CM3003
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
ESD Protection (HBM)
Pin Voltages
IN, OUT, ADJ, EN
Storage Temperature Range
Operating Temperature Range
Ambient
Junction
Power Dissipation (See note 1)
RATING
±2000
[GND - 0.4] to +6.0
-40 to +150
-40 to +85
-40 to +150
Internally Limited
UNITS
V
V
°C
°C
°C
W
Note 1: The SOIC package used is thermally enhanced through the use of a fused integral leadframe. The power rating is based on
a printed circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND pins. Typical
multi-layer boards using power plane construction will provide this heat spreading ability without the need for additional ded-
icated copper area. (Please consult with factory for thermal evaluation assistance)
STANDARD OPERATING CONDITIONS
PARAMETER
V
IN
Ambient Operating Temperature Range
Load Current
C
EXT
VALUE
2.2 to 5.5
0 to +85
0 to 1500
10 +20%
UNITS
V
°C
mA
µF
© 2004 California Micro Devices Corp. All rights reserved.
01/15/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
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