74HC04D现货热卖使用介绍供应商报价哪里找芯片批发报价-中国IC网-芯三七

INTEGRATED CIRCUITS

DATA SHEET

74HC04; 74HCT04

Hex inverter

Product speciﬁcation

2003 Jul 23

Supersedes data of 1993 Sep 01

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

FEATURES

DESCRIPTION

• Complies with JEDEC standard no. 8-1A

The 74HC/HCT04 are high-speed Si-gate CMOS devices

and are pin compatible with low power Schottky TTL

(LSTTL). They are specified in compliance with JEDEC

standard no. 7A. The 74HC/HCT04 provide six inverting

buffers.

• ESD protection:

HBM EIA/JESD22-A114-A exceeds 2000 V

MM EIA/JESD22-A115-A exceeds 200 V.

• Specified from −40 to +85 °C and −40 to +125 °C.

QUICK REFERENCE DATA

GND = 0 V; T_amb= 25 °C; t_r= t_f≤ 6.0 ns.

TYPICAL

SYMBOL

PARAMETER

CONDITIONS

UNIT

HC04

HCT04

t

_PHL/t_PLHpropagation delay nA to nY

C_L= 15 pF; V_CC= 5 V

7

8

ns

pF

C_I

input capacitance

power dissipation capacitance per gate notes 1 and 2

3.5

21

3.5

24

C_PD

Notes

1. C_PDis used to determine the dynamic power dissipation (P_Din µW).

P_D= C_PD× V_CC²× f_i× N + Σ(C_L× V_CC²× f_o) where:

f_i= input frequency in MHz;

f_o= output frequency in MHz;

C_L= output load capacitance in pF;

V_CC= supply voltage in Volts;

N = total load switching outputs;

Σ(C_L× V_CC²× f_o) = sum of the outputs.

2. For 74HC04: the condition is V_I= GND to V_CC

.

For 74HCT04: the condition is V_I= GND to V_CC− 1.5 V.

FUNCTION TABLE

See note 1.

INPUT

nA

OUTPUT

nY

L

H

L

H

Note

1. H = HIGH voltage level;

L = LOW voltage level.

2003 Jul 23

2

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

TEMPERATURE RANGE

PINS

MATERIAL

CODE

74HC04N

−40 to +125 °C

14

DIP14

plastic

SOT27-1

74HCT04N

74HC04D

SO14

SOT108-1

SOT337-1

SOT402-1

SOT762-1

74HCT04D

74HC04DB

74HCT04DB

74HC04PW

74HCT04PW

74HC04BQ

74HCT04BQ

SO14

SSOP14

TSSOP14

DHVQFN14

PINNING

SYMBOL

1A

DESCRIPTION

1

2

data input

1Y

2A

2Y

3A

3Y

GND

4Y

4A

5Y

5A

6Y

6A

V_CC

data output

data input

handbook, halfpage

1A

1Y

1

2

3

4

5

6

7

V

CC

14

13

12

11

10

9

3

6A

6Y

5A

5Y

4A

4Y

4

data output

data input

5

2A

6

data output

ground (0 V)

data output

data input

2Y

04

7

3A

8

3Y

9

8

GND

10

11

12

13

14

data output

data input

MNA340

data output

data input

Fig.1 Pin configuration DIP14, SO14 and

(T)SSOP14.

supply voltage

2003 Jul 23

3

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

V

1A

1

handbook, halfpage

CC

handbook, halfpage

14

1Y

2Y

3Y

4Y

5Y

6Y

1

3

1A

2A

3A

4A

5A

6A

2

4

1Y

2A

2

3

13 6A

12 6Y

6

5

(1)

2Y

3A

3Y

4

5

6

11 5A

10 5Y

GND

8

9

10

12

11

13

9

4A

7

8

GND 4Y

Top view

MBL760

MNA342

(1) The die substrate is attached to this pad using conductive die

attach material. It can not be used as a supply pin or input.

Fig.2 Pin configuration DHVQFN14.

Fig.3 Logic symbol.

handbook, halfpage

1

2

1

3

4

5

6

handbook, halfpage

Y

A

MNA341

9

8

11

13

10

12

MNA343

Fig.4 IEC logic symbol.

Fig.5 Logic diagram (one inverter).

2003 Jul 23

4

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

RECOMMENDED OPERATING CONDITIONS

74HC04

TYP. MAX. MIN.

74HCT04

UNIT

SYMBOL

PARAMETER

supply voltage

CONDITIONS

MIN.

2.0

TYP. MAX.

V_CC

V_I

5.0

−

6.0

4.5

0

5.0

5.5

V

input voltage

0

V_CC

−

V_CC

V_O

output voltage

0

−

0

−

T_amb

ambient temperature

see DC and AC

characteristics per

device

−40

+25

+125 −40

+25

+125 °C

t_r, t_f

input rise and fall times

V_CC= 2.0 V

V_CC= 4.5 V

−

1000

500

−

ns

6.0

−

6.0

−

500

−

V_CC= 6.0 V

400

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).

SYMBOL

PARAMETER

supply voltage

CONDITIONS

MIN.

−0.5

MAX.

+7.0

UNIT

V_CC

I_IK

V

input diode current

output diode current

V_I< −0.5 V or V_I> V_CC+ 0.5 V

V_O< −0.5 V or V_O> V_CC+ 0.5 V

−0.5 V < V_O< V_CC+ 0.5 V

−

±20

±25

mA

I_OK

I_O

output source or sink

current

I

_CC, I_GNDV_CCor GND current

−

±50

mA

T_stg

P_tot

storage temperature

power dissipation

DIP14 package

−65

+150

°C

T

_amb= −40 to +125 °C; note 1

−

750

500

mW

other packages

T_amb= −40 to +125 °C; note 2

Notes

1. For DIP14 packages: above 70 °C derate linearly with 12 mW/K.

2. For SO14 packages: above 70 °C derate linearly with 8 mW/K.

For SSOP14 and TSSOP14 packages: above 60 °C derate linearly with 5.5 mW/K.

For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K.

2003 Jul 23

5

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

DC CHARACTERISTICS

Type 74HC04

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

TEST CONDITIONS

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

OTHER

V_CC(V)

T_amb= 25 °C

V_IH

HIGH-level input voltage

LOW-level input voltage

2.0

1.5

1.2

−

V

4.5

6.0

2.0

4.5

6.0

3.15

4.2

−

2.4

3.2

0.8

2.1

2.8

V_IL

0.5

−

1.35

1.8

−

V_OH

HIGH-level output voltage V_I= V_IHor V_IL

I_O= −20 µA

I_O= −4.0 mA

I_O= −20 µA

I_O= −5.2 mA

2.0

4.5

6.0

1.9

2.0

−

V

4.4

4.5

3.98

5.9

4.32

6.0

5.48

5.81

V_OL

LOW-level output voltage

V_I= V_IHor V_IL

I_O= 20 µA

2.0

4.5

6.0

−

0

0.1

V

I_O= 20 µA

0

0.1

I_O= 4.0 mA

I_O= 20 µA

0.15

0

0.26

0.1

I_O= 5.2 mA

V_I= V_CCor GND

0.16

0.1

−

0.26

±0.1

±.0.5

I_LI

input leakage current

µA

I_OZ

3-state output OFF current V_I= V_IHor V_IL;

V_O= V_CCor GND

I_CC

quiescent supply current

V_I= V_CCor GND; I_O= 0 6.0

−

2

µA

2003 Jul 23

6

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

TEST CONDITIONS

OTHER

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

V_CC(V)

T_amb= −40 to +85 °C

V_IH

HIGH-level input voltage

2.0

4.5

6.0

2.0

4.5

6.0

1.5

−

V

3.15

4.2

−

V

V_IL

LOW-level input voltage

0.5

−

1.35

1.8

−

V_OH

HIGH-level output voltage V_I= V_IHor V_IL

I_O= −20 µA

I_O= −4.0 mA

I_O= −20 µA

I_O= −5.2 mA

2.0

4.5

6.0

1.9

−

V

4.4

3.84

5.9

5.34

V_OL

LOW-level output voltage

V_I= V_IHor V_IL

I_O= 20 µA

2.0

4.5

6.0

−

0.1

V

I_O= 20 µA

0.1

V

I_O= 4.0 mA

I_O= 20 µA

0.33

0.1

V

I_O= 5.2 mA

V_I= V_CCor GND

0.33

±1.0

±.5.0

V

I_LI

input leakage current

µA

I_OZ

3-state output OFF current V_I= V_IHor V_IL;

V_O= V_CCor GND

I_CC

quiescent supply current

V_I= V_CCor GND; I_O= 0 6.0

−

20

µA

2003 Jul 23

7

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

TEST CONDITIONS

OTHER

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

V_CC(V)

T_amb= −40 to +125 °C

V_IH

HIGH-level input voltage

2.0

4.5

6.0

2.0

4.5

6.0

1.5

−

V

3.15

4.2

−

V

V_IL

LOW-level input voltage

0.5

−

1.35

1.8

−

V_OH

HIGH-level output voltage V_I= V_IHor V_IL

I_O= −20 µA

I_O= −4.0 mA

I_O= −5.2 mA

2.0

4.5

6.0

4.5

6.0

1.9

4.4

5.9

3.7

5.2

−

V

V_OL

LOW-level output voltage

V_I= V_IHor V_IL

I_O= 20 µA

2.0

4.5

6.0

4.5

6.0

−

0.1

V

I_O= 20 µA

0.1

V

I_O= 20 µA

0.1

V

I_O= 4.0 mA

I_O= 5.2 mA

V_I= V_CCor GND

0.4

V

0.4

V

I_LI

input leakage current

±1.0

±10.0

µA

I_OZ

3-state output OFF current V_I= V_IHor V_IL;

V_O= V_CCor GND

I_CC

quiescent supply current

V_I= V_CCor GND; I_O= 0 6.0

−

40

µA

2003 Jul 23

8

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

Type 74HCT04

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

TEST CONDITIONS

SYMBOL

PARAMETER

MIN.

TYP.

MAX. UNIT

OTHER

V_CC(V)

T_amb= 25 °C

V_IH

V_IL

HIGH-level input voltage

LOW-level input voltage

HIGH-level output voltage

4.5 to 5.5 2.0

1.6

−

V

4.5 to 5.5

−

1.2

0.8

V_OH

V_I= V_IHor V_IL

I_O= −20 µA

4.5

4.4

4.5

−

V

I_O= −4.0 mA

V_I= V_IHor V_IL

I_O= 20 µA

3.84

4.32

V_OL

LOW-level output voltage

4.5

5.5

−

0

0.1

V

I_O= 4.0 mA

0.15

−

0.26

±0.1

±0.5

V

I_LI

input leakage current

V_I= V_CCor GND

µA

I_OZ

3-state output OFF current

V_I= V_IHor V_IL;

V_O= V_CCor GND;

I_O= 0

−

I_CC

quiescent supply current

V_I= V_CCor GND; 5.5

I_O= 0

−

2

µA

∆I_CC

additional supply current per input V_I= V_CC− 2.1 V;

4.5 to 5.5

120

432

I_O= 0

T_amb= −40 to +85 °C

V_IH

V_IL

HIGH-level input voltage

4.5 to 5.5 2.0

−

V

LOW-level input voltage

HIGH-level output voltage

4.5 to 5.5

−

0.8

V_OH

V_I= V_IHor V_IL

I_O= −20 µA

4.5

4.4

−

V

I_O= −4.0 mA

V_I= V_IHor V_IL

I_O= 20 µA

3.84

V_OL

LOW-level output voltage

4.5

5.5

−

0.1

V

I_O= 4.0 mA

0.33

±1.0

±5.0

V

I_LI

input leakage current

V_I= V_CCor GND

µA

I_OZ

3-state output OFF current

V_I= V_IHor V_IL;

V_O= V_CCor GND;

I_O= 0

I_CC

quiescent supply current

V_I= V_CCor GND; 5.5

I_O= 0

−

20

µA

∆I_CC

additional supply current per input V_I= V_CC− 2.1 V;

4.5 to 5.5

540

I_O= 0

2003 Jul 23

9

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

TEST CONDITIONS

SYMBOL

PARAMETER

MIN.

TYP.

MAX. UNIT

OTHER

V_CC(V)

T_amb= −40 to +125 °C

V_IH

V_IL

HIGH-level input voltage

LOW-level input voltage

HIGH-level output voltage

4.5 to 5.5 2.0

−

V

4.5 to 5.5

−

0.8

V_OH

V_I= V_IHor V_IL

I_O= −20 µA

4.5

4.4

3.7

−

V

I_O= −4.0 mA

V_I= V_IHor V_IL

I_O= 20 µA

V_OL

LOW-level output voltage

4.5

5.5

−

0.1

V

I_O= 4.0 mA

0.4

V

I_LI

input leakage current

V_I= V_CCor GND

±1.0

±10

µA

I_OZ

3-state output OFF current

V_I= V_IHor V_IL;

V_O= V_CCor GND;

I_O= 0

I_CC

quiescent supply current

V_I= V_CCor GND; 5.5

I_O= 0

−

40

µA

∆I_CC

additional supply current per input V_I= V_CC− 2.1 V;

4.5 to 5.5

590

I_O= 0

2003 Jul 23

10

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

AC CHARACTERISTICS

Family 74HC04

GND = 0 V; t_r= t_f≤ 6.0 ns; C_L= 50 pF.

TEST CONDITIONS

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

WAVEFORMS

V_CC(V)

T_amb= 25 °C

t_PHL/t_PLH

propagation delay

nA to nY

see Figs 6 and 7

2.0

4.5

6.0

2.0

4.5

6.0

−

25

85

ns

9

17

14

75

15

13

ns

7

t_THL/t_TLH

output transition time

see Figs 6 and 7

19

7

6

T_amb= −40 to +85 °C

t_PHL/t_PLH

propagation delay

nA to nY

see Figs 6 and 7

2.0

4.5

6.0

2.0

4.5

6.0

−

105

21

18

95

19

16

ns

t_THL/t_TLH

output transition time

T_amb= −40 to +125 °C

t_PHL/t_PLH

propagation delay

nA to nY

see Figs 6 and 7

2.0

4.5

6.0

2.0

4.5

6.0

−

130

26

ns

22

t_THL/t_TLH

output transition time

110

22

19

2003 Jul 23

11

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

Family 74HCT04

GND = 0 V; t_r= t_f≤ 6.0 ns; C_L= 50 pF.

TEST CONDITIONS

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

WAVEFORMS

V_CC(V)

T_amb= 25 °C

t_PHL/t_PLH

propagation delay

nA to nY

see Figs 6 and 7

4.5

−

10

19

ns

t_THL/t_TLH

output transition time

7

15

ns

T_amb= −40 to +85 °C

t_PHL/t_PLHpropagation delay

see Figs 6 and 7

4.5

−

24

19

ns

nA to nY

t_THL/t_TLH

output transition time

T_amb= −40 to +125 °C

t_PHL/t_PLHpropagation delay

see Figs 6 and 7

4.5

−

29

22

ns

nA to nY

t_THL/t_TLH

output transition time

AC WAVEFORMS

V

handbook, halfpage

I

V

M

nA input

M

GND

t

PHL

PLH

V

OH

90%

V

nY output

M

10%

V

OL

t

TLH

MNA722

THL

For 74HC04: V_M= 50%; V_I= GND to V_CC

.

For 74HCT04: V_M= 1.3 V; V_I= GND to 3.0 V.

Fig.6 Waveforms showing the data input (nA) to data output (nY) propagation delays and the output transition

times.

2003 Jul 23

12

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

V

handbook, halfpage

CC

V

I

O

PULSE

GENERATOR

D.U.T

R

C

50 pF

T

L

MGK565

Definitions for test circuit:

C_L= Load capacitance including jig and probe capacitance.

R_T= Termination resistance should be equal to the output impedance Z_oof the pulse generator.

Fig.7 Load circuitry for switching times.

2003 Jul 23

13

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

PACKAGE OUTLINES

DIP14: plastic dual in-line package; 14 leads (300 mil)

SOT27-1

D

M

E

A

2

A

1

L

c

e

w M

Z

b

1

(e )

1

b

M

H

14

8

pin 1 index

E

1

7

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

A

2

(1)

Z

1

UNIT

mm

b

c

D

E

e

L

M

H

w

1

E

max.

min.

max.

1.73

1.13

0.53

0.38

0.36

0.23

19.50

18.55

6.48

6.20

3.60

3.05

8.25

7.80

10.0

8.3

4.2

0.51

3.2

2.54

0.1

7.62

0.3

0.254

0.01

2.2

0.068

0.044

0.021

0.015

0.014

0.009

0.77

0.73

0.26

0.24

0.14

0.12

0.32

0.31

0.39

0.33

inches

0.17

0.02

0.13

0.087

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-13

SOT27-1

050G04

MO-001

SC-501-14

2003 Jul 23

14

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

D

E

A

X

c

y

H

v

M

A

E

Z

8

14

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

7

e

detail X

w

M

b

p

0

2.5

scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.75

1.27

0.05

1.05

0.25

0.01

0.25

0.1

0.25

0.01

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.35

0.014 0.0075 0.34

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches

0.041

0.01 0.004

0.069

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-19

SOT108-1

076E06

MS-012

2003 Jul 23

15

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm

SOT337-1

D

E

A

X

c

y

H

v

M

A

E

Z

8

14

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

7

1

detail X

w M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

Z

θ

p

1

2

3

E

max.

8^o

0^o

0.21

0.05

1.80

1.65

0.38

0.25

0.20

0.09

6.4

6.0

5.4

5.2

7.9

7.6

1.03

0.63

0.9

0.7

1.4

0.9

mm

2

0.25

0.65

1.25

0.2

0.13

0.1

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-19

SOT337-1

MO-150

2003 Jul 23

16

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

D

E

A

X

c

y

H

v

M

A

E

Z

8

14

Q

(A )

3

A

2

A

1

pin 1 index

θ

L

p

L

1

7

detail X

w

M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

Z

θ

1

2

3

p

E

p

max.

8^o

0^o

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

6.6

6.2

0.75

0.50

0.4

0.3

0.72

0.38

mm

1.1

0.65

0.25

1

0.2

0.13

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT402-1

MO-153

2003 Jul 23

17

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

14 terminals; body 2.5 x 3 x 0.85 mm

SOT762-1

B

A

D

A

1

E

c

detail X

terminal 1

index area

C

terminal 1

index area

e

1

y

e

b

v

M

C

A

B

C

1

w

M

2

6

L

1

7

8

E

h

e

14

13

9

D

h

X

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

A

(1)

UNIT

A

b

c

E

e

1

y

D

E

L

v

w

y

1

h

1

max.

0.05 0.30

0.00 0.18

3.1

2.9

1.65

1.35

2.6

2.4

1.15

0.85

0.5

0.3

mm

0.05

0.1

1

0.2

0.5

2

0.1

0.05

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

02-10-17

03-01-27

SOT762-1

- - -

MO-241

- - -

2003 Jul 23

18

Philips Semiconductors

Product speciﬁcation

Hex inverter

74HC04; 74HCT04

DATA SHEET STATUS

DATA SHEET

LEVEL

PRODUCT

STATUS⁽²⁾⁽³⁾

DEFINITION

STATUS⁽¹⁾

I

Objective data

Development This data sheet contains data from the objective speciﬁcation for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

II

Preliminary data Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Relevant changes will

be communicated via a Customer Product/Process Change Notiﬁcation

(CPCN).

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

DEFINITIONS

DISCLAIMERS

Short-form specification

The data in a short-form

Life support applications

These products are not

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductors customers using or selling these products

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

at these or at any other conditions above those given in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -

including circuits, standard cells, and/or software -

described or contained herein in order to improve design

and/or performance. When the product is in full production

(status ‘Production’), relevant changes will be

Application information

Applications that are

communicated via a Customer Product/Process Change

Notification (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these

products, conveys no licence or title under any patent,

copyright, or mask work right to these products, and

makes no representations or warranties that these

products are free from patent, copyright, or mask work

right infringement, unless otherwise specified.

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

no representation or warranty that such applications will be

suitable for the specified use without further testing or

modification.

2003 Jul 23

19

Philips Semiconductors – a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

SCA75

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

613508/03/pp20

Date of release: 2003 Jul 23

Document order number: 9397 750 11256

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