BSI
ORDERING INFORMATION
BS616LV2018
YY
SPEED
55: 55ns
70: 70ns
PKG MATERIAL
-: Normal
G: Green
P: Pb free
GRADE
C: +0
o
C ~ +70
o
C
I: -40
o
C ~ +85
o
C
PACKAGE
E: TSOP2-44
A: BGA-48-0608
D: DICE
BS616LV2018
X X
Z
Note:
BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products
for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support
systems and critical medical instruments.
PACKAGE DIMENSIONS
NOTES:
1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.
3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1.4 Max.
BALL PITCH e = 0.75
D
8.0
E
6.0
N
48
D1
5.25
E1
3.75
D1
e
VIEW A
48 mini-BGA (6 x 8)
R0201-BS616LV2018
E1
8
Revision 3.1
Jan.
2004
BSI [ BRILLIANCE SEMICONDUCTOR ]
