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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • 93LC46CT-I/SN
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  • 93LC46CT-I/SN图
  • 深圳市高捷芯城科技有限公司

     该会员已使用本站11年以上
  • 93LC46CT-I/SN 现货库存
  • 数量7389 
  • 厂家MICROCHIP(美国微芯) 
  • 封装SOP-8 
  • 批号23+ 
  • 百分百原装正品,可原型号开票
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    QQ:3007947087QQ:3007947087 复制
  • 0755-83062789 QQ:3007977934QQ:3007947087
  • 93LC46CT-I/SN图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • 93LC46CT-I/SN 现货库存
  • 数量26890 
  • 厂家MICROCHIP/微芯 
  • 封装SOP8 
  • 批号21+ 
  • 新到现货、一手货源、当天发货、bom配单
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  • 0755-84507451 QQ:1435424310
  • 93LC46CT-I/SN图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • 93LC46CT-I/SN
  • 数量98500 
  • 厂家MICROCHIP 
  • 封装SOP8 
  • 批号23+ 
  • 真实库存全新原装正品!代理此型号
  • QQ:2881495751QQ:2881495751 复制
  • 0755-88917743 QQ:2881495751
  • 93LC46CT-I/SN图
  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
  • 93LC46CT-I/SN
  • 数量65000 
  • 厂家MICROCHIP(美国微芯) 
  • 封装SOIC-8 
  • 批号23+ 
  • 真实库存全新原装正品!代理此型号
  • QQ:2881495753QQ:2881495753 复制
  • 0755-23605827 QQ:2881495753
  • 93LC46CT-I/SN图
  • 深圳市芯鹏泰科技有限公司

     该会员已使用本站8年以上
  • 93LC46CT-I/SN
  • 数量6635 
  • 厂家Microchip Technology 
  • 封装8-SOIC 
  • 批号23+ 
  • 存储器IC原装现货
  • QQ:892152356QQ:892152356 复制
  • 0755-82777852 QQ:892152356
  • 93LC46CT-I/SN图
  • 北京耐芯威科技有限公司

     该会员已使用本站13年以上
  • 93LC46CT-I/SN
  • 数量5000 
  • 厂家Microchip Technology 
  • 封装8-SOIC 
  • 批号21+ 
  • 全新原装、现货库存,欢迎询价
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  • 86-010-010-62104931 QQ:2880824479QQ:1344056792
  • 93LC46CT-I/SN图
  • 北京耐芯威科技有限公司

     该会员已使用本站12年以上
  • 93LC46CT-I/SN
  • 数量5000 
  • 厂家Microchip Technology 
  • 封装8-SOIC 
  • 批号21+ 
  • 全新原装、现货库存,欢迎询价
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    QQ:1344056792QQ:1344056792 复制
  • 96-010-62104931 QQ:2880824479QQ:1344056792
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  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • 93LC46CT-I/SN
  • 数量2394 
  • 厂家MROCHIP/微芯 
  • 封装NA/ 
  • 批号23+ 
  • 优势代理渠道,原装正品,可全系列订货开增值税票
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    QQ:3007947087QQ:3007947087 复制
  • 0755-82546830 QQ:3007977934QQ:3007947087
  • 93LC46CT-I/SN图
  • 集好芯城

     该会员已使用本站13年以上
  • 93LC46CT-I/SN
  • 数量5041 
  • 厂家Microchip Technology 
  • 封装 
  • 批号最新批次 
  • 原厂原装公司现货
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    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • 93LC46CT-I/SN图
  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • 93LC46CT-I/SN
  • 数量5000 
  • 厂家Microchip Technology 
  • 封装8-SOIC 
  • 批号21+ 
  • 全新原装、现货库存,欢迎询价
  • QQ:2880824479QQ:2880824479 复制
    QQ:1344056792QQ:1344056792 复制
  • 010-62104931 QQ:2880824479QQ:1344056792
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  • 深圳市宏捷佳电子科技有限公司

     该会员已使用本站12年以上
  • 93LC46CT-I/SN
  • 数量15300 
  • 厂家Microchip Technology 
  • 封装8-SOIC(0.154,3.90mm 宽) 
  • 批号24+ 
  • 只做原装★真实库存★含13点增值税票!
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    QQ:2885134615QQ:2885134615 复制
  • 0755-83201583 QQ:2353549508QQ:2885134615
  • 93LC46CT-I/SNG图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • 93LC46CT-I/SNG
  • 数量15862 
  • 厂家MICROCHIP 
  • 封装SOP-8 
  • 批号23+ 
  • 全新原装正品现货热卖
  • QQ:2885348317QQ:2885348317 复制
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  • 0755-83209630 QQ:2885348317QQ:2885348339
  • 93LC46CT-I/SN图
  • 北京齐天芯科技有限公司

     该会员已使用本站15年以上
  • 93LC46CT-I/SN
  • 数量5600 
  • 厂家Microchip 
  • 封装8-SOIC N 
  • 批号16+ 
  • 原装正品,假一罚十
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    QQ:1344056792QQ:1344056792 复制
  • 010-62104931 QQ:2880824479QQ:1344056792
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  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • 93LC46CT-I/SN
  • 数量36218 
  • 厂家MICROCHIP-微芯 
  • 封装SOP-8.贴片 
  • 批号▉▉:2年内 
  • ▉▉¥2.3元一有问必回一有长期订货一备货HK仓库
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  • 131-4700-5145---Q-微-恭-候---有-问-秒-回 QQ:43871025
  • 93LC46CT-I/SN图
  • 深圳市华芯盛世科技有限公司

     该会员已使用本站13年以上
  • 93LC46CT-I/SN
  • 数量865000 
  • 厂家MICROCHIP/微芯 
  • 封装SOP8 
  • 批号最新批号 
  • 一级代理,原装特价现货!
  • QQ:2881475757QQ:2881475757 复制
  • 0755-83225692 QQ:2881475757
  • 93LC46CT-I/SN图
  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • 93LC46CT-I/SN
  • 数量5000 
  • 厂家Microchip Technology 
  • 封装贴/插片 
  • 批号16+ 
  • 百分百原装正品,现货库存
  • QQ:857273081QQ:857273081 复制
    QQ:1594462451QQ:1594462451 复制
  • 010-62104931 QQ:857273081QQ:1594462451
  • 93LC46CT-I/SN图
  • 深圳市毅创腾电子科技有限公司

     该会员已使用本站16年以上
  • 93LC46CT-I/SN
  • 数量1000 
  • 厂家MIC 
  • 封装SOP-8 
  • 批号22+ 
  • ★只做原装★正品现货★原盒原标★
  • QQ:2355507165QQ:2355507165 复制
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  • 86-0755-83210909 QQ:2355507165QQ:2355507162
  • 93LC46CT-I/SN图
  • 深圳市一呈科技有限公司

     该会员已使用本站9年以上
  • 93LC46CT-I/SN
  • 数量3210 
  • 厂家Microchip(微芯) 
  • 封装SOIC-8 
  • 批号23+ 
  • ▉原厂渠道▉支持实单
  • QQ:3003797048QQ:3003797048 复制
    QQ:3003797050QQ:3003797050 复制
  • 0755-82779553 QQ:3003797048QQ:3003797050
  • 93LC46CT-I/SNG图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • 93LC46CT-I/SNG
  • 数量15862 
  • 厂家MICROCHIP 
  • 封装SOP-8 
  • 批号23+ 
  • 全新原装正品现货热卖
  • QQ:2885348339QQ:2885348339 复制
    QQ:2885348317QQ:2885348317 复制
  • 0755-82519391 QQ:2885348339QQ:2885348317
  • 93LC46CT-I/SN图
  • 深圳市英德州科技有限公司

     该会员已使用本站2年以上
  • 93LC46CT-I/SN
  • 数量9800 
  • 厂家Microchip(微芯) 
  • 封装SOIC-8 
  • 批号2年内 
  • 全新原装 货源稳定 长期供应 提供配单
  • QQ:2355734291QQ:2355734291 复制
  • -0755-88604592 QQ:2355734291
  • 93LC46CT-I/SN图
  • 昂富(深圳)电子科技有限公司

     该会员已使用本站4年以上
  • 93LC46CT-I/SN
  • 数量1950 
  • 厂家MICROCHIP/微芯 
  • 封装SOP8 
  • 批号24+ 
  • 一站式BOM配单,短缺料找现货,怕受骗,就找昂富电子.
  • QQ:GTY82dX7
  • 0755-23611557【陈妙华 QQ:GTY82dX7
  • 93LC46CT-I/SN图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • 93LC46CT-I/SN
  • 数量8500 
  • 厂家MICROCHIP(美国微芯) 
  • 封装SOIC-8 
  • 批号新年份 
  • 羿芯诚只做原装,原厂渠道,价格优势可谈!
  • QQ:2853992132QQ:2853992132 复制
  • 0755-82570683 QQ:2853992132
  • 93LC46CT-I/SN图
  • 深圳市芳益电子科技有限公司

     该会员已使用本站10年以上
  • 93LC46CT-I/SN
  • 数量20000 
  • 厂家MICROCHI 
  • 封装sop dip 
  • 批号2023+ 
  • 原装现货库存 MICRCHI全系列配套 欢迎加Q详谈
  • QQ:498361569QQ:498361569 复制
    QQ:389337416QQ:389337416 复制
  • 0755-13631573466 QQ:498361569QQ:389337416
  • 93LC46CT-I/SN图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • 93LC46CT-I/SN
  • 数量8500 
  • 厂家原厂品牌 
  • 封装原厂封装 
  • 批号新年份 
  • 羿芯诚只做原装长期供,支持实单
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  • 0755-82570600 QQ:2880123150
  • 93LC46CT-I/SN图
  • 深圳市富莱微科技有限公司

     该会员已使用本站6年以上
  • 93LC46CT-I/SN
  • 数量7407 
  • 厂家Microchip Technology 
  • 封装8-SOIC 
  • 批号20+ 
  • 进口原装,公司现货
  • QQ:1968343307QQ:1968343307 复制
    QQ:2885835292QQ:2885835292 复制
  • 0755-83210149 QQ:1968343307QQ:2885835292
  • 93LC46CT-I/SN图
  • 深圳市鹏睿康科技有限公司

     该会员已使用本站16年以上
  • 93LC46CT-I/SN
  • 数量1200 
  • 厂家MICROCHIP 
  • 封装只做原装 
  • 批号23+ 
  • 原装现货假一赔万,原包原标,支持实单
  • QQ:2885392746QQ:2885392746 复制
    QQ:2885392744QQ:2885392744 复制
  • 0755-83192793 QQ:2885392746QQ:2885392744
  • 93LC46CT-I/SN图
  • 深圳市思诺康科技有限公司

     该会员已使用本站16年以上
  • 93LC46CT-I/SN
  • 数量12638 
  • 厂家Microchip Technology 
  • 封装8-SOIC 
  • 批号23+ 
  • IC-存储器
  • QQ:2881281130QQ:2881281130 复制
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  • 0755-83286481 QQ:2881281130QQ:2881281133
  • 93LC46CT-I/SN图
  • 深圳市芯柏然科技有限公司

     该会员已使用本站7年以上
  • 93LC46CT-I/SN
  • 数量1950 
  • 厂家MICROCHIP/微芯 
  • 封装SOP8 
  • 批号21+ 
  • 新到现货、一手货源、当天发货、价格低于市场
  • QQ:287673858QQ:287673858 复制
  • 0755-82533534 QQ:287673858
  • 93LC46CT-I/SN图
  • 深圳市惠诺德电子有限公司

     该会员已使用本站7年以上
  • 93LC46CT-I/SN
  • 数量29500 
  • 厂家Microchip Technology 
  • 封装IC EEPROM 1KBIT SPI 3MHZ 8MSOP 
  • 批号21+ 
  • 只做原装现货代理
  • QQ:1211267741QQ:1211267741 复制
    QQ:1034782288QQ:1034782288 复制
  • 159-7688-9073 QQ:1211267741QQ:1034782288
  • 93LC46CT-I/SN图
  • 深圳市卓越微芯电子有限公司

     该会员已使用本站12年以上
  • 93LC46CT-I/SN
  • 数量5300 
  • 厂家MIC 
  • 封装SOP-8 
  • 批号20+ 
  • 百分百原装正品 真实公司现货库存 本公司只做原装 可开13%增值税发票,支持样品,欢迎来电咨询!
  • QQ:1437347957QQ:1437347957 复制
    QQ:1205045963QQ:1205045963 复制
  • 0755-82343089 QQ:1437347957QQ:1205045963
  • 93LC46CT-I/SN图
  • 深圳市诚达吉电子有限公司

     该会员已使用本站2年以上
  • 93LC46CT-I/SN
  • 数量9738 
  • 厂家MIC 
  • 封装SOP-8 
  • 批号2024+ 
  • 原装正品 一手现货 假一赔百
  • QQ:2881951980QQ:2881951980 复制
  • 15873513267 QQ:2881951980
  • 93LC46CT-I/SN图
  • 深圳市中利达电子科技有限公司

     该会员已使用本站11年以上
  • 93LC46CT-I/SN
  • 数量10000 
  • 厂家MICROCHIP/微芯 
  • 封装SOP8 
  • 批号24+ 
  • 原装进口现货 假一罚十
  • QQ:1902134819QQ:1902134819 复制
    QQ:2881689472QQ:2881689472 复制
  • 0755-83200645 QQ:1902134819QQ:2881689472
  • 93LC46CT-I/SN图
  • 万三科技(深圳)有限公司

     该会员已使用本站2年以上
  • 93LC46CT-I/SN
  • 数量6500000 
  • 厂家微芯 
  • 封装原厂原装 
  • 批号22+ 
  • 万三科技 秉承原装 实单可议
  • QQ:3008961396QQ:3008961396 复制
  • 0755-21008751 QQ:3008961396
  • 93LC46CT-I/SN图
  • 深圳市隆鑫创展电子有限公司

     该会员已使用本站15年以上
  • 93LC46CT-I/SN
  • 数量30000 
  • 厂家NXP 
  • 封装SOT89 
  • 批号2022+ 
  • 电子元器件一站式配套服务QQ:122350038
  • QQ:2355878626QQ:2355878626 复制
    QQ:2850299242QQ:2850299242 复制
  • 0755-82812278 QQ:2355878626QQ:2850299242
  • 93LC46CT-I/SN图
  • 深圳市宇川湘科技有限公司

     该会员已使用本站6年以上
  • 93LC46CT-I/SN
  • 数量23000 
  • 厂家MICROCHIP 
  • 封装原封装 
  • 批号23+ 
  • 原装正品现货,郑重承诺只做原装!
  • QQ:2885348305QQ:2885348305 复制
    QQ:2885348305QQ:2885348305 复制
  • 0755-84534256 QQ:2885348305QQ:2885348305
  • 93LC46CT-I/SNG图
  • 深圳市一线半导体有限公司

     该会员已使用本站15年以上
  • 93LC46CT-I/SNG
  • 数量16500 
  • 厂家原厂品牌 
  • 封装原厂外观 
  • 批号 
  • 全新原装部分现货其他订货
  • QQ:2881493920QQ:2881493920 复制
    QQ:2881493921QQ:2881493921 复制
  • 0755-88608801多线 QQ:2881493920QQ:2881493921
  • 93LC46CT-I/SN图
  • 深圳市一线半导体有限公司

     该会员已使用本站11年以上
  • 93LC46CT-I/SN
  • 数量30000 
  • 厂家Microchip Technology 
  • 封装 
  • 批号 
  • 全新原装部分现货其他订货
  • QQ:2881493920QQ:2881493920 复制
    QQ:2881493921QQ:2881493921 复制
  • 0755-88608801多线 QQ:2881493920QQ:2881493921
  • 93LC46CT-I/SNG(P/B)图
  • 深圳市科庆电子有限公司

     该会员已使用本站16年以上
  • 93LC46CT-I/SNG(P/B)
  • 数量2241 
  • 厂家MICROCHIP 
  • 封装SOP-8 
  • 批号23+ 
  • 只做进口原装/到货/可含13%税
  • QQ:2850188252QQ:2850188252 复制
    QQ:2850188256QQ:2850188256 复制
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产品型号93LC46CT-I/SN的概述

芯片93LC46CT-I/SN的概述 93LC46CT-I/SN是一款由Microchip Technology Inc.设计和生产的串行高密度非易失性存储器。这款芯片采用了EEPROM(电可擦可编程只读存储器)技术,主要用于低功耗、低成本的应用场景。其设计目标是为各种嵌入式系统提供灵活的存储解决方案,适用于数据记录、配置信息存储和其他需要非易失性存储的应用。 该芯片支持串行接口,允许简单而高效的读写操作,特别适合刷新的数据保留需求。其封装设计紧凑,因此在空间受限的设备中表现良好。这种芯片广泛应用于消费电子、工业设备、通讯设备等多个领域。 芯片93LC46CT-I/SN的详细参数 93LC46CT-I/SN的主要技术参数如下: - 存储容量: 1K位(128字节) - 工作电压: 2.5V到5.5V,可灵活适应不同的电源环境 - 工作温度范围: -40°C到+85°C,适合于多种气候条...

产品型号93LC46CT-I/SN的Datasheet PDF文件预览

93AA46A/B/C, 93LC46A/B/C,  
93C46A/B/C  
1K Microwire Compatible Serial EEPROM  
Device Selection Table  
Part Number  
VCC Range  
ORG Pin  
Word Size  
Temp Ranges  
Packages  
93AA46A  
93AA46B  
93LC46A  
93LC46B  
93C46A  
1.8-5.5  
1.8-5-5  
2.5-5.5  
2.5-5.5  
4.5-5.5  
4.5-5.5  
No  
No  
No  
No  
No  
No  
Yes  
8-bit  
16-bit  
8-bit  
I
P, SN, ST, MS, OT  
P, SN, ST, MS, OT  
P, SN, ST, MS, OT  
P, SN, ST, MS, OT  
P, SN, ST, MS, OT  
P, SN, ST, MS, OT  
I
I, E  
I, E  
I, E  
I, E  
16-bit  
8-bit  
93C46B  
16-bit  
93AA46C  
93LC46C  
1.8-5.5  
2.5-5.5  
8 or 16-bit  
8 or 16-bit  
I
P, SN, ST, MS  
P, SN, ST, MS  
P, SN, ST, MS  
Yes  
Yes  
I, E  
93C46C  
4.5-5.5  
8 or 16-bit  
I, E  
Features  
Description  
• Low-power CMOS technology  
The Microchip Technology Inc. 93XX46A/B/C devices  
are 1K bit low voltage serial Electrically Erasable  
PROMs (EEPROM). Word-selectable devices such as  
the 93AA46C, 93LC46C or 93C46C are dependent  
upon external logic levels driving the ORG pin to set  
word size. For dedicated 8-bit communication, the  
93AA46A, 93LC46A or 93C46A devices are available,  
while the 93AA46B, 93LC46B and 93C46B devices  
provide dedicated 16-bit communication. Advanced  
CMOS technology makes these devices ideal for low  
power, nonvolatile memory applications. The entire  
93XX Series is available in standard packages includ-  
ing 8-lead PDIP and SOIC, and advanced packaging  
including 8-lead MSOP, 6-lead SOT-23, and 8-lead  
TSSOP. Pb-free (Pure Matte Sn) finish is also  
available.  
• ORG pin to select word size for ‘46C version  
• 128 x 8-bit organization ‘A’ ver. devices (no ORG)  
• 64 x 16-bit organization ‘B’ ver. devices (no ORG)  
• Self-timed ERASE/WRITE cycles (including  
auto-erase)  
• Automatic ERAL before WRAL  
• Power-on/off data protection circuitry  
• Industry standard 3-wire serial I/O  
• Device Status signal (READY/BUSY)  
• Sequential READ function  
• 1,000,000 E/W cycles  
• Data retention > 200 years  
Temperature ranges supported  
- Industrial (I)  
-40°C to +85°C  
-40°C to +125°C  
Package Types (not to scale)  
- Automotive (E)  
ROTATED SOIC  
(ex: 93LC46BX)  
PDIP/SOIC  
(P, SN)  
Pin Function Table  
NC  
1
2
3
4
8
7
6
5
ORG*  
CS  
CLK  
DI  
VCC  
1
2
3
4
8
7
6
5
Name  
Function  
VCC  
VSS  
NC  
CS  
CLK  
DI  
Chip Select  
Serial Data Clock  
Serial Data Input  
Serial Data Output  
Ground  
CS  
DO  
DI  
ORG*  
CLK  
DO  
VSS  
TSSOP/MSOP  
(ST, MS)  
SOT-23  
(OT)  
DO  
1
2
3
4
8
7
6
5
CS  
CLK  
DI  
DO  
VCC  
1
2
3
6
5
4
DO  
VCC  
VSS  
NC  
NC  
ORG*  
VSS  
VSS  
CS  
No internal connection  
Memory Configuration  
Power Supply  
DI  
CLK  
* ORG pin is NC on A/B devices  
ORG  
VCC  
2003 Microchip Technology Inc.  
DS21749D-page 1  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
1.0  
ELECTRICAL CHARACTERISTICS  
(†)  
Absolute Maximum Ratings  
VCC.............................................................................................................................................................................7.0V  
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V  
Storage temperature ...............................................................................................................................-65°C to +150°C  
Ambient temperature with power applied................................................................................................-40°C to +125°C  
ESD protection on all pins ......................................................................................................................................................≥ 4 kV  
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to  
the device. This is a stress rating only and functional operation of the device at those or any other conditions  
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating  
conditions for extended periods may affect device reliability.  
TABLE 1-1:  
DC CHARACTERISTICS  
VCC = range by device (see Table on Page 1)  
Industrial (I): TA = -40°C to +85°C  
Automotive (E): TA = -40°C to +125°C  
All parameters apply over the specified ranges  
unless otherwise noted.  
Param. No. Symbol  
Parameter  
Min  
Typ  
Max  
Units  
Conditions  
VCC 2.7V  
D1  
D2  
D3  
D4  
VIH1  
VIH2  
High-level input voltage  
2.0  
0.7 VCC  
VCC +1  
VCC +1  
V
V
VCC < 2.7V  
VIL1  
VIL2  
Low-level input voltage  
Low-level output voltage  
High-level output voltage  
-0.3  
-0.3  
0.8  
0.2 VCC  
V
V
VCC 2.7V  
VCC < 2.7V  
VOL1  
VOL2  
0.4  
0.2  
V
V
IOL = 2.1 mA, VCC = 4.5V  
IOL = 100 µA, VCC = 2.5V  
VOH1  
VOH2  
2.4  
VCC - 0.2  
V
V
IOH = -400 µA, VCC = 4.5V  
IOH = -100 µA, VCC = 2.5V  
D5  
D6  
D7  
ILI  
Input leakage current  
Output leakage current  
±1  
±1  
7
µA VIN = VSS to VCC  
µA VOUT = VSS to VCC  
ILO  
CIN,  
Pin capacitance  
pF VIN/VOUT = 0V (Note 1)  
COUT  
(all inputs/outputs)  
TA = 25°C, FCLK = 1 MHz  
D8  
D9  
ICC  
write  
Write current  
500  
2
mA FCLK = 3 MHz, VCC = 5.5V  
µA FCLK = 2 MHz, VCC = 2.5V  
ICC read Read current  
100  
1
500  
mA FCLK = 3 MHz, VCC = 5.5V  
µA FCLK = 2 MHz, VCC = 3.0V  
µA FCLK = 2 MHz, VCC = 2.5V  
D10  
D11  
ICCS  
Standby current  
1
5
µA I-Temp  
µA E-Temp  
CLK = CS = 0V  
ORG = DI = VSS or VCC  
(Note 2) (NOTE 3)  
VPOR  
VCC voltage detect  
93AA46A/B/C, 93LC46A/B/C  
93C46A/B/C  
1.5V  
3.8V  
V
V
(Note 1)  
Note 1: This parameter is periodically sampled and not 100% tested.  
2: ORG pin not available on ‘A’ or ‘B’ versions.  
3: READY/BUSY status must be cleared from DO, see Section 3.4 "Data Out (DO)".  
DS21749D-page 2  
2003 Microchip Technology Inc.  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
TABLE 1-2:  
AC CHARACTERISTICS  
VCC = range by device (see Table on Page 1)  
Industrial (I): TA = -40°C to +85°C  
Automotive (E): TA = -40°C to +125°C  
All parameters apply over the specified  
ranges unless otherwise noted.  
Param. No. Symbol  
Parameter  
Min  
Max  
Units  
Conditions  
A1  
A2  
A3  
A4  
FCLK  
TCKH  
TCKL  
TCSS  
Clock frequency  
3
2
1
MHz 4.5V VCC < 5.5V, 93XX46C only  
MHz 2.5V VCC < 5.5V  
MHz 1.8V VCC < 2.5V  
Clock high time  
200  
250  
450  
ns  
ns  
ns  
4.5V VCC < 5.5V, 93XX46C only  
2.5V VCC < 5.5V  
1.8V VCC < 2.5V  
Clock low time  
100  
200  
450  
ns  
ns  
ns  
4.5V VCC < 5.5V, 93XX46C only  
2.5V VCC < 5.5V  
1.8V VCC < 2.5V  
Chip Select setup time  
50  
100  
250  
ns  
ns  
ns  
4.5V VCC < 5.5V  
2.5V VCC < 4.5V  
1.8V VCC < 2.5V  
A5  
A6  
A7  
TCSH  
TCSL  
TDIS  
Chip Select hold time  
Chip Select low time  
Data input setup time  
0
ns  
ns  
ns  
1.8V VCC < 5.5V  
1.8V VCC < 5.5V  
250  
50  
100  
250  
4.5V VCC < 5.5V, 93XX46C only  
2.5V VCC < 5.5V  
1.8V VCC < 2.5V  
A8  
A9  
TDIH  
TPD  
Data input hold time  
50  
100  
250  
ns  
ns  
4.5V VCC < 5.5V, 93XX46C only  
2.5V VCC < 5.5V  
1.8V VCC < 2.5V  
Data output delay time  
200  
250  
400  
4.5V VCC < 5.5V, CL = 100 pF  
2.5V VCC < 4.5V, CL = 100 pF  
1.8V VCC < 2.5V, CL = 100 pF  
A10  
A11  
TCZ  
TSV  
Data output disable time  
Status valid time  
100  
200  
ns  
ns  
4.5V VCC < 5.5V, (Note 1)  
1.8V VCC < 4.5V, (Note 1)  
200  
300  
500  
4.5V VCC < 5.5V, CL = 100 pF  
2.5V VCC < 4.5V, CL = 100 pF  
1.8V VCC < 2.5V, CL = 100 pF  
A12  
TWC  
Program cycle time  
6
ms  
Erase/Write mode (AA and LC  
versions)  
A13  
A14  
A15  
A16  
TWC  
TEC  
TWL  
2
6
ms  
ms  
ms  
Erase/Write mode (93C versions)  
ERAL mode, 4.5V VCC 5.5V  
WRAL mode, 4.5V VCC 5.5V  
15  
Endurance  
1M  
cycles 25°C, VCC = 5.0V, (Note 2)  
Note 1: This parameter is periodically sampled and not 100% tested.  
2: This application is not tested but ensured by characterization. For endurance estimates in a specific  
application, please consult the Total Endurance™ Model which may be obtained from www.microchip.com.  
2003 Microchip Technology Inc.  
DS21749D-page 3  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
FIGURE 1-1:  
SYNCHRONOUS DATA TIMING  
VIH  
VIL  
VIH  
CS  
TCSS  
TCKH  
TCKL  
TCSH  
CLK  
DI  
VIL  
TDIS  
TDIH  
VIH  
VIL  
TCZ  
TCZ  
TPD  
TPD  
VOH  
DO  
(READ)  
VOL  
VOH  
TSV  
DO  
(PROGRAM)  
STATUS VALID  
VOL  
Note: TSV is relative to CS.  
TABLE 1-3: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX46B OR 93XX46C WITH ORG = 1)  
Instruction  
SB  
Opcode  
Address  
Data In  
Data Out  
Req. CLK Cycles  
1
1
1
1
1
1
1
11  
00  
00  
00  
10  
01  
00  
A5  
1
A4  
0
A3  
X
A2  
X
A1  
X
A0  
X
(RDY/BSY)  
(RDY/BSY)  
HIGH-Z  
9
9
ERASE  
ERAL  
EWDS  
EWEN  
READ  
WRITE  
WRAL  
0
0
X
X
X
X
9
1
1
X
X
X
X
HIGH-Z  
9
A5  
A5  
0
A4  
A4  
1
A3  
A3  
X
A2  
A2  
X
A1  
A1  
X
A0  
A0  
X
D15 - D0  
25  
25  
25  
D15 - D0  
D15 - D0  
(RDY/BSY)  
(RDY/BSY)  
TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX46A OR 93XX46C WITH ORG = 0)  
Instruction  
SB  
Opcode  
Address  
Data In  
Data Out  
Req. CLK Cycles  
1
1
1
1
1
1
1
11  
00  
00  
00  
10  
01  
00  
A6 A5 A4 A3 A2 A1 A0  
(RDY/BSY)  
(RDY/BSY)  
HIGH-Z  
10  
10  
10  
10  
18  
18  
18  
ERASE  
ERAL  
EWDS  
EWEN  
READ  
WRITE  
WRAL  
1
0
1
0
0
1
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
HIGH-Z  
A6 A5 A4 A3 A2 A1 A0  
A6 A5 A4 A3 A2 A1 A0  
D7 - D0  
D7 - D0  
D7 - D0  
(RDY/BSY)  
(RDY/BSY)  
0
1
X
X
X
X
X
DS21749D-page 4  
2003 Microchip Technology Inc.  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
2.3  
Data Protection  
2.0  
FUNCTIONAL DESCRIPTION  
All modes of operation are inhibited when VCC is below  
a typical voltage of 1.5V for '93AA' and '93LC' devices  
or 3.8V for '93C' devices.  
When the ORG* pin is connected to VCC, the (x16)  
organization is selected. When it is connected to  
ground, the (x8) organization is selected. Instructions,  
addresses and write data are clocked into the DI pin on  
the rising edge of the clock (CLK). The DO pin is  
normally held in a HIGH-Z state except when reading  
data from the device, or when checking the READY/  
BUSY status during a programming operation. The  
READY/BUSY status can be verified during an Erase/  
Write operation by polling the DO pin; DO low indicates  
that programming is still in progress, while DO high  
indicates the device is ready. DO will enter the HIGH-Z  
state on the falling edge of CS.  
The EWEN and EWDS commands give additional  
protection against accidentally programming during  
normal operation.  
Note: For added protection, an EWDS command  
should be performed after every write  
operation.  
After power-up, the device is automatically in the  
EWDS mode. Therefore, an EWENinstruction must be  
performed before the initial ERASEor WRITEinstruction  
can be executed.  
2.1  
Start Condition  
Block Diagram  
The Start bit is detected by the device if CS and DI are  
both high with respect to the positive edge of CLK for  
the first time.  
VCC  
VSS  
Address  
Decoder  
Memory  
Array  
Before a Start condition is detected, CS, CLK, and DI  
may change in any combination (except to that of a  
Start condition), without resulting in any device  
operation (READ, WRITE, ERASE, EWEN, EWDS,  
ERAL, or WRAL). As soon as CS is high, the device is  
no longer in Standby mode.  
Address  
Counter  
DO  
An instruction following a Start condition will only be  
executed if the required opcode, address and data bits  
for any particular instruction are clocked in.  
Output  
Buffer  
Data Register  
DI  
Mode  
Decode  
Logic  
2.2  
Data In/Data Out (DI/DO)  
ORG*  
CS  
It is possible to connect the Data In and Data Out pins  
together. However, with this configuration it is possible  
for a “bus conflict” to occur during the “dummy zero”  
that precedes the READ operation, if A0 is a logic high  
level. Under such a condition the voltage level seen at  
Data Out is undefined and will depend upon the relative  
impedances of Data Out and the signal source driving  
A0. The higher the current sourcing capability of A0,  
the higher the voltage at the Data Out pin. In order to  
limit this current, a resistor should be connected  
between DI and DO.  
Clock  
Register  
CLK  
*ORG input is not available on A/B devices  
2003 Microchip Technology Inc.  
DS21749D-page 5  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
The DO pin indicates the READY/BUSY status of the  
2.4  
ERASE  
device if CS is brought high after a minimum of 250 ns  
low (TCSL). DO at logical ‘0’ indicates that programming  
is still in progress. DO at logical ‘1’ indicates that the  
register at the specified address has been erased and  
the device is ready for another instruction.  
The ERASE instruction forces all data bits of the  
specified address to the logical ‘1’ state. CS is brought  
low following the loading of the last address bit. This  
falling edge of the CS pin initiates the self-timed  
programming cycle, except on ‘93C’ devices where the  
rising edge of CLK before the last address bit initiates  
the write cycle.  
Note:  
Issuing a Start bit and then taking CS low  
will clear the READY/BUSY status from  
DO.  
FIGURE 2-1:  
ERASE TIMING FOR 93AA AND 93LC DEVICES  
TCSL  
CS  
CHECK STATUS  
CLK  
DI  
1
1
AN  
AN-1 AN-2  
A0  
•••  
1
TSV  
TCZ  
HIGH-Z  
BUSY  
READY  
DO  
HIGH-Z  
TWC  
FIGURE 2-2:  
ERASE TIMING FOR 93C DEVICES  
TCSL  
CS  
CHECK STATUS  
CLK  
DI  
1
1
AN  
AN-1 AN-2  
A0  
•••  
1
TSV  
TCZ  
HIGH-Z  
BUSY  
READY  
DO  
HIGH-Z  
TWC  
DS21749D-page 6  
2003 Microchip Technology Inc.  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
The DO pin indicates the READY/BUSY status of the  
device, if CS is brought high after a minimum of 250 ns  
2.5  
ERASE ALL (ERAL)  
The Erase All (ERAL) instruction will erase the entire  
memory array to the logical ‘1’ state. The ERAL cycle is  
identical to the ERASE cycle, except for the different  
opcode. The ERAL cycle is completely self-timed and  
commences at the falling edge of the CS, except on  
‘93C’ devices where the rising edge of CLK before the  
last data bit initiates the write cycle. Clocking of the  
CLK pin is not necessary after the device has entered  
the ERAL cycle.  
low (TCSL).  
Note: Issuing a Start bit and then taking CS low  
will clear the READY/BUSY status from  
DO.  
VCC must be 4.5V for proper operation of ERAL.  
FIGURE 2-3:  
ERAL TIMING FOR 93AA AND 93LC DEVICES  
TCSL  
CS  
CHECK STATUS  
CLK  
DI  
1
0
0
1
0
X
X
•••  
TSV  
TCZ  
HIGH-Z  
BUSY  
READY  
DO  
HIGH-Z  
VCC must be 4.5V for proper operation of ERAL.  
TEC  
FIGURE 2-4:  
ERAL TIMING FOR 93C DEVICES  
TCSL  
CS  
CHECK STATUS  
CLK  
DI  
1
0
0
1
0
X
X
•••  
TSV  
TCZ  
HIGH-Z  
BUSY  
READY  
DO  
HIGH-Z  
TEC  
2003 Microchip Technology Inc.  
DS21749D-page 7  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
2.6  
ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN)  
The 93XX46A/B/C powers up in the ERASE/WRITE  
Disable (EWDS) state. All Programming modes must be  
preceded by an ERASE/WRITE Enable (EWEN)  
instruction. Once the EWEN instruction is executed,  
programming remains enabled until an EWDSinstruction is  
executed or Vcc is removed from the device.  
To protect against accidental data disturbance, the EWDS  
instruction can be used to disable all ERASE/WRITE  
functions and should follow all programming operations.  
Execution of a READinstruction is independent of both the  
EWENand EWDSinstructions.  
FIGURE 2-5:  
EWDS TIMING  
TCSL  
CS  
CLK  
DI  
•••  
X
1
0
0
0
0
X
FIGURE 2-6:  
EWEN TIMING  
TCSL  
CS  
CLK  
DI  
•••  
1
0
0
1
1
X
X
the rising edge of the CLK and are stable after the  
specified time delay (TPD). Sequential read is possible  
when CS is held high. The memory data will  
automatically cycle to the next register and output  
sequentially.  
2.7  
READ  
The READ instruction outputs the serial data of the  
addressed memory location on the DO pin. A dummy  
zero bit precedes the 8-bit (If ORG pin is low or A-Version  
devices) or 16-bit (If ORG pin is high or B-version  
devices) output string. The output data bits will toggle on  
FIGURE 2-7:  
READ TIMING  
CS  
CLK  
DI  
•••  
A0  
0
An  
1
1
0
HIGH-Z  
DO  
Dx  
D0  
Dx  
D0  
Dx  
D0  
•••  
•••  
•••  
DS21749D-page 8  
2003 Microchip Technology Inc.  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
The DO pin indicates the READY/BUSY status of the  
device, if CS is brought high after a minimum of 250 ns  
2.8  
WRITE  
The WRITEinstruction is followed by 8 bits (If ORG is  
low or A-version devices) or 16 bits (If ORG pin is high  
or B-version devices) of data which are written into the  
specified address. For 93AA46A/B/C and 93LC46A/B/  
C devices, after the last data bit is clocked into DI, the  
falling edge of CS initiates the self-timed auto-erase  
and programming cycle. For 93C46A/B/C devices, the  
self-timed auto-erase and programming cycle is  
initiated by the rising edge of CLK on the last data bit.  
low (TCSL). DO at logical ‘0’ indicates that programming  
is still in progress. DO at logical ‘1’ indicates that the  
register at the specified address has been written with  
the data specified and the device is ready for another  
instruction.  
Note: Issuing a Start bit and then taking CS low  
will clear the READY/BUSY status from  
DO.  
FIGURE 2-8:  
WRITE TIMING FOR 93AA AND 93LC DEVICES  
TCSL  
CS  
CLK  
DI  
0
1
1
An  
A0  
Dx  
D0  
•••  
•••  
TSV  
TCZ  
HIGH-Z  
BUSY  
READY  
DO  
HIGH-Z  
Twc  
FIGURE 2-9:  
WRITE TIMING FOR 93C DEVICES  
TCSL  
CS  
CLK  
DI  
0
1
1
An  
A0  
Dx  
D0  
•••  
•••  
TSV  
TCZ  
HIGH-Z  
BUSY  
READY  
DO  
HIGH-Z  
Twc  
2003 Microchip Technology Inc.  
DS21749D-page 9  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
The DO pin indicates the READY/BUSY status of the  
device if CS is brought high after a minimum of 250 ns  
low (TCSL).  
2.9  
WRITE ALL (WRAL)  
The Write All (WRAL) instruction will write the entire  
memory array with the data specified in the command.  
For 93AA46A/B/C and 93LC46A/B/C devices, after the  
last data bit is clocked into DI, the falling edge of CS  
initiates the self-timed auto-erase and programming  
cycle. For 93C46A/B/C devices, the self-timed auto-  
erase and programming cycle is initiated by the rising  
edge of CLK on the last data bit. Clocking of the CLK  
pin is not necessary after the device has entered the  
WRAL cycle. The WRAL command does include an  
automatic ERAL cycle for the device. Therefore, the  
WRALinstruction does not require an ERALinstruction  
but the chip must be in the EWEN status.  
Note:  
Issuing a Start bit and then taking CS low  
will clear the READY/BUSY status from  
DO.  
VCC must be 4.5V for proper operation of WRAL.  
FIGURE 2-10:  
WRAL TIMING FOR 93AA AND 93LC DEVICES  
TCSL  
CS  
CLK  
DI  
0
0
1
X
1
0
•••  
Dx  
•••  
X
D0  
TSV  
TCZ  
HIGH-Z  
BUSY  
READY  
DO  
HIGH-Z  
TWL  
VCC must be 4.5V for proper operation of WRAL.  
FIGURE 2-11:  
WRAL TIMING FOR 93C DEVICES  
TCSL  
CS  
CLK  
DI  
0
0
1
X
1
0
•••  
Dx  
•••  
X
D0  
TSV  
TCZ  
HIGH-Z  
BUSY  
READY  
DO  
HIGH-Z  
TWL  
DS21749D-page 10  
2003 Microchip Technology Inc.  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
3.0  
PIN DESCRIPTIONS  
TABLE 3-1:  
Name  
PIN DESCRIPTIONS  
SOIC/PDIP/  
MSOP/  
TSSOP  
SOT-23  
Rotated SOIC  
Function  
CS  
CLK  
DI  
1
2
3
4
5
6
5
4
3
4
5
6
7
8
Chip Select  
Serial Clock  
Data In  
3
DO  
1
Data Out  
Ground  
Vss  
2
ORG/NC  
N/A  
Organization / 93XX46C  
No internal connection / 93XX46A/B  
NC  
7
8
N/A  
6
1
2
No Internal Connection  
Power Supply  
VCC  
data bits before an instruction is executed. CLK and DI  
then become don't care inputs waiting for a new Start  
condition to be detected.  
3.1  
Chip Select (CS)  
A high level selects the device; a low level deselects  
the device and forces it into Standby mode. However, a  
programming cycle which is already in progress will be  
completed, regardless of the Chip Select (CS) input  
signal. If CS is brought low during a program cycle, the  
device will go into Standby mode as soon as the  
programming cycle is completed.  
3.3  
Data In (DI)  
Data In (DI) is used to clock in a Start bit, opcode,  
address and data synchronously with the CLK input.  
3.4  
Data Out (DO)  
CS must be low for 250 ns minimum (TCSL) between  
consecutive instructions. If CS is low, the internal  
control logic is held in a Reset status.  
Data Out (DO) is used in the READ mode to output  
data synchronously with the CLK input (TPD after the  
positive edge of CLK).  
3.2  
Serial Clock (CLK)  
This pin also provides READY/BUSY status informa-  
tion during ERASE and WRITE cycles. READY/BUSY  
status information is available on the DO pin if CS is  
brought high after being low for minimum Chip Select  
low time (TCSL) and an ERASE or WRITE operation  
has been initiated.  
The Serial Clock is used to synchronize the communi-  
cation between a master device and the 93XX series  
device. Opcodes, address and data bits are clocked in  
on the positive edge of CLK. Data bits are also clocked  
out on the positive edge of CLK.  
CLK can be stopped anywhere in the transmission  
sequence (at high or low level) and can be continued  
anytime with respect to clock high time (TCKH) and  
clock low time (TCKL). This gives the controlling master  
freedom in preparing opcode, address and data.  
The Status signal is not available on DO, if CS is held  
low during the entire ERASE or WRITE cycle. In this  
case, DO is in the HIGH-Z mode. If status is checked  
after the ERASE/WRITE cycle, the data line will be high  
to indicate the device is ready.  
CLK is a “Don't Care” if CS is low (device deselected).  
If CS is high, but the Start condition has not been  
detected (DI = 0), any number of clock cycles can be  
received by the device without changing its status (i.e.,  
waiting for a Start condition).  
Note: Issuing a Start bit and then taking CS low  
will clear the READY/BUSY status from  
DO.  
3.5  
Organization (ORG)  
CLK cycles are not required during the self-timed  
WRITE (i.e., auto ERASE/WRITE) cycle.  
When the ORG pin is connected to VCC or Logic HI, the  
(x16) memory organization is selected. When the ORG  
pin is tied to VSS or Logic LO, the (x8) memory  
organization is selected. For proper operation, ORG  
must be tied to a valid logic level.  
After detection of a Start condition the specified number  
of clock cycles (respectively low-to-high transitions of  
CLK) must be provided. These clock cycles are  
required to clock in all required opcode, address and  
93XX46A devices are always x8 organization and  
93XX46B devices are always x16 organization.  
2003 Microchip Technology Inc.  
DS21749D-page 11  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
4.0  
4.1  
PACKAGING INFORMATION  
Package Marking Information  
8-Lead MSOP (150 mil)  
MSOP 1st Line Marking Codes  
Pb-free  
Example:  
Device  
std mark  
mark  
3L46BI  
2281L7  
93AA46A  
93AA46B  
93AA46C  
93LC46A  
93LC46B  
93LC46C  
93C46A  
XXXXXXT  
YWWNNN  
3A46AT  
3A46BT  
3A46CT  
3L46AT  
3L46BT  
3L46CT  
3C46AT  
3C46BT  
3C46CT  
GA46AT  
GA46BT  
GA46CT  
GL46AT  
GL46BT  
GL46CT  
GC46AT  
93C46B  
93C46C  
GC46BT  
GC46CT  
Example:  
1EL7  
6-Lead SOT-23  
XXNN  
T = blank for commercial, “I” for Industrial,  
“E” for Extended.  
SOT23 Marking Codes  
Device  
I-temp  
E-temp  
Example:  
8-Lead PDIP  
93AA46A  
93AA46B  
93LC46A  
93LC46B  
93C46A  
1BNN  
1LNN  
1ENN  
1PNN  
1HNN  
1TNN  
93LC46B  
I/SN 1L7  
1FNN  
1RNN  
1JNN  
1UNN  
XXXXXXXX  
XXXXXNNN  
0228  
YYWW  
93C46B  
Pb-free topside mark is same; Pb-free  
noted only on carton label.  
Example:  
8-Lead SOIC  
93LC46B  
I/SN 0228  
XXXXXXXX  
XXXXYYWW  
TSSOP 1st Line Marking Codes  
Pb-free  
1L7  
NNN  
Device  
std mark  
mark  
93AA46A  
93AA46B  
93AA46C  
93LC46A  
93LC46B  
93LC46C  
93C46A  
A46A  
A46B  
A46C  
L46A  
L46B  
L46C  
C46A  
C46B  
C46C  
GAAA  
GAAB  
GAAC  
GLAA  
GLAB  
GLAC  
GCAA  
GCAB  
GCAC  
Example:  
8-Lead TSSOP  
L46B  
I228  
1L7  
XXXX  
TYWW  
NNN  
93C46B  
93C46C  
Temperature grade is marked on line 2.  
Legend: XX...X Part number  
T
Temperature  
Blank Commercial  
I
E
Industrial  
Extended  
YY  
Year code (last 2 digits of calendar year) except TSSOP  
and MSOP which use only the last 1 digit  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
WW  
NNN  
Note: Custom marking available.  
DS21749D-page 12  
2003 Microchip Technology Inc.  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)  
E
E1  
p
D
2
B
n
1
α
A2  
A
c
φ
A1  
(F)  
L
β
Units  
Dimension Limits  
INCHES  
NOM  
MILLIMETERS*  
MIN  
MAX  
MIN  
NOM  
8
MAX  
n
p
Number of Pins  
Pitch  
8
.026 BSC  
0.65 BSC  
Overall Height  
A
A2  
A1  
E
-
-
.043  
-
-
0.85  
-
1.10  
Molded Package Thickness  
Standoff  
.030  
.000  
.033  
-
.037  
.006  
0.75  
0.95  
0.15  
0.00  
Overall Width  
.193 TYP.  
4.90 BSC  
Molded Package Width  
Overall Length  
Foot Length  
E1  
D
.118 BSC  
.118 BSC  
3.00 BSC  
3.00 BSC  
L
.016  
.024  
.037 REF  
.031  
0.40  
0.60  
0.95 REF  
0.80  
Footprint (Reference)  
Foot Angle  
F
φ
c
0°  
.003  
.009  
5°  
-
8°  
.009  
.016  
15°  
0°  
0.08  
0.22  
5°  
-
-
-
-
-
8°  
0.23  
0.40  
15°  
Lead Thickness  
Lead Width  
.006  
B
α
β
.012  
Mold Draft Angle Top  
Mold Draft Angle Bottom  
*Controlling Parameter  
Notes:  
-
-
5°  
15°  
5°  
15°  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not  
exceed .010" (0.254mm) per side.  
JEDEC Equivalent: MO-187  
Drawing No. C04-111  
2003 Microchip Technology Inc.  
DS21749D-page 13  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
6-Lead Plastic Small Outline Transistor (OT) (SOT-23)  
E
E1  
B
p1  
D
n
1
α
c
A
A2  
φ
A1  
L
β
Units  
INCHES*  
NOM  
MILLIMETERS  
Dimension Limits  
MIN  
MAX  
MIN  
NOM  
6
MAX  
n
p
Number of Pins  
Pitch  
6
.038  
.075  
.046  
.043  
.003  
.110  
.064  
.116  
.018  
5
0.95  
1.90  
p1  
Outside lead pitch (basic)  
Overall Height  
A
A2  
A1  
E
.035  
.057  
0.90  
0.90  
1.18  
1.10  
0.08  
2.80  
1.63  
2.95  
0.45  
5
1.45  
1.30  
0.15  
3.00  
1.75  
3.10  
0.55  
10  
Molded Package Thickness  
Standoff  
.035  
.000  
.102  
.059  
.110  
.014  
0
.051  
.006  
.118  
.069  
.122  
.022  
10  
0.00  
2.60  
1.50  
2.80  
0.35  
0
Overall Width  
Molded Package Width  
Overall Length  
Foot Length  
E1  
D
L
φ
Foot Angle  
c
Lead Thickness  
Lead Width  
.004  
.014  
0
.006  
.017  
5
.008  
.020  
10  
0.09  
0.35  
0
0.15  
0.43  
5
0.20  
0.50  
10  
B
α
β
Mold Draft Angle Top  
Mold Draft Angle Bottom  
*Controlling Parameter  
Notes:  
0
5
10  
0
5
10  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not  
exceed .005" (0.127mm) per side.  
JEITA (formerly EIAJ) equivalent: SC-74A  
Drawing No. C04-120  
DS21749D-page 14  
2003 Microchip Technology Inc.  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)  
E1  
D
2
n
1
α
E
A2  
A
L
c
A1  
β
B1  
B
p
eB  
Units  
INCHES*  
NOM  
MILLIMETERS  
Dimension Limits  
MIN  
MAX  
MIN  
NOM  
8
MAX  
n
p
Number of Pins  
Pitch  
8
.100  
.155  
.130  
2.54  
Top to Seating Plane  
A
.140  
.170  
3.56  
2.92  
3.94  
3.30  
4.32  
Molded Package Thickness  
Base to Seating Plane  
Shoulder to Shoulder Width  
Molded Package Width  
Overall Length  
A2  
A1  
E
.115  
.015  
.300  
.240  
.360  
.125  
.008  
.045  
.014  
.310  
5
.145  
3.68  
0.38  
7.62  
6.10  
9.14  
3.18  
0.20  
1.14  
0.36  
7.87  
5
.313  
.250  
.373  
.130  
.012  
.058  
.018  
.370  
10  
.325  
.260  
.385  
.135  
.015  
.070  
.022  
.430  
15  
7.94  
6.35  
9.46  
3.30  
0.29  
1.46  
0.46  
9.40  
10  
8.26  
6.60  
9.78  
3.43  
0.38  
1.78  
0.56  
10.92  
15  
E1  
D
Tip to Seating Plane  
Lead Thickness  
L
c
Upper Lead Width  
B1  
B
Lower Lead Width  
Overall Row Spacing  
Mold Draft Angle Top  
Mold Draft Angle Bottom  
§
eB  
α
β
5
10  
15  
5
10  
15  
* Controlling Parameter  
§ Significant Characteristic  
Notes:  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed  
.010” (0.254mm) per side.  
JEDEC Equivalent: MS-001  
Drawing No. C04-018  
2003 Microchip Technology Inc.  
DS21749D-page 15  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)  
E
E1  
p
D
2
B
n
1
h
α
45°  
c
A2  
A
φ
β
L
A1  
Units  
INCHES*  
NOM  
MILLIMETERS  
Dimension Limits  
MIN  
MAX  
MIN  
NOM  
8
MAX  
n
p
Number of Pins  
Pitch  
8
.050  
.061  
.056  
.007  
.237  
.154  
.193  
.015  
.025  
4
1.27  
Overall Height  
A
.053  
.069  
1.35  
1.32  
1.55  
1.42  
0.18  
6.02  
3.91  
4.90  
0.38  
0.62  
4
1.75  
Molded Package Thickness  
Standoff  
A2  
A1  
E
.052  
.004  
.228  
.146  
.189  
.010  
.019  
0
.061  
.010  
.244  
.157  
.197  
.020  
.030  
8
1.55  
0.25  
6.20  
3.99  
5.00  
0.51  
0.76  
8
§
0.10  
5.79  
3.71  
4.80  
0.25  
0.48  
0
Overall Width  
Molded Package Width  
Overall Length  
E1  
D
Chamfer Distance  
Foot Length  
h
L
φ
Foot Angle  
c
Lead Thickness  
Lead Width  
.008  
.013  
0
.009  
.017  
12  
.010  
.020  
15  
0.20  
0.33  
0
0.23  
0.42  
12  
0.25  
0.51  
15  
B
α
Mold Draft Angle Top  
Mold Draft Angle Bottom  
β
0
12  
15  
0
12  
15  
* Controlling Parameter  
§ Significant Characteristic  
Notes:  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed  
.010” (0.254mm) per side.  
JEDEC Equivalent: MS-012  
Drawing No. C04-057  
DS21749D-page 16  
2003 Microchip Technology Inc.  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)  
E
E1  
p
D
2
1
n
B
α
A
c
A1  
A2  
φ
β
L
Units  
INCHES  
NOM  
MILLIMETERS*  
Dimension Limits  
MIN  
MAX  
MIN  
NOM  
8
MAX  
n
p
Number of Pins  
Pitch  
8
.026  
0.65  
Overall Height  
A
.043  
1.10  
Molded Package Thickness  
Standoff  
A2  
A1  
E
.033  
.035  
.004  
.251  
.173  
.118  
.024  
4
.037  
.006  
.256  
.177  
.122  
.028  
8
0.85  
0.05  
0.90  
0.10  
6.38  
4.40  
3.00  
0.60  
4
0.95  
0.15  
6.50  
4.50  
3.10  
0.70  
8
§
.002  
.246  
.169  
.114  
.020  
0
Overall Width  
6.25  
4.30  
2.90  
0.50  
0
Molded Package Width  
Molded Package Length  
Foot Length  
E1  
D
L
φ
Foot Angle  
c
Lead Thickness  
.004  
.007  
0
.006  
.010  
5
.008  
.012  
10  
0.09  
0.19  
0
0.15  
0.25  
5
0.20  
0.30  
10  
Lead Width  
B
α
β
Mold Draft Angle Top  
Mold Draft Angle Bottom  
0
5
10  
0
5
10  
* Controlling Parameter  
§ Significant Characteristic  
Notes:  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed  
.005” (0.127mm) per side.  
JEDEC Equivalent: MO-153  
Drawing No. C04-086  
2003 Microchip Technology Inc.  
DS21749D-page 17  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
APPENDIX A: REVISION HISTORY  
Revision D  
Corrections to Section 1.0, Electrical Characteristics.  
Section 4.1, 6-Lead SOT-23 package to OT.  
DS21749D-page 18  
2003 Microchip Technology Inc.  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
ON-LINE SUPPORT  
SYSTEMS INFORMATION AND  
UPGRADE HOT LINE  
Microchip provides on-line support on the Microchip  
World Wide Web site.  
The Systems Information and Upgrade Line provides  
system users a listing of the latest versions of all of  
Microchip's development systems software products.  
Plus, this line provides information on how customers  
can receive the most current upgrade kits.The Hot Line  
Numbers are:  
The web site is used by Microchip as a means to make  
files and information easily available to customers. To  
view the site, the user must have access to the Internet  
and a web browser, such as Netscape® or Microsoft®  
Internet Explorer. Files are also available for FTP  
download from our FTP site.  
1-800-755-2345 for U.S. and most of Canada, and  
1-480-792-7302 for the rest of the world.  
Connecting to the Microchip Internet  
Web Site  
042003  
The Microchip web site is available at the following  
URL:  
www.microchip.com  
The file transfer site is available by using an FTP  
service to connect to:  
ftp://ftp.microchip.com  
The web site and file transfer site provide a variety of  
services. Users may download files for the latest  
Development Tools, Data Sheets, Application Notes,  
User's Guides, Articles and Sample Programs. A vari-  
ety of Microchip specific business information is also  
available, including listings of Microchip sales offices,  
distributors and factory representatives. Other data  
available for consideration is:  
• Latest Microchip Press Releases  
Technical Support Section with Frequently Asked  
Questions  
• Design Tips  
• Device Errata  
• Job Postings  
• Microchip Consultant Program Member Listing  
• Links to other useful web sites related to  
Microchip Products  
• Conferences for products, Development Systems,  
technical information and more  
• Listing of seminars and events  
2003 Microchip Technology Inc.  
DS21749D-page 19  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
READER RESPONSE  
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can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.  
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93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
DS21749D  
Literature Number:  
Device:  
Questions:  
1. What are the best features of this document?  
2. How does this document meet your hardware and software development needs?  
3. Do you find the organization of this document easy to follow? If not, why?  
4. What additions to the document do you think would enhance the structure and subject?  
5. What deletions from the document could be made without affecting the overall usefulness?  
6. Is there any incorrect or misleading information (what and where)?  
7. How would you improve this document?  
DS21749D-page 20  
2003 Microchip Technology Inc.  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
/XX  
X
PART NO.  
Device  
X
X
X
Examples:  
a)  
b)  
c)  
93AA46C-I/MS: 1K, 128x8 or 64x16 Serial  
EEPROM, MSOP package, 1.8V  
93AA46B-I/MS: 1K, 64x16 Serial EEPROM,  
MSOP package, 1.8V  
Package  
Lead Finish  
Tape & Reel Temperature  
Range  
Pinout  
93AA46AT-I/OT: 1K, 128x8 Serial EEPROM,  
SOT-23 package, tape and reel, 1.8V  
Device  
93AA46A: 1K 1.8V Microwire Serial EEPROM  
93AA46B: 1K 1.8V Microwire Serial EEPROM  
93AA46C: 1K 1.8V Microwire Serial EEPROM w/ORG  
d)  
93AA46CT-I/MS: 1K, 128x8 or 16x16 Serial  
EEPROM, MSOP package, tape and reel, 1.8V  
93LC46A: 1K 2.5V Microwire Serial EEPROM  
93LC46B: 1K 2.5V Microwire Serial EEPROM  
93LC46C: 1K 2.5V Microwire Serial EEPROM w/ORG  
a)  
b)  
93LC46A-I/MS: 1K, 128x8 Serial EEPROM,  
MSOP package, 2.5V  
93LC46BT-I/OT: 1K, 64x16 Serial EEPROM,  
SOT-23 package, tape and reel, 2.5V  
93C46A: 1K 5.0V Microwire Serial EEPROM  
93C46B: 1K 5.0V Microwire Serial EEPROM  
93C46C: 1K 5.0V Microwire Serial EEPROM w/ORG  
c)  
d)  
93LC46B-I/MS: 1K, 64x16 Serial EEPROM,  
MSOP package, 2.5V  
Pinout:  
Blank  
X
=
=
Standard pinout  
Rotated pinout  
93LC46BXT-I/SNG:  
1K,  
64x16  
Serial  
EEPROM, SOIC package, rotated pinout,  
Industrial temperature, Pb-free finish, 2.5V  
Tape & Reel:  
Temperature Range  
Package  
Blank  
T
=
=
Standard packaging  
Tape & Reel  
a)  
b)  
c)  
93C46B-I/MS: 1K, 64x16 Serial EEPROM,  
MSOP package, 5.0V  
93C46C-I/MS: 1K, 128x8 or 16x16 Serial  
EEPROM, MSOP package, 5.0V  
93C46AT-I/OT: 1K, 128x8 Serial EEPROM,  
SOT-23 package, tape and reel, 5.0V  
I
E
=
=
-40°C to +85°C  
-40°C to +125°C  
MS  
OT  
P
SN  
ST  
=
=
=
=
=
Plastic MSOP (Micro Small outline, 8-lead)  
SOT-23, 6-lead (Tape & Reel only)  
Plastic DIP (300 mil body), 8-lead  
Plastic SOIC (150 mil body), 8-lead  
TSSOP, 8-lead  
Lead Finish:  
Blank  
G
=
=
Standard 63% / 37% SnPb  
Pure Matte Sn  
Sales and Support  
Data Sheets  
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences  
and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of  
the following:  
1. Your local Microchip sales office  
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277  
3. The Microchip Worldwide Site (www.microchip.com)  
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.  
New Customer Notification System  
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  
2003 Microchip Technology Inc.  
DS21749D-page 21  
93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C  
NOTES:  
DS21749D-page 22  
2003 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is intended through suggestion only  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
No representation or warranty is given and no liability is  
assumed by Microchip Technology Incorporated with respect  
to the accuracy or use of such information, or infringement of  
patents or other intellectual property rights arising from such  
use or otherwise. Use of Microchip’s products as critical com-  
ponents in life support systems is not authorized except with  
express written approval by Microchip. No licenses are con-  
veyed, implicitly or otherwise, under any intellectual property  
rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, Accuron,  
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,  
PRO MATE and PowerSmart are registered trademarks of  
Microchip Technology Incorporated in the U.S.A. and other  
countries.  
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,  
SEEVAL and The Embedded Control Solutions Company are  
registered trademarks of Microchip Technology Incorporated  
in the U.S.A.  
Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,  
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,  
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,  
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,  
PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,  
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,  
SmartSensor, SmartShunt, SmartTel and Total Endurance are  
trademarks of Microchip Technology Incorporated in the  
U.S.A. and other countries.  
Serialized Quick Turn Programming (SQTP) is a service mark  
of Microchip Technology Incorporated in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2003, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received QS-9000 quality system  
certification for its worldwide headquarters,  
design and wafer fabrication facilities in  
Chandler and Tempe, Arizona in July 1999  
and Mountain View, California in March 2002.  
The Company’s quality system processes and  
procedures are QS-9000 compliant for its  
PICmicro® 8-bit MCUs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals,  
non-volatile memory and analog products. In  
addition, Microchip’s quality system for the  
design and manufacture of development  
systems is ISO 9001 certified.  
2003 Microchip Technology Inc.  
DS21749D-page 23  
WORLDWIDE SALES AND SERVICE  
Korea  
AMERICAS  
ASIA/PACIFIC  
168-1, Youngbo Bldg. 3 Floor  
Samsung-Dong, Kangnam-Ku  
Seoul, Korea 135-882  
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or  
82-2-558-5934  
Corporate Office  
Australia  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Suite 22, 41 Rawson Street  
Epping 2121, NSW  
Australia  
Fax: 480-792-7277  
Technical Support: 480-792-7627  
Web Address: http://www.microchip.com  
Tel: 61-2-9868-6733  
Fax: 61-2-9868-6755  
Singapore  
200 Middle Road  
#07-02 Prime Centre  
Singapore, 188980  
Tel: 65-6334-8870 Fax: 65-6334-8850  
China - Beijing  
Unit 915  
Bei Hai Wan Tai Bldg.  
No. 6 Chaoyangmen Beidajie  
Beijing, 100027, No. China  
Tel: 86-10-85282100  
Fax: 86-10-85282104  
Atlanta  
3780 Mansell Road, Suite 130  
Alpharetta, GA 30022  
Tel: 770-640-0034  
Fax: 770-640-0307  
Taiwan  
Kaohsiung Branch  
30F - 1 No. 8  
Min Chuan 2nd Road  
Kaohsiung 806, Taiwan  
Tel: 886-7-536-4818  
Fax: 886-7-536-4803  
Boston  
China - Chengdu  
2 Lan Drive, Suite 120  
Westford, MA 01886  
Tel: 978-692-3848  
Fax: 978-692-3821  
Rm. 2401-2402, 24th Floor,  
Ming Xing Financial Tower  
No. 88 TIDU Street  
Chengdu 610016, China  
Tel: 86-28-86766200  
Taiwan  
Taiwan Branch  
11F-3, No. 207  
Tung Hua North Road  
Taipei, 105, Taiwan  
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139  
Chicago  
333 Pierce Road, Suite 180  
Itasca, IL 60143  
Tel: 630-285-0071  
Fax: 630-285-0075  
Fax: 86-28-86766599  
China - Fuzhou  
Unit 28F, World Trade Plaza  
No. 71 Wusi Road  
Dallas  
Fuzhou 350001, China  
Tel: 86-591-7503506  
Fax: 86-591-7503521  
EUROPE  
Austria  
Durisolstrasse 2  
A-4600 Wels  
Austria  
Tel: 43-7242-2244-399  
Fax: 43-7242-2244-393  
Denmark  
Regus Business Centre  
Lautrup hoj 1-3  
4570 Westgrove Drive, Suite 160  
Addison, TX 75001  
Tel: 972-818-7423  
Fax: 972-818-2924  
China - Hong Kong SAR  
Unit 901-6, Tower 2, Metroplaza  
223 Hing Fong Road  
Kwai Fong, N.T., Hong Kong  
Tel: 852-2401-1200  
Fax: 852-2401-3431  
Detroit  
Tri-Atria Office Building  
32255 Northwestern Highway, Suite 190  
Farmington Hills, MI 48334  
Tel: 248-538-2250  
China - Shanghai  
Room 701, Bldg. B  
Far East International Plaza  
No. 317 Xian Xia Road  
Shanghai, 200051  
Tel: 86-21-6275-5700  
Fax: 86-21-6275-5060  
China - Shenzhen  
Rm. 1812, 18/F, Building A, United Plaza  
No. 5022 Binhe Road, Futian District  
Shenzhen 518033, China  
Tel: 86-755-82901380  
Fax: 86-755-8295-1393  
China - Shunde  
Fax: 248-538-2260  
Ballerup DK-2750 Denmark  
Tel: 45-4420-9895 Fax: 45-4420-9910  
Kokomo  
France  
2767 S. Albright Road  
Kokomo, IN 46902  
Tel: 765-864-8360  
Fax: 765-864-8387  
Parc d’Activite du Moulin de Massy  
43 Rue du Saule Trapu  
Batiment A - ler Etage  
91300 Massy, France  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
Los Angeles  
18201 Von Karman, Suite 1090  
Irvine, CA 92612  
Tel: 949-263-1888  
Fax: 949-263-1338  
Germany  
Steinheilstrasse 10  
D-85737 Ismaning, Germany  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Phoenix  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7966  
Fax: 480-792-4338  
Room 401, Hongjian Building  
No. 2 Fengxiangnan Road, Ronggui Town  
Shunde City, Guangdong 528303, China  
Tel: 86-765-8395507 Fax: 86-765-8395571  
Italy  
Via Quasimodo, 12  
20025 Legnano (MI)  
Milan, Italy  
China - Qingdao  
Rm. B505A, Fullhope Plaza,  
No. 12 Hong Kong Central Rd.  
Qingdao 266071, China  
Tel: 86-532-5027355 Fax: 86-532-5027205  
San Jose  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
Netherlands  
P. A. De Biesbosch 14  
NL-5152 SC Drunen, Netherlands  
Tel: 31-416-690399  
2107 North First Street, Suite 590  
San Jose, CA 95131  
Tel: 408-436-7950  
Fax: 408-436-7955  
India  
Toronto  
Divyasree Chambers  
1 Floor, Wing A (A3/A4)  
No. 11, O’Shaugnessey Road  
Bangalore, 560 025, India  
Tel: 91-80-2290061 Fax: 91-80-2290062  
Japan  
6285 Northam Drive, Suite 108  
Mississauga, Ontario L4V 1X5, Canada  
Tel: 905-673-0699  
Fax: 31-416-690340  
United Kingdom  
505 Eskdale Road  
Winnersh Triangle  
Fax: 905-673-6509  
Wokingham  
Berkshire, England RG41 5TU  
Tel: 44-118-921-5869  
Fax: 44-118-921-5820  
Benex S-1 6F  
3-18-20, Shinyokohama  
Kohoku-Ku, Yokohama-shi  
Kanagawa, 222-0033, Japan  
Tel: 81-45-471- 6166 Fax: 81-45-471-6122  
07/28/03  
DS21749D-page 24  
2003 Microchip Technology Inc.  
配单直通车
93LC46CT-I/SN产品参数
型号:93LC46CT-I/SN
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
IHS 制造商:MICROCHIP TECHNOLOGY INC
零件包装代码:SOIC
包装说明:3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
针数:8
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.32.00.51
Factory Lead Time:15 weeks
风险等级:0.95
备用内存宽度:8
最大时钟频率 (fCLK):2 MHz
数据保留时间-最小值:200
耐久性:1000000 Write/Erase Cycles
JESD-30 代码:R-PDSO-G8
JESD-609代码:e3
长度:4.9 mm
内存密度:1024 bit
内存集成电路类型:EEPROM
内存宽度:16
湿度敏感等级:1
功能数量:1
端子数量:8
字数:64 words
字数代码:64
工作模式:SYNCHRONOUS
最高工作温度:85 °C
最低工作温度:-40 °C
组织:64X16
封装主体材料:PLASTIC/EPOXY
封装代码:SOP
封装等效代码:SOP8,.25
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
并行/串行:SERIAL
峰值回流温度(摄氏度):260
电源:3/5 V
认证状态:Not Qualified
座面最大高度:1.75 mm
串行总线类型:MICROWIRE
最大待机电流:0.000001 A
子类别:EEPROMs
最大压摆率:0.002 mA
最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.5 V
标称供电电压 (Vsup):3 V
表面贴装:YES
技术:CMOS
温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING
端子节距:1.27 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:40
宽度:3.9 mm
最长写入周期时间 (tWC):6 ms
写保护:SOFTWARE
Base Number Matches:1
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