Accu-Guard
®
II
SMD Thin-Film Fuse
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Leach Resistance
Conditions
Components completely immersed in a
solder bath at 235 ±5°C for 2 secs.
Completely immersed in a solder bath
at 260 ±5°C for 60 secs.
12 months minimum with components
stored in “as received” packaging.
Components mounted to a substrate.
A force of 5N applied normal to the
line joining the terminations and in
a line parallel to the substrate.
Components mounted to a substrate.
50 cycles -55°C to +125°C.
Per Mil-Std-202F
Method 201A and
Method 204D Condition D.
Tested as shown in diagram
Requirement
Terminations to be well tinned
No visible damage
Dissolution of termination
≤
25% of area
∆R/R<10%
Good solderability
No visible damage
Storage
Shear
Rapid Change of
Temperature
Vibration
No visible damage
∆
R/R<10%
No visible damage
∆R/R<10%
No visible damage
∆R/R<10%
Bend
3 mm
Deflection
45mm
Load Life
F0805B, F1206B
45mm
No visible damage
∆R/R<10%
25°C, rated current, 20,000 hrs.
8
AVX [ AVX CORPORATION ]
