BL8519
DEMO BOARD BOM
No.
1
2
3
4
5
6
7
Reference
C1
C2
D1
L1
IC1
R1
R2
Type
Capacitor
Capacitor
Diode
Inductor
IC
Resistor
Resistor
Specification
MLCC 10uF; SMD 0805
MLCC 10uF; SMD 0805
SS34; 40V, 3A; SMD
10uH; 3A; SMD, Shielding
BL8519; SMD SOP-8
SMD 0805; 30K；1%
SMD 0805; 10K；1%
Note
LAYOUT CONSIDERATION
Careful PCB layout is critical to achieving low switching losses and clean, stable operation.
The switching power stage requires particular attention. If possible, mount all the power
components on one side of the board, with their ground terminals as close to one another as
possible.
Keep the high-current paths short, especially the distance between Cin and the Vin (GND)
terminals. It is essential for stable, jitter-free operation, showing as the following figure. The
ESR of Cin should be smaller enough and the capacitance of Cin should be large enough for
filtering the switching noise across power path, a 10uF ceramic capacitor is recommended.
Keep the trace connecting to SW terminal wide enough for heat dissipation, if possible, it is
better to place some vias connected to the bottom copper for enhancement.
Route high-speed switching nodes, for example SW terminal, away from sensitive analog
trace (eg. FB terminal).
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