AD768
WAFER TEST LIMITS
1
Parameter
Integral Nonlinearity
2
Differential Nonlinearity
2
Offset Error
Gain Error
Reference Voltage
Positive Supply Current
Negative Supply Current
Power Dissipation
(T
A
= +25 C, V
DD
= +5.0 V, V
EE
= –5.0 V, I
REFIN
= 5 mA, unless otherwise noted)
AD768ACHIPS Limit
±
8
±
6
±
0.2
±
1.0
±
1.0
40
73
600
Units
LSB max
LSB max
% FSR max
% FSR max
% of nom. 2.5 V max
mA max
mA max
mW max
NOTES
1
Electrical test are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal
yield loss, yield after packaging is not guaranteed for standard product dice.
2
Limits extrapolated from testing of individual bit errors.
3
Die offers latch control pad. Edge triggered latches become level triggered when latch control and clock pads are high.
4
Die substrate is connected to V
EE.
PIN DESCRIPTIONS
Pin No.
1
2
3
4
5
6
7
8–14
15
16
17–23
24
25
26
27
28
Symbol
IOUTA
NR
REFOUT
NC
REFCOM
IREFIN
DB0
DB1–DB7
DCOM
CLOCK
DB8–DB14
DB15
V
DD
V
EE
IOUTB
LADCOM
Type
AO
AI
AO
NC
P
AI
DI
DI
P
DI
DI
DI
P
P
AO
P
Name and Function
DAC Current Output. Full-scale current when all data bits are 1s.
Noise Reduction Node. Add capacitor for noise reduction.
Reference Output Voltage. Nominal value is 2.5 V.
No Connect. Reserved for internal use.
Reference Ground.
Reference Input Current. Nominal is 5 mA. DAC full-scale is 4× this current.
Data Bit 0 (LSB).
Data Bits 1–7.
Digital Ground.
Clock Input. Data latched on positive edge of clock.
Data Bits 8–14.
Data Bit 15 (MSB).
Positive Supply Voltage. Nominal is +5 V.
Negative Supply Voltage. Nominal is –5 V.
Complementary DAC Current Output. Full-scale current when all data bits are 0s.
DAC Ladder Common.
Type: AI = Analog Input; DI = Digital Input; AO = Analog Output; P = Power.
PIN CONFIGURATION
V
DD
V
DD
DICE CHARACTERISTICS
3, 4
DB15
DB14 DB13
DB12 DB11
DB10
IOUTA 1
NR 2
REFOUT 3
NC 4
REFCOM 5
IREFIN 6
(LSB) DB0 7
28 LADCOM
27 IOUTB
26 V
EE
(–5V)
25 V
DD
(+5V)
24 DB15 (MSB)
V
EE
V
EE
DB9
DB8
AD768
23 DB14
IOUTB
LADCOM
IOUTA
NR
REFOUT
NC
REFCOM IREFIN
DB0
DB1
DB2
DB3 DB4
CLOCK
LATCH CONTROL
DCOM
DB7
DB6
DB5
TOP VIEW 22 DB13
(Not to Scale)
DB1 8
21 DB12
DB2 9
DB3 10
DB4 11
DB5 12
DB6 13
DB7 14
20 DB11
19 DB10
18 DB9
17 DB8
16 CLOCK
15 DCOM
NC = NO CONNECT
Die Size:
0.1106
×
0.1417 inch, 15,672 sq. mils
(2.81
×
3.60 mm, 10.116 sq. mm)
–4–
REV. B
AD [ ANALOG DEVICES ]
