BSI
ORDERING INFORMATION
BS616LV1613
Z
YY
SPEED
55: 55ns
70: 70ns
PKG MATERIAL
-: Normal
G: Green
P: Pb free
GRADE
C: +0
o
C ~ +70
o
C
I: -40
o
C ~ +85
o
C
BS616LV1613
X X
PACKAGE
F :BGA-48-0912
Note:
BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products
for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support
systems and critical medical instruments.
PACKAGE DIMENSIONS
0.25± 0.05
NOTES:
1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.
3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1.4 Max.
SIDE VIEW
D 0.1
3.375
D1
N
48
D
12.0
E
9.0
D1
5.25
E1
3.75
e
0.75
SOLDER BALL 0.35±0.05
e
VIEW A
48 mini-BGA (9mm x 12mm)
R0201-BS616LV1613
2.625
E
±
0.1
E1
8
Revision 1.1
Jan.
2004
BSI [ BRILLIANCE SEMICONDUCTOR ]
