CY7C245A
Package Diagrams
(continued)
28-Pin Windowed Leadless Chip Carrier Q64
MIL–STD–1835 C–4
51-80102-**
24 Lead (300 Mil) SOIC - S13
PIN 1 ID
24-Lead (300-Mil) SOIC S13
12
1
DIMENSIONS IN INCHES[MM]
*
0.394[10.007]
0.419[10.642]
0.291[7.391]
0.300[7.620]
MIN.
MAX.
REFERENCE JEDEC MO-119
PACKAGE WEIGHT 0.65gms
PART #
S24.3 STANDARD PKG.
SZ24.3 LEAD FREE PKG.
13
24
0.026[0.660]
0.032[0.812]
SEATING PLANE
0.597[15.163]
0.615[15.621]
0.092[2.336]
0.105[2.667]
0.004[0.101]
0.015[0.381]
0.050[1.270]
0.050[1.270]
TYP.
0.013[0.330]
0.019[0.482]
*
0.004[0.101]
0.0118[0.299]
*
0.0091[0.231]
0.0125[0.317]
51-85025-*B
Document #: 38-04007 Rev. *D
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