BH62UV4000
n PACKAGE DIMENSIONS (continued)
DIMENSION
(MM)
DIMENSION
(INCH)
17
32
MIN.
NOM. MAX. MIN.
NOM. MAX.
0.047
1.20
0.15
A
A1
0.004
0.006
0.042
0.05
0.95
0.10
1.00
0.002
0.037
1.05
0.039
0.016
A2
b
0.30
0.30
0.12
0.52
0.45
0.21
0.012
0.012
0.005
0.020
0.018
0.008
b1
c
0.40
c1
D
E
0.10
0.127
20.95
0.16
0.004
0.820
0.455
0.394
0.005
0.825
0.006
0.830
0.471
0.405
21.08
11.96
10.29
20.82
11.56
10.03
11.76
0.463
1
16
e
b
"X"
E1
e
10.16
0.400
Y
Y
1.27 BASIC
0.050 BASIC
0.60
0.25
0.024
0.010
0.004
L
0.40
0.50
0.016
0.020
0.25 BASIC
0.8 REF
0.010 BASIC
0.031 REF
L1
L2
R
D
0.12
0.12
0.005
0.005
ZD
R1
0.95 REF
0.037 REF
ZD
Y
0.10
Y
SEATING PLANE
-T-
NOTE:
1. CONTROLLING DIMENSION : MILLIMETERS.
2. REFREENCE DOCUMENT : JEDEC MS-024
3. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION.
MOLD PROTRUSION SHALL NOT EXCEED 0.15(0.006") PER SIDE.
DIMENSION E1 DOES NOT INCLUDE INTERLEAD PROTRUSION.
INTERLEAD PROTRUSION SHALL NOT EXCEED 0.25(0.01") PER SIDE.
b
b1
RAD R
GAGE PLANE
4. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSIONS/INTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD TO
BE WIDER THAN THE MAX b DIMENSION BY MORE THAN 0.13mm
L
RAD R1
DAMBAR INTRUSION SHALL NOT CAUSE THE LEAD TO BE NARROWER
THAN THE MIN b DIMENSION BY MORE THAN 0.07mm.
WITH PLATING
BASE METAL
L2
DETAIL "X"
SECTION Y-Y
TSOP II - 32
Revision 1.2
Aug. 2006
R0201-BH62UV4000
11
BSI [ BRILLIANCE SEMICONDUCTOR ]
