Absolute Maximum Ratings
Description
Average Power per Segment
or DP
Peak Forward Current per
Segment or DP
DC Forward Current per
Segment or DP
Operating Temperature
Range
Storage Temperature Range
Reverse Voltage per
Segment or DP
Lead Solder Temperature
for 3 Seconds (1.60 mm
[0.063 in.] below seating
plane)
Notes:
1. See Figure 1 to establish pulsed conditions.
2. Derate above 45°C at 0.83 mA/°C.
3. See Figure 2 to establish pulsed conditions.
4. Derate above 55°C at 0.8 mA/°C.
5. See Figure 7 to establish pulsed conditions.
6.
7.
8.
9.
Red
HDSP-3400
Series
115
200
[1]
50
[2]
-40 to +100
AlGaAs Red
HDSP-N150
Series
96
160
[3]
40
[4]
-20 to +100
[9]
HER
HDSP-3900
Series
105
135
[5]
40
[6]
Yellow
HDSP-4200
Series
105
135
[5]
40
[6]
Green
HDSP-8600
Series
Units
105
90
[7]
30
[8]
-40 to +100
mW
mA
mA
°C
°C
V
-40 to +100
-55 to +100
3.0
260
°C
Derate above 50°C at 0.73 mA/°C.
See Figure 8 to establish pulsed conditions.
Derate above 50°C at 0.54 mA/°C.
For operation below -20°C, contact your local HP
components sales office or an authorized distributor.
Electrical/Optical Characteristics at T
A
= 25
°
C
Red
Device
Series
Parameter
Luminous Intensity/Segment
[1,2]
(Digit Average)
Forward Voltage/Segment or DP
HDSP-
340X
Peak Wavelength
Dominant Wavelength
[3]
Reverse Voltage/Segment or DP
[4]
Temperature Coefficient of
V
F
/Segment or DP
Thermal Resistance LED Junction-
to-Pin
Symbol
I
V
V
F
λ
PEAK
λ
d
V
R
∆V
F
/°C
Rθ
J-PIN
3.0
Min.
500
Typ.
1200
1.6
655
640
20
-2
375
2.0
Max.
Units
µcd
V
nm
nm
V
mV/°C
°C/W
I
R
= 100
µA
Test Conditions
I
F
= 20 mA
I
F
= 20 mA
3-94
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
