ACT4070B
Rev 0, 23-Apr-12
ORDERING INFORMATION
PART NUMBER
ACT4070BYH
ACT4070BYH-T
TEMPERATURE RANGE
-40°C to 85°C
-40°C to 85°C
PACKAGE
SOP-8/EP
SOP-8/EP
PINS
8
8
PACKING
TUBE
TAPE & REEL
PIN CONFIGURATION
SOP-8/EP
PIN DESCRIPTION
PIN NUMBER
1
2
3
4
5
6
PIN NAME
BS
IN
SW
GND
FB
COMP
PIN DESCRIPTION
Bootstrap. This pin acts as the positive rail for the high-side switch’s gate driver.
Connect a 10nF between this pin and SW.
Input Supply. Bypass this pin to GND with a low ESR capacitor. See
Input Ca-
pacitor
in
Application Information
section.
Switch Output. Connect this pin to the switching end of the inductor.
Ground.
Feedback Input. The voltage at this pin is regulated to 0.808V. Connect to the
resistor divider between output and ground to set output voltage.
Compensation Pin. See
Compensation Technique
in
Application Information
sec-
tion.
Enable Input. When higher than 1.6V, this pin turns the IC on. When lower than
1.5V, this pin turns the IC off. This pin has a small internal pull up current to a high
level voltage when pin is not connected.
Not Connected.
Exposed Pad shown as dashed box. The exposed thermal pad should be con-
nected to board ground plane and pin 4. The ground plane should include a large
exposed copper pad under the package for thermal dissipation (see package out-
line). The leads and exposed pad should be flush with the board, without offset
from the board surface.
7
8
EN
N/C
EP
EP
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