Ultra High Performance BGA Cooling
Solutions w/ maxiGRIP™ Attachment
ATS PART # ATS-50170P-C2-R0
Features & Benefits
maxiFLOW™ design features a low profile, spread fin
array that maximizes surface area for more effective
convection (air) cooling
maxiGRIP™ attachment applies steady, even pressure to
the component and does not require holes in the PCB
Meets Telcordia GR-63-Core Office Vibration; ETSI 300
019 Transportation Vibration; and MIL-STD-810 Shock and
Unpackaged Drop Testing standards
Comes preassembled with high performance, phase
changing, thermal interface material
Designed for standard height components from 3 to 4.5mm
*Image above is for illustration purposes only.
°C/W (UNDUCTED FLOW)
°C/W (DUCTED FLOW)
C = heat sink height from bottom of the base to the top of the fin field.
ATS-50170P-C1-R0 is a subsitute item available utilizing an equivalent phase change
material (Chomerics T766).
Thermal performance data are provided for reference only. Actual performance may vary
ATS reserves the right to update or change its products without notice to improve the
design or performance.
Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT170
Contact ATS to learn about custom options available.
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).