Preliminary Datasheet
150mA RF ULDO REGULATOR
AP2202
Absolute Maximum Ratings (Note 1)
Parameter
Symbol
VIN
Value
Unit
V
Supply Input Voltage
Enable Input Voltage
Power Dissipation
15
15
VEN
V
PD
Internally Limited
W
oC
Lead Temperature (Soldering, 5sec)
Storage Temperature
ESD (Machine Model)
Thermal Resistance
TLEAD
TSTG
260
-65 to 150
200
oC
V
θJA
(Note 2)
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.
Note 2: Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allow-
able power dissipation is a function of the maximum junction temperature, TJ(max), the junction-to-ambient thermal resistance,
θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated
using: PD(max)=(TJ(max) -TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die tempera-
ture, and the regulator will go into thermal shutdown.
Recommended Operating Conditions
Parameter
Symbol
VIN
Min
2.5
0
Max
13.2
13.2
125
Unit
V
Supply Input Voltage
Enable Input Voltage
Operating Junction Temperature
VEN
TJ
V
oC
-40
BCD Semiconductor Manufacturing Limited
Aug. 2005 Rev. 1. 3
5
BCDSEMI [ BCD SEMICONDUCTOR MANUFACTURING LIMITED ]
