HSDL-44XX Absolute Maximum Ratings
Parameter
Peak Forward Current
(
Duty Factor = 20%,
Pulse Width = 100
µs)
DC Forward Current
Power Dissipation
Reverse Voltage (I
R
= 100
µA)
Transient Forward Current (10
µs
Pulse)
Operating Temperature
Storage Temperature
Junction Temperature
Lead Solder Temperature
[1.6 mm (0.063 in.) from body]
Reflow Soldering Temperatures
Convection IR
Vapor Phase
Symbol
I
FPK
I
FDC
P
DISS
V
R
I
FTR
T
O
T
S
T
J
-40
-55
5
1.0
85
100
110
260/5 s
Min.
Max.
500
100
180
Unit
mA
mA
mW
V
A
°C
°C
°C
°C
[1]
Ref.
Fig. 7, 8
Fig. 6
235/90 s
215/180 s
°C
°C
Notes:
1. The transient peak current in the maximum nonrecurring peak current the device can withstand without damaging the LED die and
the wire bonds.
HSDL-44XX Electrical Characteristics at T
A
= 25
°
C
Parameter
Forward Voltage
Symbol
V
F
Min.
1.30
1.40
Typ.
1.50
1.67
2.15
-2.1
-2.1
2.8
40
5
20
170
Max.
1.70
1.85
Unit
V
Condition
I
FDC
= 50 mA
I
FDC
= 100 mA
I
FPK
= 250 mA
I
FDC
= 50 mA
I
FDC
= 100 mA
I
FDC
= 100 mA
0 V, 1 MHz
I
R
= 100
µA
Ref.
Fig. 2
Forward Voltage
Temperature Coefficient
Series Resistance
Diode Capacitance
Reverse Voltage
Thermal Resistance,
Junction to Pin
∆V
F
/∆T
R
S
C
O
V
R
Rθ
jp
mV/°C
Ω
pF
V
°C/W
Fig. 3
4-78
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
