 3.3 V.

2. Typical values at V_CC= 5.0 V.

Type 74AHCT04

GND = 0 V; t_r= t_f≤ 3.0 ns.

TEST CONDITIONS

_amb(°C)

−40 to +85 −40 to +125 UNIT

MIN. TYP. MAX. MIN. MAX. MIN. MAX.

SYMBOL

PARAMETER

WAVEFORMS

C_L

V_CC= 4.5 to 5.5 V; note 1

t_PHL/t_PLH

propagation

delay nA to nY

see Figs 5 and 6 15 pF −

50 pF −

3.0

4.5

6.7

7.7

1.0

7.5

8.5

1.0

8.5

10.0 ns

Note

1. Typical values at V_CC= 5.0 V.

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

AC WAVEFORMS

handbook, halfpage

nA INPUT

(1)

GND

PHL

PLH

(1)

nY OUTPUT

MNA344

(1)

V_IINPUT

V_M

FAMILY

REQUIREMENTS

INPUT

50% V_CC50% V_CC

1.5 V 50% V_CC

OUTPUT

AHC

GND to V_CC

AHCT

GND to 3.0 V

Fig.5 The input (nA) to output (nY) propagation delay.

handbook, full pagewidth

open

GND

1000 Ω

PULSE

D.U.T.

GENERATOR

MNA219

TEST

S₁

t_PLH/t_PHL

t_PLZ/t_PZL

t_PHZ/t_PZH

open

V_CC

GND

Fig.6 Load circuitry for switching times.

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

PACKAGE OUTLINES

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

(A )

pin 1 index

detail X

2.5

scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

UNIT

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

1.75

1.27

0.050

1.05

0.25

0.01

0.25

0.1

0.25

0.01

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.35

0.014 0.0075 0.34

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches

0.041

0.01 0.004

0.069

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-01-23

97-05-22

SOT108-1

076E06S

MS-012AB

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

(A )

pin 1 index

detail X

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

(2)

(1)

UNIT

max.

8^o

0^o

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

6.6

6.2

0.75

0.50

0.4

0.3

0.72

0.38

1.10

0.65

0.25

1.0

0.2

0.13

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

94-07-12

95-04-04

SOT402-1

MO-153

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

SOLDERING

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable

for surface mount ICs, or for printed-circuit boards with

high population densities. In these situations reflow

soldering is often used.

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

Reﬂow soldering

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

Manual soldering

Wave soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

Suitability of surface mount IC packages for wave and reﬂow soldering methods

SOLDERING METHOD

REFLOW⁽¹⁾

PACKAGE

WAVE

BGA, LFBGA, SQFP, TFBGA

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable⁽²⁾

PLCC⁽³⁾, SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

not suitable

suitable

not recommended⁽³⁾⁽⁴⁾

not recommended⁽⁵⁾

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

NOTES

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

NOTES

1999 Sep 27

Philips Semiconductors

Product speciﬁcation

Hex inverter

74AHC04; 74AHCT04

NOTES

1999 Sep 27

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Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Hungary: see Austria

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Indonesia: PT Philips Development Corporation, Semiconductors Division,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),

Tel. +39 039 203 6838, Fax +39 039 203 6800

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Uruguay: see South America

Vietnam: see Singapore

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Middle East: see Italy

Tel. +381 11 62 5344, Fax.+381 11 63 5777

For all other countries apply to: Philips Semiconductors,

Internet: http://www.semiconductors.philips.com

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,

5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

245002/02/pp16

Date of release: 1999 Sep 27

Document order number: 9397 750 06286

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74AHC04PW产品参数

型号:	74AHC04PW
是否Rohs认证：	符合
生命周期：	Active
包装说明：	TSSOP,
Reach Compliance Code：	compliant
HTS代码：	8542.39.00.01
风险等级：	5.07
Is Samacsys：	N
系列：	AHC/VHC/H/U/V
JESD-30 代码：	R-PDSO-G14
JESD-609代码：	e4
长度：	5 mm
逻辑集成电路类型：	INVERTER
湿度敏感等级：	1
功能数量：	6
输入次数：	1
端子数量：	14
最高工作温度：	125 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	TSSOP
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：	260
传播延迟（tpd）：	14.5 ns
认证状态：	Not Qualified
座面最大高度：	1.1 mm
最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	2 V
标称供电电压 (Vsup)：	5 V
表面贴装：	YES
技术：	CMOS
温度等级：	AUTOMOTIVE
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	0.65 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	30
宽度：	4.4 mm
Base Number Matches：	1

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