MLP1 ESD Suppressor
PolySurg
™
0402ESDA-MLP1
Applications
HF
FREE
• Computers and peripherals
• HDTV Equipment
• DVD Players
• A/V Equipment
• Satellite radio
• Cell phones
• PDAs
• Digital still cameras
• Digital camcorders
• MP3/Multimedia players
• Set top boxes
• External storage
• DSL Modems
• High speed data ports
• USB 2.0/3.0
• IEEE 1394b
• HDMI 1.3
• DVI
• High speed ethernet
• Infiniband
®
HALOGEN
Pb
Surface Mount Device
Description
The Cooper Bussmann PolySurg
™
0402ESDA-MLP1 ESD Suppressors
protect valuable high-speed data circuits from ESD damage without distorting
data signals as a result of its ultra-low (0.05pF typical) capacitance.
Features
•
•
•
•
•
•
•
•
•
Halogen free
RoHS compliant for global applications
Lead free
Ultra-low capacitance (0.05pF typ.) ideal for high speed data
applications
Provides ESD protection with fast response time (<1ns) allowing
equipment to pass IEC 61000-4-2 level 4 test
Single-line, bi-directional device for placement flexibility
Low profile 0402/1005 design for board space savings
Low leakage current (<0.1nA typ.) reduces power consumption
(Sn) Tin-plated version available
Part Numbering System: 0402
Package Size
Product Family
Form Designation
Designation for Dip Termination
ESDA MLP
1
Packaging
• 10,000 suppressors on paper tape in seven inch (178mm)
plastic reel
per EIA Standard 481-1
.
Ordering Information
Catalog Number Description
0402ESDA-MLP1 10,000 pieces on paper tape on 7" (178mm) reel - tin plating
Specifications
Characteristic
Rated Voltage
Clamping Voltage
1
Trigger Voltage
2
Capacitance (@1MHz)
Attenuation Change (0-6GHz)
Leakage Current (@12Vdc)
ESD Capability
• IEC61000-4-2 Direct Discharge
• IEC61000-4-2 Air Discharge
ESD Pulse Withstand
3
Value
30Vdc maximum
35V typical
300V typical
0.05pF typical, 0.15pF maximum
-0.2dB typical
<0.1nA typical
8kV typical
15kV typical
>1000 typical
Design Considerations
The location in the circuit for the MLP series has to be carefully determined.
For better performance, the device should be placed as close to the signal
input as possible and ahead of any other component. Due to the high current
associated with an ESD event, it is recommended to use a “0-stub” pad
design (pad directly on the signal/data line and second pad directly on
common ground).
1 Per IEC61000-4-2, Level 4 waveform (8kV direct, 30A) measured 30ns after initiation of pulse.
2 Trigger measurement made using Transmission Line Pulse (TLP) method.
3 Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate
1010
BU-SB101153
Page 1 of 2
Data Sheet 4367
COOPER [ COOPER BUSSMANN, INC. ]
