PL
IA
Features
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Applications
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NT
RoHS Compliant*
Low capacitance - 1.9 pF
ESD protection >40k V
Surge protection
Personal Digital Assistants (PDAs)
Mobile phones & accessories
Memory card protection
SIM card port protection
Portable electronics
Ethernet
*R
oH
S
CO
M
CDSC706-0504F – Surface Mount TVS Diode Array
General Information
I/O 4
REF
5
I/O 3
4
The CDSC706-0504F device provides ESD, EFT and Surge protection for high speed
data ports meeting IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 61000-4-5
(Surge) requirements. The Transient Voltage Suppressor array, protecting up to 4 data
lines, offers a Working Peak Reverse Voltage of 5 V and Minimum Breakdown
Voltage of 6 V.
The SC70-6L packaged device will mount directly onto the industry standard SC70-6
footprint. Bourns
®
Chip Diodes conform to JEDEC standards, are easy to handle with
standard pick and place equipment and the flat configuration minimizes roll away.
6
1
I/O 1
2
GND
3
I/O 2
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Value
Unit
Peak Pulse Power (tp = 8/20
µs)
1
Peak Pulse Current (tp = 8/20
µs)
Storage Temperature
Operating Temperature
Note:
1. See Peak Pulse Power vs. Pulse Time.
PPK
IPPM
TSTG
TOPR
200
6
-55 to +150
-55 to +150
W
A
°C
°C
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Value
Unit
Minimum Breakdown Voltage @ 1 mA
Maximum Working Peak Voltage
Maximum Leakage Current @ VWM
Maximum Clamping Voltage @ IP = 1 A
Maximum Clamping Voltage @ IP = 5 A
Typical Junction Capacitance @ 0 V 1 MHz
Maximum Junction Capacitance @ 0 V 1 MHz
VBR
VWM
ID
VC
VC
CD
CD
6
5
3
15
25
1.9
3
V
V
µA
V
V
pF
pF
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
BOURNS [ BOURNS ELECTRONIC SOLUTIONS ]
