AWT6314R
Dual-band CDMA/PCS
3.4 V/28 dBm Linear Power Amplifier Module
PRELIMINARY DATA SHEET - Rev 1.2
FEATURES
•
•
•
•
•
•
•
•
•
Single Mode Operation: P
OUT
≤
+28 dBm
High Efficiency: 54 % AMPS, 39 % CDMA
Low Quiescent Current: 50 mA
25 % Package Size Reduction
Common V
MODE
Control Line
Simplified V
CC
Bus PCB routing
Reduced External Component Count
Low Profile Surface Mount Package: 1.1 mm
RoHS Compliant Package, 250
o
C MSL-3
AW
T63
14
APPLICATIONS
•
Dual-band Cellular/PCS CDMA Wireless
Handsets
M23 Package
12 Pin 3 mm x 5 mm x 1 mm
Surface Mount Module
technology offering state-of-the-art reliability,
temperature stability, and ruggedness. Selectable
bias modes that optimize efficiency for different
output power levels, and a shutdown mode with low
leakage current, serve to increase handset talk and
standby time. The self contained 3 mm x 5 mm x 1
mm surface mount package incorporates matching
networks optimized for output power, efficiency and
linearity in a 50
Ω
system.
GND at slug (pad)
PRODUCT DESCRIPTION
The AWT6314R meets the increasing demands for
higher levels of integration in dual-band CDMA/PCS
1X handsets, while reducing board area
requirements by 25 %. The package pinout was
chosen to enable handset manufacturers to easily
route V
CC
to both power amplifiers and simplify
control with a common V
MODE
pin. The device is
manufactured on an advanced InGaP HBT MMIC
V
REF_PCS
1
Bias Control
12
RF
OUT_PCS
RF
IN_PCS
2
11
GND
V
CC1
3
10
V
CC2
V
MODE
4
9
V
CC2
A
RF
IN_CELL
5
Bias Control
8
RF
OUT_CELL
V
REF_CELL
6
7
GND
GND
Figure 1: Block Diagram
05/2006
ANADIGICS [ ANADIGICS, INC ]
