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  • 74AHC08PW图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • 74AHC08PW 现货库存
  • 数量97500 
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  • 74AHC08PW图
  • 深圳市欧昇科技有限公司

     该会员已使用本站2年以上
  • 74AHC08PW 现货库存
  • 数量2500 
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  • 74AHC08PW图
  • 深圳市隆鑫创展电子有限公司

     该会员已使用本站15年以上
  • 74AHC08PW 现货库存
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  • 深圳市澳亿芯电子

     该会员已使用本站13年以上
  • 74AHC08PW 现货库存
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  • 74AHC08PW图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • 74AHC08PW 现货库存
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  • 74AHC08PW图
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     该会员已使用本站15年以上
  • 74AHC08PW
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  • 74AHC08PW图
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     该会员已使用本站13年以上
  • 74AHC08PW
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  • 74AHC08PW,118图
  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • 74AHC08PW,118
  • 数量5000 
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  • 74AHC08PW图
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     该会员已使用本站5年以上
  • 74AHC08PW
  • 数量35000 
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     该会员已使用本站11年以上
  • 74AHC08PW
  • 数量10000 
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  • 74AHC08PW图
  • 深圳市捷兴胜微电子科技有限公司

     该会员已使用本站13年以上
  • 74AHC08PW
  • 数量183 
  • 厂家PHI 
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  • 74AHC08PW图
  • 深圳市西源信息科技有限公司

     该会员已使用本站9年以上
  • 74AHC08PW
  • 数量8800 
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  • 深圳市芯福林电子有限公司

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  • 74AHC08PW
  • 数量85000 
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  • 74AHC08PW图
  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • 74AHC08PW
  • 数量12500 
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  • 74AHC08PW-Q100J图
  • 深圳市鹏睿康科技有限公司

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  • 74AHC08PW-Q100J
  • 数量12500 
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  • 74AHC08PW112图
  • 北京中其伟业科技有限公司

     该会员已使用本站16年以上
  • 74AHC08PW112
  • 数量2400 
  • 厂家Nxp Semiconductors 
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  • 74AHC08PW图
  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • 74AHC08PW
  • 数量15000 
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  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • 74AHC08PW
  • 数量31709 
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  • HECC GROUP CO.,LIMITED

     该会员已使用本站17年以上
  • 74AHC08PW
  • 数量1500 
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  • 74AHC08PW图
  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • 74AHC08PW
  • 数量5000 
  • 厂家NXP Semiconductors 
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  • 74AHC08PW,118图
  • 深圳市正信鑫科技有限公司

     该会员已使用本站12年以上
  • 74AHC08PW,118
  • 数量7451 
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  • 深圳市意好科技有限公司

     该会员已使用本站15年以上
  • 74AHC08PW
  • 数量6730 
  • 厂家NS 
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  • 批号24+ 
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  • 74AHC08PW图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • 74AHC08PW
  • 数量222048 
  • 厂家Nexperia 
  • 封装TSSOP14 
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  • 原厂可订货,技术支持,直接渠道。可签保供合同
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  • 74AHC08PW TSSOP14图
  • 深圳市科庆电子有限公司

     该会员已使用本站16年以上
  • 74AHC08PW TSSOP14
  • 数量2344 
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  • 现货只售原厂原装可含13%税
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  • 北京睿科新创电子中心

     该会员已使用本站9年以上
  • 74AHC08PW
  • 数量2500 
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  • 74AHC08PW图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • 74AHC08PW
  • 数量190 
  • 厂家NXP/恩智浦 
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  • 深圳市炎凯科技有限公司

     该会员已使用本站7年以上
  • 74AHC08PW
  • 数量83489 
  • 厂家NXP 
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  • 北京顺科电子科技有限公司

     该会员已使用本站8年以上
  • 74AHC08PW
  • 数量5500 
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  • 深圳市能元时代电子有限公司

     该会员已使用本站10年以上
  • 74AHC08PW
  • 数量50000 
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  • 深圳市恒达亿科技有限公司

     该会员已使用本站12年以上
  • 74AHC08PW
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  • 深圳市恒达亿科技有限公司

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  • 74AHC08PW
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产品型号74AHC08PW的概述

芯片74AHC08PW的概述 74AHC08PW是一款广泛使用的集成电路,其主要功能为提供四路与门(AND gate)逻辑运算。作为74系列逻辑芯片的一部分,74AHC08PW是在高性能、高速度的数字电路设计中实现基本逻辑功能的重要元件。该芯片不仅具备较高的工作频率,还具有广阔的电压范围,适合多种工业和消费电子应用。 74AHC08PW的高性能主要源于其采用的AHC(Advanced High-Speed CMOS)技术。这种技术能够在更低的电源电压下实现快速开关,降低能耗并提升整体效率。AHC系列半导体器件一般在3V至5.5V的电源电压范围内工作,使其具备良好的兼容性,适用于多种逻辑电平环境。 芯片74AHC08PW的详细参数 在详细了解74AHC08PW之前,有必要提及其几个核心参数: 1. 电源电压(VCC):3V至5.5V,适合各类电源环境。 2. 输入电压(VIH/VIL):...

产品型号74AHC08PW的Datasheet PDF文件预览

INTEGRATED CIRCUITS  
DATA SHEET  
74AHC08; 74AHCT08  
Quad 2-input AND gate  
Product specification  
1999 Sep 24  
Supersedes data of 1998 Dec 18  
File under Integrated Circuits, IC06  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
FEATURES  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf 3.0 ns.  
ESD protection:  
HBM EIA/JESD22-A114-A  
exceeds 2000 V  
MM EIA/JESD22-A115-A  
exceeds 200 V  
CDM EIA/JESD22-C101  
exceeds 1000 V  
TYPICAL  
SYMBOL  
PARAMETER  
CONDITIONS  
UNIT  
AHC  
3.5  
AHCT  
5.0  
tPHL/tPLH propagation delay  
nA, nB to nY  
CL = 15 pF;  
VCC = 5 V  
ns  
CI  
input capacitance  
output capacitance  
VI = VCC or GND 3.0  
4.0  
3.0  
4.0  
12  
pF  
pF  
pF  
Balanced propagation delays  
CO  
CPD  
All inputs have Schmitt-trigger  
actions  
power dissipation  
capacitance  
CL = 50 pF;  
f = 1 MHz;  
10  
notes 1 and 2  
Inputs accepts voltages higher than  
VCC  
Notes  
For AHC only:  
1. CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi + (CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
operates with CMOS input levels  
For AHCT only:  
operates with TTL input levels  
fo = output frequency in MHz;  
Specified from  
40 to +85 and +125 °C.  
(CL × VCC2 × fo) = sum of outputs;  
CL = output load capacitance in pF;  
DESCRIPTION  
VCC = supply voltage in Volts.  
The 74AHC/AHCT08 are high-speed  
Si-gate CMOS devices and are pin  
compatible with low power Schottky  
TTL (LSTTL). They are specified in  
compliance with JEDEC standard  
No. 7A.  
2. The condition is VI = GND to VCC  
.
PINNING  
PIN  
SYMBOL  
1A to 4A  
DESCRIPTION  
data inputs  
1, 4, 9 and 12  
The 74AHC/AHCT08 provide the  
2-input AND function.  
2, 5, 10 and 13  
1B to 4B  
1Y to 4Y  
GND  
data inputs  
3, 6, 8 and 11  
data outputs  
ground (0 V)  
DC supply voltage  
7
FUNCTION TABLE  
14  
VCC  
See note 1.  
INPUT  
OUTPUT  
nA  
L
nB  
L
nY  
L
L
H
L
L
H
H
L
H
H
Note  
1. H = HIGH voltage level;  
L = LOW voltage level.  
1999 Sep 24  
2
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
ORDERING INFORMATION  
OUTSIDE NORTH  
PACKAGES  
NORTH AMERICA  
AMERICA  
PINS  
PACKAGE  
MATERIAL  
CODE  
74AHC08D  
74AHC08D  
14  
14  
14  
14  
SO  
plastic  
plastic  
plastic  
plastic  
SOT108-1  
SOT402-1  
SOT108-1  
SOT402-1  
74AHC08PW  
74AHCT08D  
74AHCT08PW  
74AHC08PW DH  
74AHCT08D  
TSSOP  
SO  
74AHCT08PW DH  
TSSOP  
handbook, halfpage  
1A  
1B  
1Y  
2A  
2B  
2Y  
1
2
3
4
5
6
7
V
CC  
14  
13  
12  
11  
10  
9
4B  
4A  
4Y  
3B  
3A  
3Y  
handbook, halfpage  
A
08  
Y
B
MNA221  
8
GND  
MNA220  
Fig.1 Pin configuration.  
Fig.2 Logic diagram (one gate).  
1
handbook, halfpage  
&
3
2
handbook, halfpage  
1
2
1A  
1B  
1Y  
2Y  
3Y  
3
6
8
4
&
4
5
2A  
2B  
6
5
9
9
3A  
3B  
10  
&
8
12  
13  
4A  
4B  
10  
4Y 11  
12  
MNA222  
&
11  
13  
MNA223  
Fig.3 Functional diagram.  
Fig.4 IEC logic symbol.  
1999 Sep 24  
3
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
RECOMMENDED OPERATING CONDITIONS  
74AHC  
74AHCT  
UNIT  
SYMBOL  
PARAMETER  
DC supply voltage  
CONDITIONS  
MIN. TYP. MAX. MIN. TYP. MAX.  
VCC  
VI  
2.0  
0
5.0  
5.5  
4.5  
0
5.0  
5.5  
V
input voltage  
5.5  
5.5  
V
VO  
output voltage  
0
VCC  
+85  
0
VCC  
+85  
V
Tamb  
operating ambient temperature  
range  
see DC and AC  
characteristics per  
device  
40  
40  
+25  
+25  
40  
+25  
+25  
°C  
+125 40  
+125 °C  
tr,tf (t/f) input rise and fall rates  
VCC = 3.3 V ±0.3 V  
VCC = 5 V ±0.5 V  
100  
20  
ns/V  
20  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).  
SYMBOL  
PARAMETER  
DC supply voltage  
CONDITIONS  
MIN. MAX. UNIT  
VCC  
VI  
0.5 +7.0  
0.5 +7.0  
V
input voltage range  
V
IIK  
DC input diode current  
DC output diode current  
VI < 0.5 V; note 1  
VO < 0.5 V or VO > VCC + 0.5 V; note 1  
20  
±20  
±25  
±75  
mA  
mA  
mA  
mA  
IOK  
IO  
DC output source or sink current 0.5 V < VO < VCC + 0.5 V  
DC VCC or GND current  
ICC  
Tstg  
PD  
storage temperature range  
65  
+150 °C  
500 mW  
power dissipation per package  
for temperature range: 40 to +125 °C; note 2  
Notes  
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. For SO packages: above 70 °C the value of PD derates linearly with 8 mW/K.  
For TSSOP packages: above 60 °C the value of PD derates linearly with 5.5 mW/K.  
1999 Sep 24  
4
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
DC CHARACTERISTICS  
74AHC family  
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).  
TEST CONDITIONS Tamb (°C)  
40 to +85 40 to +125 UNIT  
MIN. TYP. MAX. MIN. MAX. MIN. MAX.  
SYMBOL  
PARAMETER  
25  
OTHER  
VCC (V)  
VIH  
HIGH-level input  
voltage  
2.0  
3.0  
5.5  
2.0  
3.0  
5.5  
2.0  
3.0  
4.5  
3.0  
1.5  
2.1  
3.85  
1.5  
2.1  
3.85  
1.5  
2.1  
3.85  
V
V
V
V
VIL  
LOW-level input  
voltage  
0.5  
0.9  
1.65  
0.5  
0.9  
1.65  
0.5  
0.9  
1.65  
VOH  
HIGH-level output VI = VIH or VIL;  
voltage; all  
outputs  
1.9  
2.9  
4.4  
2.58  
2.0  
3.0  
4.5  
1.9  
2.9  
4.4  
2.48  
1.9  
2.9  
4.4  
2.40  
IO = 50 µA  
HIGH-level output VI = VIH or VIL;  
voltage  
IO = 4.0 mA  
VI = VIH or VIL;  
4.5  
3.94  
3.8  
3.70  
IO = 8.0 mA  
VOL  
LOW-level output VI = VIH or VIL;  
2.0  
3.0  
4.5  
3.0  
0
0
0
0.1  
0.1  
0.1  
0.36  
0.1  
0.1  
0.1  
0.44  
0.1  
0.1  
0.1  
0.55  
V
V
voltage; all  
outputs  
IO = 50 µA  
LOW-level output VI = VIH or VIL;  
voltage  
IO = 4 mA  
VI = VIH or VIL;  
IO = 8 mA  
4.5  
3
0.36  
0.1  
0.44  
1.0  
±2.5  
20  
0.55  
2.0  
II  
input leakage  
current  
VI = VCC or GND 5.5  
µA  
IOZ  
ICC  
CI  
3-state output  
OFF current  
VI = VIH or VIL;  
VO = VCC or GND  
5.5  
±0.25 −  
±10.0 µA  
quiescent supply VI = VCC or GND; 5.5  
2.0  
10  
40  
10  
µA  
current  
IO = 0  
input capacitance  
10  
pF  
1999 Sep 24  
5
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
74AHCT family  
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).  
TEST CONDITIONS  
Tamb (°C)  
SYMBOL  
PARAMETER  
25  
40 to +85 40 to +125 UNIT  
OTHER VCC (V)  
MIN. TYP. MAX. MIN. MAX. MIN. MAX.  
VIH  
VIL  
HIGH-level input  
voltage  
4.5 to 5.5 2.0  
2.0  
2.0  
V
LOW-level input  
voltage  
4.5 to 5.5 −  
0.8  
0.8  
0.8  
V
VOH  
HIGH-level output VI = VIH or VIL;  
voltage; all outputs IO = 50 µA  
4.5  
4.5  
4.5  
4.5  
5.5  
5.5  
4.4 4.5  
4.4  
3.8  
4.4  
3.70  
V
HIGH-level output VI = VIH or VIL;  
voltage  
3.94  
0
V
IO = 8.0 mA  
VOL  
LOW-level output VI = VIH or VIL;  
voltage; all outputs IO = 50 µA  
0.1  
0.36  
0.1  
0.1  
0.44  
1.0  
±2.5  
0.1  
0.55  
2.0  
V
LOW-level output VI = VIH or VIL;  
voltage  
V
IO = 8 mA  
II  
input leakage  
current  
VI = VIH or VIL  
µA  
IOZ  
3-state output  
OFF current  
VI = VIH or VIL;  
VO = VCC or GND  
per input pin;  
±0.25 −  
±10.0 µA  
other inputs at  
V
CC or GND;  
IO = 0  
ICC  
quiescent supply  
current  
VI = VCC or GND; 5.5  
IO = 0  
2.0  
20  
40  
µA  
ICC  
additional  
VI = VCC 2.1 V 4.5 to 5.5 −  
1.35  
1.5  
1.5  
mA  
quiescent supply  
current per input  
pin  
other inputs at  
V
CC or GND;  
IO = 0  
CI  
input capacitance  
3
10  
10  
10  
pF  
1999 Sep 24  
6
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
AC CHARACTERISTICS  
Type 74AHC08  
GND = 0 V; tr = tf 3.0 ns.  
TEST CONDITIONS  
WAVEFORMS CL  
T
amb (°C)  
SYMBOL  
PARAMETER  
25  
40 to +85 40 to +125 UNIT  
MIN. TYP. MAX. MIN. MAX. MIN. MAX.  
V
CC = 3.0 to 3.6 V; note 1  
tPHL/tPLH propagation delay see Figs 5 and 6 15 pF −  
4.0  
5.6  
8.8  
1.0  
1.0  
10.5  
14.0  
1.0  
1.0  
11.0  
15.5  
ns  
ns  
nA, nB to nY  
50 pF −  
12.3  
VCC = 4.5 to 5.5 V; note 2  
tPHL/tPLH propagation delay see Figs 5 and 6 15 pF −  
3.0  
4.2  
5.9  
7.9  
1.0  
1.0  
7.0  
9.0  
1.0  
1.0  
7.5  
ns  
ns  
nA, nB to nY  
50 pF −  
10.0  
Notes  
1. Typical values at VCC = 3.3 V.  
2. Typical values at VCC = 5.0 V.  
Type 74AHCT08  
GND = 0 V; tr = tf 3.0 ns.  
TEST CONDITIONS  
T
amb (°C)  
40 to +85 40 to +125 UNIT  
MIN. TYP. MAX. MIN. MAX. MIN. MAX.  
SYMBOL  
PARAMETER  
25  
WAVEFORMS  
CL  
VCC = 4.5 to 5.5 V; note 1  
t
PHL/tPLH propagation delay see Figs 5 and 6 15 pF  
3.2  
4.4  
6.9  
7.9  
1.0  
1.0  
8.0  
9.0  
1.0  
1.0  
9.0  
ns  
ns  
nA, nB to nY  
50 pF  
10.0  
Note  
1. Typical values at VCC = 5.0 V.  
1999 Sep 24  
7
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
AC WAVEFORMS  
V
handbook, halfpage  
I
(1)  
V
nA, nB INPUT  
M
GND  
t
t
PHL  
PLH  
V
OH  
(1)  
V
nY OUTPUT  
M
V
MNA224  
OL  
(1)  
(1)  
VI INPUT  
REQUIREMENTS  
VM  
VM  
OUTPUT  
FAMILY  
INPUT  
74AHC  
GND to VCC  
50% VCC 50% VCC  
1.5 V 50% VCC  
74AHCT GND to 3.0 V  
Fig.5 The input (nA, nB) to output (nY) propagation delays.  
S
V
CC  
1
open  
V
CC  
GND  
1000  
V
V
O
I
PULSE  
D.U.T.  
GENERATOR  
C
R
L
T
MNA225  
TEST  
tPLH/tPHL  
tPLZ/tPZL  
tPHZ/tPZH  
S1  
open  
VCC  
GND  
Fig.6 Load circuitry for switching times.  
8
1999 Sep 24  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
PACKAGE OUTLINES  
SO14: plastic small outline package; 14 leads; body width 3.9 mm  
SOT108-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
7
e
detail X  
w
M
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
8.75  
8.55  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.75  
1.27  
0.050  
1.05  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.35  
0.014 0.0075 0.34  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches  
0.041  
0.01 0.004  
0.069  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-01-23  
97-05-22  
SOT108-1  
076E06S  
MS-012AB  
1999 Sep 24  
9
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm  
SOT402-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
7
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.72  
0.38  
mm  
1.10  
0.65  
0.25  
1.0  
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
94-07-12  
95-04-04  
SOT402-1  
MO-153  
1999 Sep 24  
10  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
SOLDERING  
Use a double-wave soldering method comprising a  
turbulent wave with high upward pressure followed by a  
smooth laminar wave.  
Introduction to soldering surface mount packages  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “Data Handbook IC26; Integrated Circuit Packages”  
(document order number 9398 652 90011).  
For packages with leads on two sides and a pitch (e):  
– larger than or equal to 1.27 mm, the footprint  
longitudinal axis is preferred to be parallel to the  
transport direction of the printed-circuit board;  
There is no soldering method that is ideal for all surface  
mount IC packages. Wave soldering is not always suitable  
for surface mount ICs, or for printed-circuit boards with  
high population densities. In these situations reflow  
soldering is often used.  
– smaller than 1.27 mm, the footprint longitudinal axis  
must be parallel to the transport direction of the  
printed-circuit board.  
The footprint must incorporate solder thieves at the  
downstream end.  
Reflow soldering  
For packages with leads on four sides, the footprint must  
be placed at a 45° angle to the transport direction of the  
printed-circuit board. The footprint must incorporate  
solder thieves downstream and at the side corners.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Several methods exist for reflowing; for example,  
infrared/convection heating in a conveyor type oven.  
Throughput times (preheating, soldering and cooling) vary  
between 100 and 200 seconds depending on heating  
method.  
Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Typical reflow peak temperatures range from  
215 to 250 °C. The top-surface temperature of the  
packages should preferable be kept below 230 °C.  
Manual soldering  
Wave soldering  
Fix the component by first soldering two  
diagonally-opposite end leads. Use a low voltage (24 V or  
less) soldering iron applied to the flat part of the lead.  
Contact time must be limited to 10 seconds at up to  
300 °C.  
Conventional single wave soldering is not recommended  
for surface mount devices (SMDs) or printed-circuit boards  
with a high component density, as solder bridging and  
non-wetting can present major problems.  
When using a dedicated tool, all other leads can be  
soldered in one operation within 2 to 5 seconds between  
270 and 320 °C.  
To overcome these problems the double-wave soldering  
method was specifically developed.  
If wave soldering is used the following conditions must be  
observed for optimal results:  
1999 Sep 24  
11  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
Suitability of surface mount IC packages for wave and reflow soldering methods  
SOLDERING METHOD  
REFLOW(1)  
PACKAGE  
WAVE  
BGA, LFBGA, SQFP, TFBGA  
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2)  
PLCC(3), SO, SOJ  
LQFP, QFP, TQFP  
SSOP, TSSOP, VSO  
not suitable  
suitable  
suitable  
suitable  
suitable  
suitable  
suitable  
not recommended(3)(4)  
not recommended(5)  
Notes  
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum  
temperature (with respect to time) and body size of the package, there is a risk that internal or external package  
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the  
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.  
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink  
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).  
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.  
The package footprint must incorporate solder thieves downstream and at the side corners.  
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;  
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is  
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 Sep 24  
12  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
NOTES  
1999 Sep 24  
13  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
NOTES  
1999 Sep 24  
14  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74AHC08; 74AHCT08  
NOTES  
1999 Sep 24  
15  
Philips Semiconductors – a worldwide company  
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Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,  
Tel. +45 33 29 3333, Fax. +45 33 29 3905  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,  
Tel. +27 11 471 5401, Fax. +27 11 471 5398  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615 800, Fax. +358 9 6158 0920  
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427  
South America: Al. Vicente Pinzon, 173, 6th floor,  
04547-130 SÃO PAULO, SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 821 2382  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 2353 60, Fax. +49 40 2353 6300  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: see Austria  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,  
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813  
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),  
Tel. +39 039 203 6838, Fax +39 039 203 6800  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,  
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381, Fax. +1 800 943 0087  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Middle East: see Italy  
Tel. +381 11 62 5344, Fax.+381 11 63 5777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
68  
SCA  
© Philips Electronics N.V. 1999  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
245002/02/pp16  
Date of release: 1999 Sep 24  
Document order number: 9397 750 06287  
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