8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW4502/3)
11.15 ± 0.15
(0.442 ± 0.006)
8
7
6
5
LAND PATTERN RECOMMENDATION
9.00 ± 0.15
(0.354 ± 0.006)
1
2
3
4
13.56
(0.534)
1.3
(0.051)
1.55
(0.061)
MAX.
4.00
(0.158) MAX.
1.78 ± 0.15
(0.070 ± 0.006)
1.00 ± 0.15
(0.039 ± 0.006)
12.30 ± 0.30
(0.484 ± 0.012)
11.00 MAX.
(0.433)
2.29
(0.09)
2.54
(0.100)
BSC
0.75 ± 0.25
(0.030 ± 0.010)
0.254 -+ 0.076
0.0051
0.003)
(0.010 +0.002)
-
7° NOM.
Dimensions in millimeters (inches).
Lead coplanarity = 0.10 mm (0.004 inches).
Note: Floating lead protrusion is 0.25 mm (10 mils) max.
Solder Reflow Temperature Profile
300
PREHEATING RATE
3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE
2.5°C ± 0.5°C/SEC.
TEMPERATURE (°C)
200
160°C
150°C
140°C
100
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
SOLDERING
TIME
200°C
PEAK
TEMP.
230°C
2.5 C ± 0.5°C/SEC.
30
SEC.
30
SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
TIME (SECONDS)
200
250
Note: Non-halide flux should be used.
6
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
