with a nominal SOT-363 package
footprint superimposed on the
PCB pads.
RF Layout
The RF layout in Figure 12 is
suggested as a starting point for
designs using the INA-51063
amplifier. Adequate grounding is
needed to obtain maximum
performance and to reduce the
possibility of potential instability.
All three ground pins of the RFIC
should be connected to RF
C
RF OUTPUT
50
Ω
V
CC
ground by using plated through
holes (vias) near the package
terminals. The power supply
connection to the amplifier must
be RF bypassed by placing a
capacitor directly to ground at
the V
CC
pin of the package.
It is recommended that the PCB
traces for the ground pins NOT be
connected together underneath
the body of the package. PCB
pads hidden under the package
cannot be adequately inspected
for SMT solder quality.
FR-4 or G-10 PCB material is a
good choice for most low cost
wireless applications. Typical
board thickness is 0.025 or
0.031 inches. The width of 50
Ω
microstriplines in these PCB
thicknesses is also convenient for
mounting chip components such
as the series inductor at the input
for impedance matching or for
DC blocking capacitors. For noise
figure sensitive applications, the
use of PTFE/glass dielectric
materials may be warranted to
minimize transmission line losses
at the amplifier input.
51
50
Ω
RF INPUT
Figure 12. RF Layout.
INA-51063 Part Number Ordering Information
Part Number
INA-51063-TR1
INA-51063-BLK
Devices per Container
3,000
100
Container
7" reel
Antistatic bag
Package Dimensions
Outline 63 (SOT-363/SC-70)
1.30 (0.051)
REF.
2.20 (0.087)
2.00 (0.079)
1.35 (0.053)
1.15 (0.045)
0.650 BSC (0.025)
2.20 (0.087)
1.80 (0.071)
0.10 (0.004)
0.00 (0.00)
0.425 (0.017)
TYP.
0.30 REF.
1.00 (0.039)
0.80 (0.031)
0.25 (0.010)
0.15 (0.006)
10°
0.30 (0.012)
0.10 (0.004)
0.20 (0.008)
0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
6-155
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
