SLES035E – MARCH 2007 – REVISED MARCH 2008
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING ORDERING INFORMATION
PCM2900
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
28DB
SPECIFIED
TEMPERATURE
RANGE
–25°C to 85°C
PACKAGE
MARKING
PCM2900E
ORDERING
NUMBER
(1)
PCM2900E
PCM2900E/2K
TRANSPORT
MEDIA
Rails
Tape and reel
PCM2900E
(1)
SSOP-28
Models with a slash (/) are available only in tape and reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering
2000 pieces of PCM2900E/2K gets a single 2000-piece tape and reel.
PCM2902
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
28DB
SPECIFIED
TEMPERATURE
RANGE
–25°C to 85°C
PACKAGE
MARKING
PCM2902E
ORDERING
NUMBER
(1)
PCM2902E
PCM2902E/2K
TRANSPORT
MEDIA
Rails
Tape and reel
PCM2902E
(1)
SSOP-28
Models with a slash (/) are available only in tape and reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering
2000 pieces of PCM2902E/2K gets a single 2000-piece tape and reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
PCM2900/PCM2902
V
BUS
Supply voltage
Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU
Digital input voltage
Analog input
voltage
SEL0, SEL1, TEST0 (DIN)
(2)
D+, D–, HID0, HID1, HID2, XTI, XTO, TEST1 (DOUT)
V
IN
L, V
IN
R, V
COM
, V
OUT
R, V
OUT
L
V
CCCI
, V
CCP1I
, V
CCP2I
, V
CCXI
, V
DDI
(2)
UNIT
V
V
V
V
V
V
mA
°C
°C
°C
°C,
5 s
°C
–0.3 to 6.5
±0.1
–0.3 to 6.5
, SSPND
–0.3 to (V
DDI
+ 0.3) < 4
–0.3 to (V
CCCI
+ 0.3) < 4
–0.3 to 4
±10
–40 to 125
–55 to 150
150
260
250
Input current (any pins except supplies)
Ambient temperature under bias
T
stg
T
J
Storage temperature
Junction temperature
Lead temperature (soldering)
Package temperature (IR reflow, peak)
(1)
(2)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
( ): PCM2902
2
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