SPECIFICATION FOR APPROVAL
REF : 20080718-A
PROD.
NAME
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
CM2520□□□□3□-□□□
WOUND CHIP INDUCTOR
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
A
: 2.5±0.2
m/m
m/m
m/m
m/m
m/m
B : 2.0±0.1
C : 1.8±0.1
E : 1.4±0.1
F
: 0.40
B
Not Marking
0.50
C
0.9
1.5
0.9
F
F
E
（
PCB Pattern
）
Ⅱ﹒SCHEMATIC
DIAGRAM：
d
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite DR core
b﹒Wire
：Enamelled
copper wire ( class F )
c﹒Terminal：Cu/Sn
d﹒Encapsulate：Epoxy novolac molding compound
e﹒Remark：Products comply with RoHS' requirements
1.5
a
c
b
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp. rise
：20℃
max.
b﹒Ambient temp.：80℃ max.
c﹒Storage temp.：-40℃ ----+100℃
d﹒Operating temp.：-40℃----+85℃
e﹒Terminal strength：0.5 kg min.
f﹒Rated current：Current cause
inductance drop within 10%
g﹒Resistance to solder heat：260℃.10 secs.
h﹒Resistance to solvent：Per MIL-STD-202F
AR-001A
Temperatu re (
℃
)
Peak Temp：245
℃
max.
M ax time above 225℃
：3
0sec max.
M ax time above 200℃
：5
0sec max.
Temp erature
R is in g Area
2 ~ 4
℃
/ sec
P reh eat Area
1 50 ~ 180
℃
/ 90 ~ 150 sec
R eflo w Area
2 ~ 4
℃
/ sec
2 40
±5℃
F orced Co olin g Area
3 ~ 5
℃
/ sec
250
200
10sec
30sec max.
( 2 0~3 0s
ec )
150
100
50
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
