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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

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  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • 74LVC1G02GW 现货库存
  • 数量12500 
  • 厂家NXP 
  • 封装TSSOP-5( 
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  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
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  • 数量69000 
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  • 深圳市欧昇科技有限公司

     该会员已使用本站2年以上
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  • 数量2390 
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  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
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  • 数量4819 
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  • 深圳市宗天技术开发有限公司

     该会员已使用本站10年以上
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     该会员已使用本站1年以上
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  • 数量5300 
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  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
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  • 数量12500 
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     该会员已使用本站12年以上
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  • 集好芯城

     该会员已使用本站13年以上
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  • 千层芯半导体(深圳)有限公司

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  • 数量30000 
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  • 深圳市一呈科技有限公司

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  • 深圳市惊羽科技有限公司

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  • 深圳市炎凯科技有限公司

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  • 北京元坤伟业科技有限公司

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  • 深圳市得捷芯城科技有限公司

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  • 数量38900 
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  • 深圳市华来深电子有限公司

     该会员已使用本站13年以上
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  • 深圳市欧昇科技有限公司

     该会员已使用本站10年以上
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  • 深圳市晶美隆科技有限公司

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  • 深圳市拓亿芯电子有限公司

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  • 封装TSSOP-5(SOT353-1) 
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  • 深圳市宏世佳电子科技有限公司

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  • 深圳市珩瑞科技有限公司

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  • 厂家NXP(恩智浦) 
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  • 深圳市晶美隆科技有限公司

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  • 厂家NXP 
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  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
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产品型号74LVC1G02GW的概述

芯片74LVC1G02GW的概述 74LVC1G02GW是一款低电压、高速的单通道非门(NAND gate),它属于LVC(低电压CMOS)系列,广泛应用于数字电路设计中,以高效能和低功耗著称。此芯片设计旨在满足现代电子设备的性能要求,尤其是在更小的功耗和更快的信号处理速度方面。74LVC1G02GW采用CMOS技术,具有较大的噪声容限和较高的输入阻抗,这使其在各种应用中表现出色。 74LVC1G02GW可以在1.65V至5.5V的宽电压范围内工作,因此非常适合便携式和电池驱动的设备。其出色的速度特性使其在高频应用中表现良好,通常适用于开关电源、高速数字信号处理等领域。此型号的非门设计简化了逻辑运算,在多种电路中都能找到合适的应用场景。 芯片74LVC1G02GW的详细参数 以下是74LVC1G02GW的一些关键参数: - 电压范围:1.65V至5.5V - 工作温度范围:-40°C至...

产品型号74LVC1G02GW的Datasheet PDF文件预览

INTEGRATED CIRCUITS  
DATA SHEET  
74LVC1G02  
Single 2-input NOR gate  
Product specification  
2004 Sep 07  
Supersedes data of 2002 Oct 02  
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
FEATURES  
DESCRIPTION  
Wide supply voltage range from 1.65 V to 5.5 V  
High noise immunity  
The 74LVC1G02 is a high-performance, low-power,  
low-voltage, Si-gate CMOS device, superior to most  
advanced CMOS compatible TTL families.  
Complies with JEDEC standard:  
– JESD8-7 (1.65 V to 1.95 V)  
Input can be driven from either 3.3 V or 5 V devices.  
These features allow the use of these devices in a mixed  
3.3 V and 5 V environment.  
– JESD8-5 (2.3 V to 2.7 V)  
– JESD8B/JESD36 (2.7 V to 3.6 V).  
• ±24 mA output drive (VCC = 3.0 V)  
CMOS low power consumption  
Latch-up performance exceeds 250 mA  
Direct interface with TTL levels  
Inputs accept voltages up to 5 V  
Multiple package options  
Schmitt trigger action at all inputs makes the circuit tolerant  
for slower input rise and fall time.  
This device is fully specified for partial power-down  
applications using Ioff. The Ioff circuitry disables the output,  
preventing the damaging backflow current through the  
device when it is powered down.  
The 74LVC1G02 provides the single 2-input NOR  
function.  
ESD protection:  
HBM EIA/JESD22-A114-B exceeds 2000 V  
MM EIA/JESD22-A115-A exceeds 200 V.  
Specified from 40 °C to +85 °C and 40 °C to +125 °C.  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf 2.5 ns.  
SYMBOL  
PARAMETER  
propagation delay  
CONDITIONS  
TYPICAL  
UNIT  
ns  
tPHL/tPLH  
VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ  
3.2  
inputs A, B to output Y  
VCC = 2.5 V; CL = 30 pF; RL = 500 2.2  
VCC = 2.7 V; CL = 50 pF; RL = 500 2.5  
ns  
ns  
ns  
ns  
pF  
pF  
VCC = 3.3 V; CL = 50 pF; RL = 500 2.1  
VCC = 5.0 V; CL = 50 pF; RL = 500 1.7  
CI  
input capacitance  
5
CPD  
power dissipation capacitance per buffer VCC = 3.3 V; notes 1 and 2  
14  
Notes  
1. CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts;  
N = total load switching outputs;  
Σ(CL × VCC2 × fo) = sum of the outputs.  
2. The condition is VI = GND to VCC  
.
2004 Sep 07  
2
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
FUNCTION TABLE  
See note 1.  
INPUT  
OUTPUT  
A
B
Y
L
L
L
H
L
H
L
L
L
H
H
H
Note  
1. H = HIGH voltage level;  
L = LOW voltage level.  
ORDERING INFORMATION  
TYPE NUMBER  
PACKAGE  
TEMPERATURE  
RANGE  
PINS  
PACKAGE MATERIAL  
CODE  
MARKING  
74LVC1G02GW  
74LVC1G02GV  
74LVC1G02GM  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
5
5
5
SC-88A  
SC-74A  
XSON6  
plastic  
plastic  
plastic  
SOT353  
SOT753  
SOT886  
VB  
V02  
VB  
PINNING  
PIN (TSSOP5 AND VSSOP5)  
PIN (XSON6)  
SYMBOL  
DESCRIPTION  
1
2
3
4
-
1
2
3
4
5
6
B
data input B  
data input A  
ground (0 V)  
data output Y  
not connected  
supply voltage  
A
GND  
Y
n.c.  
VCC  
5
02  
B
A
1
2
3
6
5
4
V
CC  
1
2
3
5
4
B
A
V
Y
CC  
n.c.  
Y
02  
GND  
GND  
001aab611  
001aab610  
Transparent top view  
Fig.1 Pin configuration TSSOP5 and VSSOP5.  
Fig.2 Pin configuration XSON6.  
2004 Sep 07  
3
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
handbook, halfpage  
1
2
handbook, halfpage  
1
2
B
A
1  
4
Y
4
MNA165  
MNA103  
Fig.3 Logic symbol.  
Fig.4 IEE/IEC logic symbol.  
handbook, halfpage  
B
Y
A
MNA166  
Fig.5 Logic diagram.  
2004 Sep 07  
4
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
RECOMMENDED OPERATING CONDITIONS  
SYMBOL  
VCC  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
1.65  
MAX.  
5.5  
UNIT  
V
VI  
input voltage  
0
5.5  
VCC  
5.5  
+125  
20  
V
VO  
output voltage  
active mode  
0
V
VCC = 0 V; Power-down mode  
0
V
Tamb  
tr, tf  
operating ambient temperature  
input rise and fall times  
40  
0
°C  
VCC = 1.65 V to 2.7 V  
VCC = 2.7 V to 5.5 V  
ns/V  
ns/V  
0
10  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).  
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT  
VCC supply voltage 0.5 +6.5  
V
IIK  
input diode current  
input voltage  
VI < 0 V  
note 1  
50  
mA  
V
VI  
0.5  
+6.5  
±50  
IOK  
VO  
output diode current  
output voltage  
VO > VCC or VO < 0 V  
mA  
V
active mode; notes 1 and 2  
0.5  
VCC + 0.5  
+6.5  
±50  
Power-down mode; notes 1 and 2 0.5  
V
IO  
output source and sink current  
VCC or GND current  
VO = 0 V to VCC  
mA  
mA  
°C  
mW  
ICC, IGND  
Tstg  
±100  
+150  
250  
storage temperature  
power dissipation  
65  
PD  
Tamb = 40 °C to +125 °C  
Notes  
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.  
2004 Sep 07  
5
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
DC CHARACTERISTICS  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.(1)  
MAX.  
UNIT  
OTHER  
VCC (V)  
Tamb = 40 °C to +85 °C  
VIH  
HIGH-level input  
voltage  
1.65 to 1.95 0.65 × VCC  
V
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
1.7  
V
V
V
V
V
V
V
2.0  
0.7 × VCC  
VIL  
LOW-level input  
voltage  
0.35 × VCC  
0.7  
0.8  
0.3 × VCC  
VOL  
LOW-level output  
voltage  
VI = VIH or VIL  
IO = 100 µA  
IO = 4 mA  
1.65 to 5.5  
1.65  
2.3  
0.1  
V
V
V
V
V
V
0.45  
0.3  
IO = 8 mA  
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
VI = VIH or VIL  
IO = 100 µA  
IO = 4 mA  
IO = 8 mA  
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
2.7  
0.4  
3.0  
0.55  
0.55  
4.5  
VOH  
HIGH-level output  
voltage  
1.65 to 5.5  
1.65  
2.3  
V
CC 0.1  
V
1.2  
1.9  
2.2  
2.3  
3.8  
V
V
2.7  
V
3.0  
V
4.5  
V
ILI  
input leakage current VI = 5.5 V or GND 5.5  
±0.1  
±0.1  
±5  
±10  
µA  
µA  
Ioff  
power OFF leakage  
current  
VI or VO = 5.5 V  
0
ICC  
quiescent supply  
current  
VI = VCC or GND; 5.5  
IO = 0 A  
0.1  
5
10  
µA  
µA  
ICC  
additional quiescent  
VI = VCC 0.6 V;  
2.3 to 5.5  
500  
supply current per pin IO = 0 A  
2004 Sep 07  
6
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.(1)  
MAX.  
UNIT  
OTHER  
VCC (V)  
Tamb = 40 °C to +125 °C  
VIH  
HIGH-level input  
voltage  
1.65 to 1.95 0.65 × VCC  
V
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
1.7  
V
V
V
V
V
V
V
2.0  
0.7 × VCC  
VIL  
LOW-level input  
voltage  
0.35 × VCC  
0.7  
0.8  
0.3 × VCC  
VOL  
LOW-level output  
voltage  
VI = VIH or VIL  
IO = 100 µA  
IO = 4 mA  
1.65 to 5.5  
1.65  
2.3  
0.1  
V
V
V
V
V
V
0.70  
0.45  
0.60  
0.80  
0.80  
IO = 8 mA  
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
VI = VIH or VIL  
IO = 100 µA  
IO = 4 mA  
IO = 8 mA  
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
2.7  
3.0  
4.5  
VOH  
HIGH-level output  
voltage  
1.65 to 5.5  
1.65  
2.3  
V
CC 0.1  
V
0.95  
1.7  
1.9  
2.0  
3.4  
V
V
2.7  
V
3.0  
V
4.5  
V
ILI  
input leakage current VI = 5.5 V or GND 5.5  
±0.1  
±0.1  
±100  
±200  
µA  
µA  
Ioff  
power OFF leakage  
current  
VI or VO = 5.5 V  
0
ICC  
quiescent supply  
current  
VI = VCC or GND; 5.5  
IO = 0 A  
0.1  
5
200  
µA  
µA  
ICC  
additional quiescent  
VI = VCC 0.6 V;  
2.3 to 5.5  
5000  
supply current per pin IO = 0 A  
Note  
1. All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.  
2004 Sep 07  
7
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
AC CHARACTERISTICS  
GND = 0 V; tr = tf 2.0 ns.  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
WAVEFORMS  
VCC (V)  
Tamb = 40 °C to +85 °C  
tPHL/tPLH  
propagation delay  
A, B to Y  
see Figs 6 and 7  
1.65 to 1.95  
2.3 to 2.7  
2.7  
1.0  
3.2  
8.0  
ns  
0.5  
0.5  
0.5  
0.5  
2.2  
2.5  
2.1  
1.7  
5.5  
5.5  
4.5  
4.0  
ns  
ns  
ns  
ns  
3.0 to 3.6  
4.5 to 5.5  
Tamb = 40 °C to +125 °C  
tPHL/tPLH  
propagation delay  
A, B to Y  
see Figs 6 and 7  
1.65 to 1.95  
2.3 to 2.7  
2.7  
1.0  
0.5  
0.5  
0.5  
0.5  
10.5  
7.0  
7.0  
6.0  
5.5  
ns  
ns  
ns  
ns  
ns  
3.0 to 3.6  
4.5 to 5.5  
AC WAVEFORMS  
V
handbook, halfpage  
A, B input  
I
V
M
GND  
t
t
PHL  
PLH  
V
OH  
V
Y output  
M
MNA612  
V
OL  
INPUT  
VCC  
VM  
VI  
tr = tf  
1.65 V to 1.95 V 0.5 × VCC  
VCC  
2.0 ns  
2.0 ns  
2.5 ns  
2.5 ns  
2.5 ns  
2.3 V to 2.7 V  
2.7 V  
0.5 × VCC  
1.5 V  
VCC  
2.7 V  
2.7 V  
VCC  
3.0 V to 3.6 V  
4.5 V to 5.5 V  
1.5 V  
0.5 × VCC  
VOL and VOH are typical output voltage drop that occur with the output load.  
Fig.6 Input A, B to output Y propagation delay times.  
8
2004 Sep 07  
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
V
EXT  
V
CC  
R
L
V
V
O
I
PULSE  
GENERATOR  
D.U.T.  
C
R
R
L
L
T
MNA616  
VEXT  
VCC  
VI  
CL  
RL  
tPLH/tPHL  
tPZH/tPHZ  
tPZL/tPLZ  
1.65 V to 1.95 V VCC  
30 pF  
30 pF  
50 pF  
50 pF  
50 pF  
1 kΩ  
open  
open  
open  
open  
open  
GND  
GND  
GND  
GND  
GND  
2 × VCC  
2 × VCC  
6 V  
2.3 V to 2.7 V  
2.7 V  
VCC  
500 Ω  
500 Ω  
500 Ω  
500 Ω  
2.7 V  
2.7 V  
VCC  
3.0 V to 3.6 V  
4.5 V to 5.5 V  
6 V  
2 × VCC  
Definitions for test circuit:  
RL = Load resistor.  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.  
Fig.7 Load circuitry for switching times.  
2004 Sep 07  
9
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
PACKAGE OUTLINES  
Plastic surface mounted package; 5 leads  
SOT353  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
1
2
3
c
e
1
b
p
L
p
w
M B  
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
(2)  
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max  
0.30  
0.20  
1.1  
0.8  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.25  
0.15  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
SC-88A  
97-02-28  
SOT353  
2004 Sep 07  
10  
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
Plastic surface mounted package; 5 leads  
SOT753  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
p
1
2
3
detail X  
e
b
p
w
M B  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
A
1
b
c
D
E
e
H
L
Q
v
w
y
p
p
E
0.100  
0.013  
0.40  
0.25  
1.1  
0.9  
0.26  
0.10  
3.1  
2.7  
1.7  
1.3  
3.0  
2.5  
0.6  
0.2  
0.33  
0.23  
mm  
0.95  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
SOT753  
SC-74A  
02-04-16  
2004 Sep 07  
11  
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm  
SOT886  
b
1
2
3
4×  
(2)  
L
L
1
e
6
5
4
e
1
e
1
6×  
(2)  
A
A
1
D
E
terminal 1  
index area  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
A
1
UNIT  
b
D
E
e
e
L
L
1
1
max max  
0.25  
0.17  
1.5  
1.4  
1.05  
0.95  
0.35 0.40  
0.27 0.32  
mm  
0.5 0.04  
0.6  
0.5  
Notes  
1. Including plating thickness.  
2. Can be visible in some manufacturing processes.  
REFERENCES  
JEDEC JEITA  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
04-07-15  
04-07-22  
SOT886  
MO-252  
2004 Sep 07  
12  
Philips Semiconductors  
Product specification  
Single 2-input NOR gate  
74LVC1G02  
DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2004 Sep 07  
13  
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2004  
SCA76  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
R20/05/pp14  
Date of release: 2004 Sep 07  
Document order number: 9397 750 13753  
配单直通车
74LVC1G02GW产品参数
型号:74LVC1G02GW
是否Rohs认证: 符合
生命周期:Active
IHS 制造商:NEXPERIA
包装说明:TSSOP-5
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
风险等级:0.84
Samacsys Confidence:
Samacsys Status:Released
Samacsys PartID:342915
Samacsys Pin Count:5
Samacsys Part Category:Integrated Circuit
Samacsys Package Category:Other
Samacsys Footprint Name:SOT65P210X110-5N
Samacsys Released Date:2017-01-12 09:39:31
Is Samacsys:N
系列:LVC/LCX/Z
JESD-30 代码:R-PDSO-G5
JESD-609代码:e3
长度:2.05 mm
逻辑集成电路类型:NOR GATE
湿度敏感等级:1
功能数量:1
输入次数:2
端子数量:5
最高工作温度:125 °C
最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260
传播延迟(tpd):10.5 ns
认证状态:Not Qualified
座面最大高度:1.1 mm
最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):1.8 V
表面贴装:YES
技术:CMOS
温度等级:AUTOMOTIVE
端子面层:Tin (Sn)
端子形式:GULL WING
端子节距:0.65 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:30
宽度:1.25 mm
Base Number Matches:1
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