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BS616LV2023AC 参数 Datasheet PDF下载

BS616LV2023AC图片预览
型号: BS616LV2023AC
PDF下载: 下载PDF文件 查看货源
内容描述: 非常低的功率/电压CMOS SRAM 128K ×16或256K ×8位切换 [Very Low Power/Voltage CMOS SRAM 128K x 16 or 256K x 8 bit switchable]
分类和应用: 静态存储器
文件页数/大小: 11 页 / 250 K
品牌: BSI [ BRILLIANCE SEMICONDUCTOR ]
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BSI
FEATURES
Very Low Power/Voltage CMOS SRAM
128K x 16 or 256K x 8 bit switchable
DESCRIPTION
BS616LV2023
• Very low operation voltage : 2.4 ~ 3.6V
• Very low power consumption :
Vcc = 3.0V C-grade: 20mA (Max.) operating current
I-grade: 25mA (Max.) operating current
0.1uA (Typ.) CMOS standby current
• High speed access time :
-70
70ns (Max.) at Vcc = 3.0V
-10
100ns (Max.) at Vcc = 3.0V
•Automatic power down when chip is deselected
• Three state outputs and TTL compatible
• Fully static operation
• Data retention supply voltage as low as 1.5V
• Easy expansion with CE1, CE2 and OE options
• I/O Configuration x8/x16 selectable by CIO, LB and UB pin
The BS616LV2023 is a high performance, very low power CMOS Static
Random Access Memory organized as 131,072 words by 16 bits or
262,144 bytes by 8 bits selectable by CIO pin and operates from a wide
range of 2.4V to 3.6V supply voltage.
Advanced CMOS technology and circuit techniques provide both high
speed and low power features with a typical CMOS standby current
of 0.1uA and maximum access time of 70/100ns in 3V operation.
Easy memory expansion is provided by active HIGH chip
enable2(CE2), active LOW chip enable1(CE1), active LOW output
enable(OE) and three-state output drivers.
The BS616LV2023 has an automatic power down feature, reducing the
power consumption significantly when chip is deselected.
The BS616LV2023 is available in DICE form and 48-pin BGA type.
PRODUCT FAMILY
SPEED
( ns )
Vcc=3.0V
PRODUCT
FAMILY
BS616LV2023DC
BS616LV2023AC
BS616LV2023DI
BS616LV2023AI
OPERATING
TEMPERATURE
+0
O
C to +70
O
C
-40
O
C to +85
O
C
Vcc
RANGE
2.4V ~ 3.6V
2.4V ~ 3.6V
( I
CCSB1
, Max )
POWER DISSIPATION
STANDBY
Operating
( I
CC
, Max )
PKG TYPE
DICE
BGA-48-0608
DICE
BGA-48-0608
Vcc=3.0V
Vcc=3.0V
70 / 100
70 / 100
0.7uA
1.5uA
20mA
25mA
PIN CONFIGURATION
BLOCK DIAGRAM
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
2048
D0
16(8)
Data
Input
Buffer
16(8)
Column I/O
Address
Input
Buffer
20
Row
Decoder
1024
Memory Array
1024 x 2048
.
.
.
.
D15
CE1
CE2
WE
OE
UB
LB
CIO
Vdd
Vss
.
.
.
.
Write Driver
16(8)
Sense Amp
128(256)
Column Decoder
16(8)
Data
Output
Buffer
14(16)
Control
Address Input Buffer
A16 A0 A1 A2 A3 A4 A5
(SAE)
Brilliance Semiconductor Inc
. reserves the right to modify document contents without notice.
R0201-BS616LV2023
1
Revision 2.4
April 2002