Active-Semi
STABILITY COMPENSATION CONT’D
PC Board Layout Guidance
When laying out the printed circuit board, the
following checklist should be used to ensure proper
operation of the IC.
1) Arrange the power components to reduce the
AC loop size consisting of C
IN
, IN pin, SW pin
and the schottky diode.
2)
Place input decoupling ceramic capacitor C
IN
as
close to IN pin as possible. C
IN
is connected
power GND with vias or short and wide path.
3)
Return FB, COMP and ISET to signal GND pin,
and connect the signal GND to power GND at a
single point for best noise immunity. Connect
exposed pad to power ground copper area with
copper and vias.
4)
Use copper plane for power GND for best heat
dissipation and noise immunity.
5)
Place feedback resistor close to FB pin.
6) Use short trace
connecting
HSB-C
HSB
-SW loop
Figure 6 shows an example of PCB layout.
ACT4303
Rev 0, 05-Dec-11
Figure 7 gives a typical application schematic and
associated BOM list.
Figure 6: PCB Layout
Innovative Power
TM
-9-
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