Solder Reflow Thermal Profile
300
PREHEATING RATE 3¡C + 1¡C/Ð0.5¡C/SEC.
REFLOW HEATING RATE 2.5¡C 0.5¡C/SEC.
PEAK
TEMP.
245¡C
PEAK
TEMP.
240¡C
PEAK
TEMP.
230¡C
200
2.5¡C 0.5¡C/SEC.
SOLDERING
TIME
30
160¡C
150¡C
140¡C
200¡C
SEC.
30
SEC.
3¡C + 1¡C/Ð0.5¡C
100
PREHEATING TIME
150¡C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
t
p
15 SEC.
260 +0/-5 °C
T
T
p
217 °C
L
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
T
smax
T
smin
t
s
t
L
60 to 150 SEC.
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
= 200 °C, T = 150 °C
T
smax
smin
Note: Non-halide flux should be used.
Regulatory Information
The HCPL-0370/3700/3760 has been approved by the following organizations:
IEC/EN/DIN EN 60747-5-5 (with option 060)
UL
Maximum Working Insulation Voltage VIORM = 567 Vpeak
for HCPL-0370, and 630 Vpeak for HCPL3700/3760.
Recognized under UL 1577, component recognition
program, File E55361 (HCPL-0370 pending).
Highest Allowable Overvoltage VIOTM = 6000 Vpeak for
HCPL-0370/3700/3760.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
5
AVAGO [ AVAGO TECHNOLOGIES LIMITED ]
