Film Chip Capacitors
PEN DIELECTRIC – CB Series
GENERAL DESCRIPTION
Film chip capacitor using a naked and stacked construction with
metallized PEN (polyethylene naphtalate).
ADVANTAGES
• Use of high temperature dielectric films make these
capacitors suitable for IR or vapor phase reflow processes.
This chip is built without specific encapsulation.
• The intrinsic elasticity of the dielectric film allows an
excellent compatibility of the capacitor with all types of
material for printed circuit boards.
• The self-healing property of film technology results to a
safety open failure mode and better overall reliability.
• Excellent thermal shock resistance.
• Low dissipation factor ESR & ESL.
• No piezoelectric effect.
• Available in tape and reel suitable for automatic placement.
• Non-polar construction.
APPLICATIONS
General purpose function in low voltage applications where
miniaturization and SMD is required. Typical applications
would be:
• Automotive (Airbag, Fuel injection calculator...)
• Telecom (Public switching systems, modems, telephone
set, cordless, mobile)
• Industrial (SMPS, Power convertor module...)
Outer Layer
Termination Plating :
100% matte Sn
Ni Barrier Under
Termination
Silver Epoxy
Resin
Brass
Active Layers : PEN dielectric
PERFORMANCE CHARACTERISTICS
Climatic Category
Capacitance Range
Tolerance on C
R
Nominal Voltages
Test Voltage
Soldering methods
Tangent of Loss Angle at 1kHz (DF)
Insulation resistance minimum : IR
55/125/56
1nF to 4.7μF
±5%, ±10%
25Vdc to 630Vdc
1.4Vr 2 sec. at 25°C
IR or vapor phase reflow (not suitable for wave soldering)
< 100 x 10
-4
for C ≤ 0.33μF IR > 1000 MΩ at 20°C for 1 min. charge at 10Vdc
for VR < 100Vdc and 100Vdc for VR ≥ 100Vdc
for C > 0.33μF IR C > 400 sec. at 20°C for 1 min. charge at 10Vdc
for VR < 100Vdc and 100Vdc for VR ≥ 100Vdc
-55°C to 125°C with voltage derating of 1.25%/°C between 105°C and 125°C
For high frequency A.C. application please check with AVX
Temperature range
A.C. applications
20
AVX [ AVX CORPORATION ]
