ABSOLUTE MAXIMUM RATINGS
(1)
+IN to GND ................................................................................ V
A
+ 0.1V
–IN to GND ....................................................................................... +0.5V
V
A
to GND ............................................................................. –0.3V to +7V
Digital Input Voltage to GND ................................... –0.3V to (V
A
+ 0.3V)
V
OUT
to GND ............................................................ –0.3V to (V
A
+ 0.3V)
Operating Temperature Range ...................................... –40°C to +105°C
Storage Temperature Range ......................................... –65°C to +150°C
Junction Temperature (T
J
max) .................................................... +150°C
TQFP Package:
Power Dissipation ................................................... (T
J
max – T
A
) /
θ
JA
θ
JA
Thermal Impedance ......................................................... 240°C/W
Lead Temperature:
Vapor Phase (soldering, 60s) ................................................. +215°C
Infrared (soldering, 15s) .......................................................... +220°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
PIN CONFIGURATION
Top View
TQFP
REF
OUT
AGND
REF
IN
+V
A
+IN
26
32
31
30
29
28
27
25
–IN
24 CS
23 BYTE
22 RD
21 CONVST
20 CLOCK
19 DGND
18 +V
D
17 BUSY
16
NC
11
DB15
DB14
DB13
DB12
DB11
DB10
DB9
DB8
1
2
3
4
ADS8322
5
6
7
8
9
10
12
13
14
15
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes
could cause the device not to meet its published specifications.
PIN ASSIGNMENTS
PIN
1
2
3
4
5
6
3
8
9
10
11
12
13
14
15
16
17
18
19
NAME
DB15
DB14
DB13
DB12
DB11
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
BUSY
+V
D
DGND
DESCRIPTION
Data Bit 15 (MSB)
Data Bit 14
Data Bit 13
Data Bit 12
Data Bit 11
Data Bit 10
Data Bit 9
Data Bit 8
Data Bit 7
Data Bit 6
Data Bit 5
Data Bit 4
Data Bit 3
Data Bit 2
Data Bit 1
Data Bit 0 (LSB)
High when a conversion is in progress.
Digital Power Supply, +5VDC.
Digital Ground
DB7
DB6
DB5
DB4
NC
DB3
DB2
DB1
PIN
20
NAME
CLOCK
DESCRIPTION
An external CMOS compatible clock can be applied
to the CLOCK input to synchronize the conversion
process to an external source.
Convert Start
Synchronization pulse for the parallel output.
Selects 8 most significant bits (LOW) or 8 least
significant bits (HIGH). Data valid on pins 9-16.
Chip Select
Inverting Input Channel
Noninverting Input Channel
Analog Ground
Analog Power Supply, +5VDC.
No Connect
No Connect
Reference Input. When using the internal 2.5V refer-
ence tie this pin directly to REF
OUT
.
Reference Output. A 0.1µF capacitor should be con-
nected to this pin when the internal reference is
used.
21
22
23
24
25
26
27
28
29
30
31
32
CONVST
RD
BYTE
CS
–IN
+IN
AGND
+V
A
NC
NC
REF
IN
REF
OUT
PACKAGE/ORDERING INFORMATION
MAXIMUM
INTEGRAL
LINEARITY
ERROR (LSB)
±8
NO
MISSING
CODES
ERROR (LSB)
14
PACKAGE
DRAWING
NUMBER
351
SPECIFICATION
TEMPERATURE
RANGE
–40°C to 85°C
PRODUCT
ADS8322Y
PACKAGE
TQFP-32
ORDERING
NUMBER
(1)
ADS8322Y/250
ADS8322Y/2K
ADS8322YB/250
ADS8322YB/2K
DB0
TRANSPORT
MEDIA
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
"
ADS8322YB
"
±6
"
15
"
TQFP-32
"
351
"
–40°C to 85°C
"
"
"
"
"
"
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2000 pieces
of “ADS8322Y/2K” will get a single 2000-piece Tape and Reel.
2
ADS8322
SBAS215
BURR-BROWN [ BURR-BROWN CORPORATION ]
