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BS616LV4010BIG10 参数 Datasheet PDF下载

BS616LV4010BIG10图片预览
型号: BS616LV4010BIG10
PDF下载: 下载PDF文件 查看货源
内容描述: [Standard SRAM, 256KX16, 100ns, CMOS, PBGA48, MINIBGA-48]
分类和应用: 静态存储器内存集成电路
文件页数/大小: 9 页 / 269 K
品牌: BSI [ BRILLIANCE SEMICONDUCTOR ]
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BSI
WRITE CYCLE2
(1,6)
BS616LV4010
t
WC
ADDRESS
t
CW
CE
(5)
(11)
t
BW
LB,UB
t
AW
WE
t
WR
t
WP
(2)
(3)
t
AS
(4,10)
t
WHZ
D
OUT
t
t
DW
t
OW
(7)
(8)
DH
(8,9)
D
IN
NOTES:
1. WE must be high during address transitions.
2. The internal write time of the memory is defined by the overlap of CE and WE low. All signals
must be active to initiate a write and any one signal can terminate a write by going inactive.
The data input setup and hold timing should be referenced to the second transition edge of
the signal that terminates the write.
3. T
WR
is measured from the earlier of CE or WE going high at the end of write cycle.
4. During this period, DQ pins are in the output state so that the input signals of opposite phase
to the outputs must not be applied.
5. If the CE low transition occurs simultaneously with the WE low transitions or after the WE
transition, output remain in a high impedance state.
6. OE is continuously low (OE = V
IL
).
7. D
OUT
is the same phase of write data of this write cycle.
8. D
OUT
is the read data of next address.
9. If CE is low during this period, DQ pins are in the output state. Then the data input signals of
opposite phase to the outputs must not be applied to them.
10. Transition is measured
±
500mV from steady state with C
L
= 5pF as shown in Figure 1B.
The parameter is guaranteed but not 100% tested.
11. T
CW
is measured from the later of CE going low to the end of write.
R0201-BS616LV4010
7
Revision 2.4
Jan.
2004