80N08
Preliminary
Power MOSFET
ABSOLUTE MAXIMUM RATINGS (TJ= 25 °C, unless otherwise specified)
PARAMETER
SYMBOL
ID
TEST CONDITIONS
TC=25 °C, VGS=10 V
TC=100 °C, VGS=10 V (Note 2)
RATINGS
80
UNIT
A
Continuous Drain Current (Note 1)
80
Pulsed Drain Current (Note 2)
Avalanche Energy, Single Pulse (Note 2)
Gate Source Voltage (Note 3)
Power Dissipation
ID,pulse TC=25 °C
320
A
mJ
V
EAS
VGS
PTOT
TJ
ID=80A
810
±20
TC=25 °C
300
W
°C
°C
Junction Temperature
+150
-55 ~ +150
Storage Temperature
TSTG
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
THERMAL DATA
PARAMETER
SYMBOL
θJA
RATINGS
UNIT
Junction to Ambient
Junction to Case
62
K/W
K/W
θJC
0.5
ELECTRICAL CHARACTERISTICS (TJ =25°C, unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNIT
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS
IDSS
ID=1mA, VGS=0V
80
V
VDS=75V, VGS=0V, TJ=25°C
VDS=75V, VGS=0V, TJ=125°C 2
VDS=0V, VGS=20V
0.01
1
1
Drain-Source Leakage Current
µA
nA
100
100
Gate-Source Leakage Current
ON CHARACTERISTICS
Gate Threshold Voltage
Static Drain-Source On-State Resistance
DYNAMIC PARAMETERS (Note 2)
Input Capacitance
IGSS
1
VGS(TH)
RDS(ON)
VDS=VGS, ID=250µA
VGS=10V, ID=80A
2.1
3.0
4.0
12
V
mΩ
CISS
COSS
CRSS
4700
1260
580
pF
pF
pF
VGS=0V, VDS=25V, f=1.0MHz
Output Capacitance
Reverse Transfer Capacitance
SWITCHING PARAMETERS (Note 2)
Gate to Source Charge
Gate to Drain Charge
QGS
QGD
QG
25
69
37
nC
nC
nC
V
VDD=60V, VGS=0~10V, ID=80A
116
180
Total Gate Charge
144
5.4
26
Gate Plateau Voltage
Vplateau
tD(ON)
tR
Turn-ON Delay Time
ns
ns
ns
ns
Rise Time
VDD=40V, RG=2.2Ω
ID=80A, VGS=10V
50
Turn-OFF Delay Time
Fall-Time
tD(OFF)
tF
61
30
SOURCE- DRAIN DIODE RATINGS AND CHARACTERISTICS
Maximum Body-Diode Continuous Current
Pulsed Current
IS
IS, pulse
VSD
80
TC=25°C (Note 2)
A
320
1.3
IF=80A, VGS=0V, TJ=25°C
IF= IS, dIF/dt=100A/µs
VR=40V
0.9
110
470
V
Drain-Source Diode Forward Voltage (Note1)
Reverse Recovery Time (Note 2)
Reverse Recovery Charge (Note 2)
tRR
140
590
ns
nC
QRR
Note: 1. Current is limited by bondwire; with an θJC= 0.5K/W the chip is able to carry 132A at 25°C.
2. Defined by design. Not subject to production test.
3. Qualified at -20V and +20V.
UNISONIC TECHNOLOGIES CO., LTD
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QW-R502-468.a
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