8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
11.23 ± 0.15
(0.442 ± 0.006)
8
7
6
5
LAND PATTERN RECOMMENDATION
9.00 ± 0.15
(0.354 ± 0.006)
13.56
(0.534)
1
2
3
4
1.3
(0.051)
1.55
(0.061)
MAX.
12.30 ± 0.30
(0.484 ± 0.012)
11.00 MAX.
(0.433)
2.29
(0.09)
4.00 MAX.
(0.158)
1.80 ± 0.15
(0.071 ± 0.006)
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
0.75 ± 0.25
(0.030 ± 0.010)
1.00 ± 0.15
(0.039 ± 0.006)
+ 0.076
0.254 - 0.0051
+ 0.003)
(0.010 - 0.002)
7° NOM.
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3
°C
+ 1
°C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5
°C
± 0.5
°C/SEC.
PEAK
TEMP.
245
°C
PEAK
TEMP.
240
°C
200
TEMPERATURE (°C)
160
°C
150
°C
140
°C
3
°C
+ 1
°C/–0.5 °C
100
2.5 C ± 0.5
°C/SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
230
°C
SOLDERING
TIME
200
°C
PREHEATING TIME
150
°C,
90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
TIME (SECONDS)
NOTE: NON-HALIDE FLUX SHOULD BE USED.
150
200
250
6
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
