OP27
DICE CHARACTERISTICS
1. NULL
2. (–) INPUT
3. (+) INPUT
4. V–
6. OUTPUT
7. V+
8. NULL
DIE SIZE 0.109 ꢂ 0.055 INCH, 5995 SQ. MILS
(2.77 ꢂ 1.40mm, 3.88 SQ. mm)
(@ VS = 15 V, TA = 25ꢁC unless otherwise noted.)
WAFER TEST LIMITS
OP27N
Limit
OP27G
Limit
OP27GR
Limit
Parameter
Symbol
Conditions
Unit
INPUT OFFSET VOLTAGE*
INPUT OFFSET CURRENT
INPUT BIAS CURRENT
VOS
IOS
IB
35
35
40
11
60
50
55
11
100
75
µV Max
nA Max
nA Max
V Min
80
INPUT VOLTAGE RANGE
IVR
11
COMMON-MODE REJECTION
RATIO
CMRR
PSRR
V
CM = IVR
114
10
106
10
100
20
dB Min
POWER SUPPLY
VS = 4 V to 18 V
µV/V Max
LARGE-SIGNAL VOLTAGE
GAIN
AVO
AVO
RL ≥ 2 kΩ, VO = 10 V
RL ≥ 600 Ω, VO = 10 V
1000
800
1000
800
700
600
V/mV Min
V/mV Min
OUTPUT VOLTAGE SWING
VO
VO
RL ≥ 2 kΩ
RL2600n
12.0
10.0
12.0
10.0
+11.5
10.0
V Min
V Min
POWER CONSUMPTION
Pd
VO = 0
140
140
170
mW Max
NOTE
*Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
–5–
REV. A
ADI [ ADI ]
