CSPEMI205
Mechanical Details
CSP Mechanical Specifications
Mechanical Package Diagrams
CSPEMI205 devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
BOTTOM VIEW
A1
SIDE
VIEW
C1
B1
C
B
A
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
8
1
2 3 4 5
Millimeters
Nom Max
Inches
Nom
Dim
D1
D2
0.30 DIA.
Min
Min
Max
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
1.405 1.450 1.495 0.0553 0.0571 0.0589
1.365 1.410 1.455 0.0537 0.0555 0.0573
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.175 0.225 0.275 0.0069 0.0089 0.0108
0.220 0.270 0.320 0.0087 0.0106 0.0126
0.561 0.605 0.649 0.0221 0.0238 0.0255
0.355 0.380 0.405 0.0140 0.0150 0.0159
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI205
Chip Scale Package
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm)
B X A X K
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
P
1
PART NUMBER
CHIP SIZE (mm)
0
0
0
0
CSPEMI205
1.45 X 1.41 X 0.6
1.55 X 1.52 X 0.71
8mm
178mm (7")
3500
4mm 4mm
10 Pitches cumulative
tolerance on tape
0.2 mm
P
o
Top
Cover
Tape
A
o
W
B
o
K
o
For tape feeder reference
only including draft.
Concentric around B.
Embossment
Center lines
of cavity
P
1
User direction of feed
Figure 7. Tape and Reel Mechanical Data
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
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